Abstract: A composite containing directly adjoining and firmly bonded sections (I) and (II) of the following type: (I) section, formed from a thermoplastic moulding compound FM-1 containing at least one polyamide (A) and optionally fillers and reinforcing materials (C) and additives (D); (II) section, formed from a thermoplastic moulding compound containing at least one olefinic and/or vinyl aromatic polymer (E) and optionally fillers and reinforcing agents (F), plasticisers (G) and additives (H); wherein the moulding compound FM-1 or FM-2 contains 0.1 to 5.0 percent by weight of polyethyleneimine (B) or a copolymer or derivative thereof and a method for producing such composites.

Abstract: Use of a part comprising at least a portion of a polyamide moulding composition said portion for direct contact with fuel, wherein the polyamide moulding composition consists of the following components in the following proportions: (A) 30-90% by weight of at least one polyamide; (B) 10-70% by weight of fibers with non-circular cross-section; (C) 0-10% by weight of at least one stabiliser; (D) 0-10% by weight of additives different from (B) and (C), wherein the sum of (A)-(D) makes up 100% of the portion.

Abstract: Method for the preparation of moldings in a layer-by-layer process in which selectively areas of a powdered layer are melted, sintered, fused, or otherwise solidified, characterized in that as a powder for the powdered layer a thermoplastic, ground polyamide powder is used, in which the polyamide comprises laurolactam and caprolactam, preferably exclusively, and wherein the proportion of caprolactam is in the range of 40-60 mol % of the lactams used.

Abstract: The present invention relates to a polyamide molding material with high fracture energy and molded parts produced therefrom which are particularly suitable for visible parts for automotive parts or for electronic devices. The polyamide molding material has, in addition to excellent fracture energy, a likewise excellent piano lacquer finish and a high rubbing resistance.

Abstract: The present invention relates to polyamide compounds having high heat aging resistance which, in addition to a specific polyamide, comprise at least one unsubstituted or substituted metallocene, optionally at least one impact modifier and optionally at least one additive. The invention also relates to the use of said polyamide compounds for the production of molds.

Abstract: The present invention relates to filled polyamide moulding compounds with a high heat-ageing resistance which, besides a specific polyamide mixture, also comprise at least one filler, at least one unsubstituted or substituted metallocene and optionally at least one additive. The invention also relates to the use of these polyamide moulding compounds to produce moulded articles.

Abstract: A transparent polyamide moulding with high resistance to steam, containing at least one copolyamide with polyamide units AB/AC/D, wherein: (A) is selected as a cycloaliphatic diamine from the group: MACM and PACM; (B) is selected as an aromatic dicarboxylic acid from the group: isophthalic acid (I), naphthalenedicarboxylic acid, and terephthalic acid (T); (C) is selected as an aliphatic dicarboxylic acid from the group: decanedioic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid; and (D) is selected as at least one lactam or ?,?-aminocarboxylic acid from the group: laurolactam, undecanolactam, 12-aminododecanoic acid, and 11-aminoundecanoic acid, wherein: the proportions of polyamide units AB are from 30 to 45 mol %, the proportions of polyamide units AC are from 30 to 40 mol %, and the proportions of polyamide units D are from 20 to 32 mol %, and wherein the sum total of polyamide units AB, AC and D is 100 mol %.

Abstract: A plastic line including at least an inner layer, which directly or indirectly encloses an interior space, and an outer layer directly adjacent to the inner layer. The inner layer is based on fluoropolymer, and the outer layer consists of the following constituents: (A) 51-98% of a polyamide from the following group: PA 616, PA 516, PA 618 or mixtures thereof, and copolymers containing at least 50% of at least one of these polyamides and also mixtures of at least one of these polyamides with a further different thermoplastic material (A2), wherein the proportion of these polyamides in such mixtures makes up at least 50%; (B) 2-20% of impact modifiers or plasticizers; (C) 0-29% of additives different from (A) and (B), wherein the components (A)-(C) together make up 100% of the material of the outer layer.

Abstract: The present invention relates to the use of a polyamide molding compound for application purposes in which high resistance to hypochlorous acid is crucial. The molding compound is thus used according to the invention for molded bodies suitable for being in contact with aqueous, hypochlorous acid-containing solutions.

Abstract: The present invention relates to the use of a polyamide molding compound for application purposes in which a high resistance to hypochlorous acid is decisive. The molding compound is thus used in accordance with the invention for molds that are suitable for contact with aqueous solutions containing hypochlorous acid.

Abstract: The present invention relates to reinforced polyamide molding materials with high notch impact strengths, comprising low viscous polyamides and flat glass fibers as a reinforcing medium, characterized in a polyamide matrix.

