Patents Assigned to EMI Holding Corp.
  • Chain mail ground for electromagnetic testing platform
    Patent number: 5808852
    Abstract: A chain mail conductive meshing is conductively affixed to the perimeter of a platform to provide a broadband ground thereto. The chain mail is hung from the platform such that it contacts a ground plane therebelow. The platform is rotated during electromagnetic testing of equipment placed thereon, and the conductive meshing maintains the ground connection while the platform is rotated. A technique is disclosed for clamping the meshing to the platform, and alternate, sectional embodiments of the platform and meshing are provided.
    Type: Grant
    Filed: May 30, 1996
    Date of Patent: September 15, 1998
    Assignee: EMI Holding Corp.
    Inventor: Joseph Alfred Iannotti