Patents Assigned to Emisshield, Inc.
  • Patent number: 11268763
    Abstract: Electric arc, and ladle, furnaces 10 have components 14 with a high-emissivity/high reflectivity layer 18 disposed on the hot face 16. The component 14 includes a water-cooled panel 40, a duct 34, roof 12 frame 38, pipes, dry delta 36, water-cooled delta 28, fourth hole elbow 32, fourth hole roof 42, side walls 26 and combinations thereof. The high-emissivity/high-reflectivity layer 18 comprises, in dry admixture, from about 5% to about 40% of an inorganic adhesive, from about 45% to about 92% of a filler, and from about 1% to about 25% of one or more emissivity agents.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: March 8, 2022
    Assignees: Emisshield, Inc., Melter S.A. de C.V.
    Inventors: John W. Olver, Timothy Wayne Wilson, Carlos Uribe, Alberto Rivera
  • Patent number: 10332658
    Abstract: The present invention relates to a surface modified overhead conductor with a coating that allows the conductor to operate at lower temperatures. The coating contains about 5% to about 30% of an inorganic adhesive, about 45% to about 92% of a filler, about 2% to about 20% of one or more emissivity agents, and about 1% to about 5% of a stabilizer.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: June 25, 2019
    Assignees: General Cable Technologies Corporation, Emisshield, Inc.
    Inventors: Vijay Mhetar, Cody R. Davis, Sathish Kumar Ranganathan, John Olver, John Dillard
  • Patent number: 9976742
    Abstract: A crematory, or crematory accessory, having a nano-emissive thermal enhancement layer disposed therein to generate even heat throughout the crematory heating chamber. A method of making a crematory or crematory accessory involves spraying an hydrous coating containing high emissivity constituents in an admixture on an exposed or unexposed a crematory refractory surface, or crematory accessory, or in a layer therein.
    Type: Grant
    Filed: June 30, 2014
    Date of Patent: May 22, 2018
    Assignee: Emisshield, Inc.
    Inventor: John W. Olver
  • Patent number: 9366446
    Abstract: Provide an oven and optional cooking accessories having a high emissivity thermal protective layer on a substrate surface which comprises a metal or ceramic. The layer comprises from about 5% to 30% of an inorganic adhesive, from about 45% to 92% of at least one filler, and from about 1% to 25% of one or more emissivity agents; or from about 5% to 35% of colloidal silica, colloidal alumina, or combinations thereof, from about 23% to 79% of at least one filler, and from about 1% to 25% of one or more emissivity agents.
    Type: Grant
    Filed: September 22, 2014
    Date of Patent: June 14, 2016
    Assignees: Emisshield, Inc., AMF Automation Technologies LLC
    Inventors: John W. Olver, Philip J. Domenicucci, John Emery
  • Patent number: 9011791
    Abstract: A cracking furnace construction includes a firebox defining a chamber having a high emissivity thermal protective coating disposed on at least part of the refractory walls and/or on process tubes disposed within the chamber. The coating contains an inorganic adhesive for metal/alloy tubes or colloidal silica and/or colloidal alumina for refractory walls or ceramic tubes, a filler, and one or more emissivity agents. A method of coating the firebox chamber includes preparing the surface of the tubes/refractory walls, preparing the coating, and applying the coating to the surface.
    Type: Grant
    Filed: April 7, 2008
    Date of Patent: April 21, 2015
    Assignee: Emisshield, Inc.
    Inventors: John W. Olver, Jason Andrew Simmons
  • Publication number: 20150104641
    Abstract: The present invention relates to a surface modified overhead conductor with a coating that allows the conductor to operate at lower temperatures. The coating contains about 5% to about 30% of an inorganic adhesive, about 45% to about 92% of a filler, about 2% to about 20% of one or more emissivity agents, and about 1% to about 5% of a stabilizer.
    Type: Application
    Filed: October 10, 2013
    Publication date: April 16, 2015
    Applicants: EMISSHIELD, INC., GENERAL CABLETECHNOLOGIES CORPORATION
    Inventors: Vijay MHETAR, Cody R. DAVIS, Sathish Kumar RANGANATHAN, John OLVER, John DILLARD
  • Patent number: 8840942
    Abstract: Provide an oven and optional cooking accessories having a high emissivity thermal protective layer on a substrate surface which comprises a metal or ceramic. The layer comprises from about 5% to 30% of an inorganic adhesive, from about 45% to 92% of at least one filler, and from about 1% to 25% of one or more emissivity agents; or from about 5% to 35% of colloidal silica, colloidal alumina, or combinations thereof, from about 23% to 79% of at least one filler, and from about 1% to 25% of one or more emissivity agents.
    Type: Grant
    Filed: September 24, 2010
    Date of Patent: September 23, 2014
    Assignee: Emisshield, Inc.
    Inventors: John W. Olver, Philip J. Domenicucci, John Emery
  • Patent number: 8693853
    Abstract: A radiant tube assembly (12) has at least one tubular structure (14, 16, 22, or 24), and a heat source (30), with a thermal protective layer (18) is on at least one side, interior or exterior (17 or 15), thereof. An outer tubular structure (16) may be present. A protective layer (18) may be disposed on the outer tubular structure's (16) interior and/or exterior sides (17 and/or 15). A shield (26), having two sides (25 and 27) and a thermal protective layer (18) may be disposed along an exterior or interior side (27 or 25).
    Type: Grant
    Filed: September 19, 2008
    Date of Patent: April 8, 2014
    Assignee: Emisshield, Inc.
    Inventors: John W. Olver, Jason Simmons
  • Patent number: 8636946
    Abstract: Thermal protective layer on metallic and/or ceramic substrate surfaces within/on an outer cover, an inner cover, a base/door, and/or a support member within a bell annealing furnace has from about 5% to about 30% of an inorganic adhesive, from about 45% to about 92% of a filler and from about 1% to about 20% of one or more emissivity agents, or from about 5% to about 35% of colloidal silica, colloidal alumina, or combinations thereof, from about 23% to about 79% of a filler, and from about 1% to about 20% of one or more emissivity agents.
    Type: Grant
    Filed: April 13, 2009
    Date of Patent: January 28, 2014
    Assignee: Emisshield, Inc.
    Inventor: John W. Olver