Abstract: A system is disclosed. The system includes a substrate, and a first chip on the substrate, where a load circuit is integrated on the first chip. The system also includes a second chip on the substrate, where a power delivery circuit is configured to deliver current to the load circuit according to a regulated voltage at a node. The power delivery circuit includes a first circuit configured to generate an error signal based at least in part on the regulated voltage, and a voltage generator including power switches configured to modify the regulated voltage according to the error signal, where the first circuit of the power delivery circuit is integrated on the first chip, and where at least a portion of the power switches of the power delivery circuit are integrated on the second chip.

Abstract: A switched-mode power regulator circuit has four solid-state switches connected in series and a capacitor and an inductor that regulate power delivered to a load. The solid-state switches are operated such that a voltage at the load is regulated by repetitively (1) charging the capacitor causing a current to flow in the inductor and (2) discharging the capacitor causing current to flow in the inductor. The power regulator circuit may be configured to operate with zero current switching at frequencies in the range of 100 MHz, enabling it to be fabricated on a unitary silicon die along with the load that it powers.

Abstract: A converter circuit. In one aspect, the converter circuit includes an input terminal, a first output terminal and a second output terminal, and first, second, third and fourth capacitors coupled to a plurality of switches, where the plurality of switches are arranged to repetitively cycle the first, second, third and fourth capacitors between a first state and a second state to generate first and a second output voltages, where in the first state, the first and second capacitors are connected in parallel with each other and in series with a third capacitor to apply a first fraction of an input voltage at the first output terminal, and in the second state, the first and second capacitors are connected in series with each other and in parallel with the fourth capacitor to apply a second fraction of the input voltage at the second output terminal.

Abstract: A power circuit is disclosed. The power circuit includes an input node, a plurality of inductors each connected to an output node, a plurality of phases each configured to provide current to one of the inductors, and a control circuit configured to trigger the phases. The phases are configured to provide current to one of the inductors in response to being triggered by the control circuit, the control circuit is configured to determine a variable time difference between a first phase being triggered and a second phase being triggered, and the time difference is based at least in part on a voltage difference between an input voltage at the input node and an output voltage at the output node.

Abstract: A configurable capacitance device includes a semiconductor substrate including a plurality of integrally formed capacitors; and a separate interconnect structure coupled to the semiconductor substrate, wherein the separate interconnect structure is configurable to electrically couple two or more of the plurality of integrally formed capacitors together in a parallel configuration.

Abstract: A power circuit is disclosed. The power circuit includes an input node, a plurality of inductors each connected to an output node, a plurality of phases each configured to provide current to one of the inductors, and a control circuit configured to trigger the phases. The phases are configured to provide current to one of the inductors in response to being triggered by the control circuit, the control circuit is configured to determine a variable time difference between a first phase being triggered and a second phase being triggered, and the time difference is based at least in part on a voltage difference between an input voltage at the input node and an output voltage at the output node.

Abstract: A system is disclosed. The system includes a substrate, and a first chip on the substrate, where a load circuit is integrated on the first chip. The system also includes a second chip on the substrate, where a power delivery circuit is configured to deliver current to the load circuit according to a regulated voltage at a node. The power delivery circuit includes a first circuit configured to generate an error signal based at least in part on the regulated voltage, and a voltage generator including power switches configured to modify the regulated voltage according to the error signal, where the first circuit of the power delivery circuit is integrated on the first chip, and where at least a portion of the power switches of the power delivery circuit are integrated on the second chip.

Abstract: Devices and techniques for controlling voltage regulation are disclosed. A voltage regulation system may include one or more loads disposed on an integrated circuit, a DC-to-DC voltage regulation device at least partially disposed on the integrated circuit, and a second device disposed external to the integrated circuit and comprising circuitry configured to communicate with the controller of the voltage regulation device. The voltage regulation device may include one or more voltage regulation modules and a controller configured to control the one or more voltage regulation modules. The one or more voltage regulation modules may be configured to supply one or more voltage levels, respectively, to the one or more loads. The controller may be configured to disable at least one of the one or more voltage regulation modules based on a determination that the second device is not suitable for use with the voltage regulation device.

Abstract: An electronic package comprises an integrated circuit (IC) configured to receive a power input signal and to deliver a regulated power output signal. A multilayer electrical routing structure is attached to the IC and is configured to couple the electronic package to an external circuit. The multilayer routing structure has one or more electrical conductors on each of at least two layers which are configured to route the power input signal from the external circuit to the IC and to route the regulated power output signal from the IC to the external circuit. The one or more electrical conductors form an integrated inductive device having a respective portion disposed on each of the at least two layers and the power output signal is coupled to the external circuit through the integrated inductive device.

Abstract: A voltage tolerant interface circuit includes an input terminal and one or more low-voltage transistors for generating an output from the voltage tolerant interface circuit based on a voltage received at the input terminal. The voltage tolerant interface circuit also includes a blocking transistor coupled between a control terminal of at least one low-voltage transistor and the input terminal. In some implementations, the blocking transistor is configured to protect the control terminal of the low-voltage transistor by blocking the voltage received at the input terminal when the voltage exceeds a voltage tolerance of the low-voltage transistor. In other implementations, the low-voltage transistor receives a supply voltage higher than the voltage tolerance of the low-voltage transistor.

