Patents Assigned to Emerson Plastronics
  • Consecutive wafer transfer apparatus and method
    Patent number: 4244673
    Abstract: An apparatus and method for consecutively transferring wafers used in the fabrication of semiconductor devices between carriers having either the same spacing distance or different spacing distances are disclosed. A plate is positioned below an inverted first carrier and above a second carrier. The position of the plate and the second carrier is changed so that wafers fall consecutively from notches in the first carrier into every nth notch in the second carrier, where n is a positive integer.
    Type: Grant
    Filed: February 16, 1979
    Date of Patent: January 13, 1981
    Assignee: Emerson Plastronics
    Inventor: William W. Henderson