Abstract: Described is a seaming machine for use with a container (22) and an end closure (28). The machine includes a seaming head (62) with multiple shaft assemblies (100) and a lifter table (60) located below the seaming head (62) and including multiple container stations. During use, the lifter table (60) and seaming head (62) rotate in unison about the centerline of a spindle (64). A single shaft assembly (100) is provided at each station to perform a two-step seaming operation on its corresponding container (22). In one embodiment, a seaming cam (66) is located above the seaming head (62) for moving first and second cam followers (116), (118) in the shaft assembly (100). In another embodiment, the cam followers (116) and (118) have a master/slave relationship dependent on which step of the seaming operation is being conducted. In another embodiment, a single piece plate (122) is used in a cover feed assembly (120) and provides end closures (28) to a make-up point (30).

Abstract: A substrate having a diamond or diamond-like carbon coating of at least one micron thickness on an underlayer of an insulating material such as AlN. Such a substrate is advantageously used as a mounting for passive electrical components such as microwave and radio-frequency (rf) resistors, capacitors, attenuators, terminators and loads.

Abstract: A power sensing RF termination comprising a calibration means allows the user to correct for part-to-part variation, miss match loss and output offset. The power sensing RF termination comprises a first and second temperature sensitive resistors connected at a first common junction, a switching means for connecting either an RF input or a DC power reference to the first common junction, a first switch for connecting either a DC voltage source or a first current detecting resistor to the first temperature sensitive resistor, and a second current detecting resistor connected to the second temperature sensitive resistor. A first output terminal is connected to the junction between the first switch and the first temperature sensitive resistor. A second output terminal is connected to the first common junction. A third output terminal is connected to the junction between the second temperature sensitive resistor and the second current detecting resistor.

Abstract: A power sensing RF termination comprising a calibration means allows the user to correct for part-to-part variation, miss match loss and output offset. The power sensing RF termination comprises a first and second temperature sensitive resistors connected at a first common junction, a switching means for connecting either an RF input or a DC power reference to the first common junction, a first switch for connecting either a DC voltage source or a first current detecting resistor to the first temperature sensitive resistor, and a second current detecting resistor connected to the second temperature sensitive resistor. A first output terminal is connected to the junction between the first switch and the first temperature sensitive resistor. A second output terminal is connected to the first common junction. A third output terminal is connected to the junction between the second temperature sensitive resistor and the second current detecting resistor.

Abstract: A Lange coupler device which includes a first layer which is a base substrate of a dielectric material such as alumina. Deposited on this substrate are second, third and fourth layers of the device. Each layer is made from a thick-film material. The second layer is a conductive layer, arranged in five parallel lines. One of the outermost lines is connected to the center line at one end of the substrate while the other outermost line is connected to the center line at the opposite end of the substrate. This leaves two lines unconnected at this layer. The third layer is a dielectric layer which has through-holes to: 1) each end of the unconnected lines of the bottom layer, 2) the unconnected ends of the outermost lines and, 3) the middle of the center line. The fourth layer of material is a conductive layer. The fourth layer is arranged as three parallel lines, each perpendicular to the lines of the second layer.

Abstract: A chip resistor includes a substantially rectangular substrate of an insulating material having opposed substantially flat top and bottom surfaces and edges extending between the top and bottom surfaces. A layer of a resistance material is on the top surface of the substrate. Separate termination layers of a conductive material are on the top surface or the substrate and contact the resistance layer at opposite ends thereof. Each of the termination layers extends across an edge of the substrate and over a portion of the bottom surface of the substrate. The total area of the portions of the termination layers on the bottom surface of the substrate is greater than the total area of the portions of the termination layers on the top surface of the substrate so that the spacing between the ends of the portions of the termination layers on the bottom surface of the substrate is smaller than the spacing between the ends of the portions of the termination layers on the top surface of the substrate.

Abstract: The present invention is directed to an AC termination which includes a substrate having first and second surfaces. A resistor is mounted on the first surface of the substrate. An input termination is at one end of the resistor. At least one plate of a capacitor is on the substrate and is electrically connected in series with the other end of the resistor. In one form of the termination, the capacitor is a metal film on the substrate extending from the other end of the resistor to and across the second surface of the substrate to form one electrode of the capacitor. A dielectric layer is over the metal film and another metal film extends over the dielectric layer to form the other electrode of the capacitor and the output termination of the termination. In another form of the termination, the capacitor is formed on a cover plate which extends over the first surface of the substrate and is electrically connected between the resistor and an output termination.