Abstract: The present invention relates to reinforced polyamide molding materials with high notch impact strengths, comprising low viscous polyamides and flat glass fibers as a reinforcing medium, characterized in a polyamide matrix, comprising the following components: (A) 0 to 60 wt.-% of at least one aliphatic, partly crystalline polyamide with a solution viscosity, measured in m-cresol (0.5 wt-%), of ?rel less than 1.9, (B) 0 to 60 wt.-% of at least one amorphous or microcrystalline polyamide based on aliphatic, cycloaliphatic or aromatic diamines, dicarboxylic acids, lactams and/or aminocarboxylic acids, preferably with 6 to 36 carbon atoms, or a mixture of such homopolyamides and/or copolyamides, wherein the components (A) and (B) fulfill the condition: (A)+(B)=20 to 60 wt.-% and that, in the case of a mixture of components (A) and (B), at least 50 weight parts aliphatic blocks (A) are present in the mixture, and a filler component, comprising: (C) 40 to 80 wt.

Abstract: The present invention relates to reinforced polyamide molding materials which can be prepared from a polyamide blend and, for example, by compounding with cut fibers or continuous filaments on twin-screw extruders and have mechanical properties which are usually not compatible with one another, namely a combination of exceptionally high rigidity and strength and at the same time good toughness. Furthermore, a high heat distortion temperature (HDT) is achieved according to the invention. The thermoplastic polyamide molding materials according to the invention are suitable for the production of moldings or other semifinished products or finished articles, which can be produced, for example, by extrusion, injection molding, direct methods or direct compounding, in which the compounded polyamide molding material is processed directly by injection molding, or other deformation techniques.

Abstract: The present invention relates to reinforced polyamide molding materials which can be prepared from a polyamide blend and, for example, by compounding with cut fibers or continuous filaments on twin-screw extruders and have mechanical properties which are usually not compatible with one another, namely a combination of exceptionally high rigidity and strength and at the same time good toughness. Furthermore, a high heat distortion temperature (HDT) is achieved according to the invention. The thermoplastic polyamide molding materials according to the invention are suitable for the production of moldings or other semifinished products or finished articles, which can be produced, for example, by extrusion, injection molding, direct methods or direct compounding, in which the compounded polyamide molding material is processed directly by injection molding, or other deformation techniques.

Abstract: The invention relates to a press felt for use in the press section of a paper machine. Said felt comprises a nonwoven layer lying on one of its surfaces, the surface of said layer being connected and fixed to the felt by a thermoplastic binding material. According to the invention, the surface of the nonwoven layer is smoothed by the application of pressure from a smooth surface during the cooling of said layer surface from a temperature in excess of the melting temperature of the thermoplastic binding material to a temperature below the melting temperature. To manufacture the press felt, an untreated press felt, which contains the nonwoven layer and the thermoplastic binding agent is first produced, the thermoplastic binding agent being distributed in the nonwoven layer in the form of thermoplastic adhesive fibres and/or a thermoplastic adhesive component of bicomponent fibres.

Abstract: Filled polyamide molding materials, in particular polyamide molding materials with medium filler content, are producible from a polyamide blend and for example by compounding with chopped or endless fibers on two-screw extruders, and have a combination of reduced water absorption and good mechanical properties, which results in very good dimensional stability and reduced variation of the electrical properties of the produced molded part, such as an antenna housings of stationary or mobile communication devices. These thermoplastic polyamide molding materials are suitable for manufacturing molded parts and other semi-finished or finished parts, for example by extrusion, injection molding, pressing, direct process or direct compounding, respectively, wherein the compounded polyamide molding material is directly processed by injection molding or other shaping methods.

Abstract: The invention describes a new synthetic fiber material of polyhydroxyether, as well as a melt-spinning method for its production. The new material can be used, in particular, for stabilization of the reinforcement fibers of high-performance fiber composite materials before they are embedded in the matrix material. During this usage, the polyhydroxyether fiber material dissolves at a temperature above its glass transition temperature entirely in the matrix material, so that the reinforcement fibers can be arranged largely free of kinking. In addition, it forms cross-links with the matrix material to form a homogeneous matrix and thus does not constitute a disruptive third phase in the composite material. The compatibility of the matrix and reinforcement fiber is also improved. It was possible to improve the bending strength of test slabs by 12% as compared to that of reference slabs with polyester filament.

Abstract: The present invention relates to polyamide moulding compounds which have very low distortion with good mechanical properties. This is achieved by a combination of transparent polyamide with fibrous reinforcing materials and also particulate fillers. The moulding compounds according to the invention are used for the production of any moulded articles, semi-finished products or finished products.

Abstract: The invention is directed to a transparent mold made of a polyamide molding material containing at least one polyamide formed from at least one diamine selected from the group of hexamethylene diamine (HMDA), bis-(4-amino-3-methylcyclohexyl)methane (MACM) and/or bis-(4-amino-cyclohexyl)methane (PACM) as well as from at least one dicarboxylic acid selected from the group of isophthalic acid (IPS), terephthalic acid (TPS) and/or dodecanedioic acid (DDS) or from the aforementioned diamines and dicarboxylic acids in combination with lactams and/or ?-/?-amino acids.

Abstract: The invention relates to a housing from a polyamide molding compound containing 70 to 99.5% by weight of at least one thermoplastic polyamide and 0.5 to 30% by weight of at least one polyamide oligomer with linear or branched chain structure with a number average molar mass of 800 to 5000 g/mol with basic end groups which are at least partially NH2 end groups, and carboxyl end groups, one of these end groups being present in excess and the concentration of the end group present in excess being at most 300 mmol/kg.