Abstract: A buck voltage converter is disclosed. The buck voltage generator includes a controller configured to generate one or more pulse width modulation (PWM) signals, and a plurality of serially connected switches configured to receive the PWM signals and to generate an output voltage signal at an output terminal based on the received PWM signals. The output voltage signal has an average voltage corresponding with a duty cycle of the PWM signals, a first switch of the plurality of serially connected switches has a first breakdown voltage and a second switch of the plurality of serially connected switches has a second breakdown voltage, and the first breakdown voltage is less than the second breakdown voltage.

Abstract: A power conversion device includes: a semiconductor substrate; a plurality of controllers formed on the semiconductor substrate; two or more converter phases formed on the semiconductor substrate; two or more programmable components formed on the semiconductor substrate, each of the programmable components connected to a respective one of the two or more converter phases; and an interconnect circuit formed on the semiconductor substrate. The two or more programmable components are programmable to selectively couple the two or more converter phases to the plurality of controllers via the interconnect circuit.

Abstract: A circuit is disclosed. The circuit includes a power supply node and a system configured to receive current from the power supply node at a regulated voltage and to generate one or more control signals indicating an anticipated change in the current. The circuit also includes a voltage regulator configured to provide the current to the power supply node and to drive the power supply node with the regulated voltage, where the value of the regulated voltage is based at least in part on the one or more control signals.

Abstract: A system is disclosed. The system includes a substrate, and a first chip on the substrate, where a load circuit is integrated on the first chip. The system also includes a second chip on the substrate, where a power delivery circuit is configured to deliver current to the load circuit according to a regulated voltage at a node. The power delivery circuit includes a first circuit configured to generate an error signal based at least in part on the regulated voltage, and a voltage generator including power switches configured to modify the regulated voltage according to the error signal, where the first circuit of the power delivery circuit is integrated on the first chip, and where at least a portion of the power switches of the power delivery circuit are integrated on the second chip.

Abstract: A configurable capacitance device includes a semiconductor substrate including a plurality of integrally formed capacitors; and a separate interconnect structure coupled to the semiconductor substrate, wherein the separate interconnect structure is configurable to electrically couple two or more of the plurality of integrally formed capacitors together in a parallel configuration.

Abstract: A system is disclosed. The system includes a substrate, and a first chip on the substrate, where a load circuit is integrated on the first chip. The system also includes a second chip on the substrate, where a power delivery circuit is configured to deliver current to the load circuit according to a regulated voltage at a node. The power delivery circuit includes a first circuit configured to generate an error signal based at least in part on the regulated voltage, and a voltage generator including power switches configured to modify the regulated voltage according to the error signal, where the first circuit of the power delivery circuit is integrated on the first chip, and where at least a portion of the power switches of the power delivery circuit are integrated on the second chip.

Abstract: A voltage tolerant interface circuit includes an input terminal and one or more low-voltage transistors for generating an output from the voltage tolerant interface circuit based on a voltage received at the input terminal. The voltage tolerant interface circuit also includes a blocking transistor coupled between a control terminal of at least one low-voltage transistor and the input terminal. In some implementations, the blocking transistor is configured to protect the control terminal of the low-voltage transistor by blocking the voltage received at the input terminal when the voltage exceeds a voltage tolerance of the low-voltage transistor. In other implementations, the low-voltage transistor receives a supply voltage higher than the voltage tolerance of the low-voltage transistor.

Abstract: Devices and techniques for controlling voltage regulation are disclosed. A voltage regulation system may include one or more loads disposed on an integrated circuit, a DC-to-DC voltage regulation device at least partially disposed on the integrated circuit, and a second device disposed external to the integrated circuit and comprising circuitry configured to communicate with the controller of the voltage regulation device. The voltage regulation device may include one or more voltage regulation modules and a controller configured to control the one or more voltage regulation modules. The one or more voltage regulation modules may be configured to supply one or more voltage levels, respectively, to the one or more loads. The controller may be configured to disable at least one of the one or more voltage regulation modules based on a determination that the second device is not suitable for use with the voltage regulation device.

Abstract: Boot-strapping systems and techniques for circuits are described. One or more solid-state switches of a switched regulation circuit may be implemented using core transistors and the boot-strapping systems, rather than I/O transistors.

Abstract: A power conversion circuit includes a plurality of solid-state switches coupled between an input terminal and a ground. An output terminal is positioned between two of the plurality of solid-state switches and an inductor is coupled between the output terminal and a load. A capacitor is coupled in parallel with two of the serially connected solid-state switches. A controller controls the plurality of solid-state switches to generate a current in the inductor by repetitively (1) charging the capacitor causing a temporary increase in the current in the inductor, (2) entering a first wait state that configures the plurality of solid-state switches to maintain the capacitor in a charged state, (3) discharging the capacitor causing a temporary increase in the current in the inductor and (4) entering a second wait state that configures the plurality of solid-state switches to maintain the capacitor in a discharged state.