Abstract: The present invention is directed to an AC termination which includes a substrate having first and second surfaces. A resistor is mounted on the first surface of the substrate. An input termination is at one end of the resistor. At least one plate of a capacitor is on the substrate and is electrically connected in series with the other end of the resistor. In one form of the termination, the capacitor is a metal film on the substrate extending from the other end of the resistor to and across the second surface of the substrate to form one electrode of the capacitor. A dielectric layer is over the metal film and another metal film extends over the dielectric layer to form the other electrode of the capacitor and the output termination of the termination. In another form of the termination, the capacitor is formed on a cover plate which extends over the first surface of the substrate and is electrically connected between the resistor and an output termination.

Abstract: A temperature variable phase-shifter formed of passive components. The phase-shifter includes a power divider which is adapted to receive a signal and divide the signal into two components which are 90.degree. out of phase with each other. The outputs of the power divider are connected to positive and negative temperature variable attenuators which attenuated the components of the signal. The temperature variable attenuators are connected to a combiner which sums the attenuated signals from the temperature variable attenuators.

Abstract: A hybrid coupler which includes a substrate of an insulating material having a pair of opposed surfaces. A conductive ground plane is on one of the substrate surfaces. A pair of conductive transmission lines are over the other substrate surface and a layer of a dielectric material is over the other substrate surface. Each of the transmission lines has one portion which is on the substrate surface and under the dielectric layer, another portion which is over the dielectric layer and a connecting portion which electrically connects the two portions of the transmission line. Each of the connecting portion extends through an opening in the dielectric layer and one of the connecting portions crosses over the other connecting portion. The portions of the transmission lines may extend in straight lines, in a serpentine path or in a rectangular path.

Abstract: A low profile load resistor includes a base plate of an electrically conductive material having a pair of opposed flat surfaces and a hole therethrough. A chip resistor is mounted on one of the surfaces of the base plate. The chip resistor includes a substrate of an electrical insulating material having a pair of opposed flat surfaces and a hole therethrough which is aligned with the hole in the base plate. A resistance film is on one of the surfaces of the substrate and has termination films at opposite ends thereof. A termination tab is electrically connected to one of the termination films and extends through the holes in the substrate and base plate. The other termination film is electrically connected to the base plate. A cover plate of an electrical insulating material is over the resistor film and is mechanically connected to the substrate.

Abstract: An electrical terminal for an electrical component to surface mount the component on a printed circuit board with the component extending upright from the printed circuit board. The electrical terminal includes a metal strip having a pair of spaced tabs extending in the same direction from the metal strip to form an U-shaped clip within which the electrical component fits. A separate foot extends from each tab with the feet being aligned in the same plane and extending in opposite directions from the tabs. The feet are adapted to seat on the surface of a printed circuit board to support the electrical component in the upright position on the board. A plurality of the terminals are mounted in spaced relation along an edge of the electrical component and can be soldered to terminal pads on the electrical component to electrically and mechanically connect the terminals to the electrical component.

Abstract: A high accuracy programmable attenuator for accurately selecting and maintaining desired values of attenuation for a high frequency RF signal. The attenuator is comprised of a plurality of cells wherein each cell is comprised of an individual attenuator, a switch and a bias resistor. Each bias resistor is comprised of a plurality of individual resistors arranged in a binary sequence and wire bonds are used to short out undesired resistors for compensating for insertion loss and obtaining desired attenuation. The attenuators of the circuit are also arranged in a binary sequence so as to allow the user to select from a large variety of attenuations in small increments.

Abstract: An absorptive temperature variable microwave attenuator is produced utilizing at least two different thick film resistors. The temperature coefficients of the resistors are different and are selected so that the attenuator changes at a controlled rate with changes in temperature while the impedance of the attenuator remains substantially constant. Substantially any temperature coefficient of resistance can be created for each resistor by properly selecting and mixing different inks when forming the thick film resistors. Furthermore, attenuators can be created having either a negative temperature coefficient of attenuation or a positive temperature coefficient of attenuation.

Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.

Abstract: A method is provided for soldering using tin-containing solder to substrate surfaces that are gold plated wherein a selected portion of the gold plated surface is treated by impacting with a high velocity stream of fine nickel containing abrasive particles to remove all the gold from the treated surface and then effecting joining to the treated surface by conventional soldering techniques.

Abstract: A stress-free transitional RF connector assembly is provided which electrically connects a planar conductor in a planar electric circuit with a cable or component having a conventional RF connector at one end thereof. The assembly includes a connector body one end of which is arranged to mate with the cable or component connector, and the other end of which is formed to accommodate the planar circuit. A conductive pin held in the connector body and extending to a fixed connection which may be made to the planar conductor is provided therebetween with a joint which permits rotation and axial movement relatively between the resulting two pin parts while maintaining electrical contact.

Abstract: A solid state device or circuit mounted or printed on a heat conductive ceramic substrate such as beryllia is brought into thermal conductive relation with a metal heat dissipation plate as by clamping with no intervening materials such as an adhesive or solder therebetween.