Abstract: The invention relates to a specific and novel use of a molding compound having the following constituents: (A) between 30 and 100 wt. % of a polyamide mixture containing (A1) between 50 and 95 wt. % of an aliphatic, partially crystalline homopolyamide or copolyamide or a mixture of such polyamides, and (A2) between 5 and 50 wt. % of a transparent homopolyamide or copolyamide or a mixture of such polyamides; and (B) between 0 and 70 wt. % of filling and reinforcing materials, and optionally auxiliary materials and additives. According to the invention, the molding compound can be used to produce a molded part for drinking water, especially a container or a line, in which, depending on the use, at least some regions of the processed molding compound are essentially directly exposed to the drinking water.

Abstract: Disclosed is a polyamide molding compound having heat aging resistance for use as automobile or electrical components and composed of: (A) 27-84.99 wt % of a polyamide mixture consisting of (A1) at least one semiaromatic, semicrystalline polyamide having a melting point of 255° C. to 330° C., (A2) at least one caprolactam-containing polyamide that is different from (A1) and that has a caprolactam content of at least 50 wt %, where the total caprolactam content is 22-30 wt %, with respect to the polyamide mixture, (B) 15-65 wt % of at least one filler and reinforcing agent, (C) 0.01-3.0 wt % of at least one thermal stabilizer, and (D) 0-5.0 wt % of at least one additive, where the components (A)-(D) add up to 100 wt %.

Abstract: Polyamide molding composition, in particular for use for components of electronic and/or electrical components, having the following composition: (A) 30-100% by weight of a partially aromatic, partially crystalline copolyamide made up of 100% by weight of diacid fraction composed of: 72.0-98.3% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid; 28.0-1.7% by weight of isophthalic acid (IPA) and 100% by weight of diamine fraction composed of: 51.0-80.0% by weight of 1,6-hexanediamine (HMDA); 20.0-49.0% by weight of aliphatic, unbranched C9-C12-diamine; (B) 0-70% by weight of fillers and reinforcing materials; (C) 0-25% by weight of flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight.

Abstract: Disclosed is a casing body (1) made of a thermoplastic plastic material, in particular for cosmetic pencils or writing pencils, the cavity H of which is enclosed by an at least three-shell construction A, Z, I, it having 1 to 10 outer shells A, an intermediate shell Z and 1 to 10 inner shells I, the intermediate shell Z including a polyamide foam and at least one of the other shells A, I including a polyamide.

Abstract: Filled polyamide molding compounds which, in addition to a selected polymer mixture comprising polyamides and a flameproofing agent, contain glass fibers with non-circular cross-sections, the use of such molding compounds for the production of molded articles, and the molded articles themselves.

Abstract: A polyamide moulding composition is described, based on a mixture made of transparent copolyamides and of semicrystalline, aliphatic polyamides for producing transparent mouldings, an example being, in particular, a material for the casing of devices such as mobile phones etc.

Abstract: The invention relates to a polyamide molding compound consisting of the following constituents: (A) between 25 and 70 wt. % of an aliphatic polyamide selected from the group PA1010, PA1012, PA1014, PA1210, PA1212, PA1214, PA12 and PA11, or a mixture of at least two of said systems; (B) between 8 and 35 wt. % of a transparent polyamide selected from the group MACM9-36, MACM9-36/PACM9-36, MACMI/12, MACMI/MACMT/12, or a mixture of at least two of said systems; (C) between 10 and 60 wt. % of reinforcing materials; (D) between 0 and 30 wt. % of particulate and/or layered filling materials; and (E) between 0 and 5 wt. % of auxiliary materials and/or additives, the sum of the constituents (A)-(E) amounting to 100 wt. %. Fibers are used at least partially as reinforcing materials (C), the cross-sectional surface of the fibers being either circular or the dimensional ratio of the main cross-sectional axis to the secondary cross-sectional axis being below 2.

Abstract: The present invention relates to a pulverulent adhesive for textile reinforcing inserts, which is dispersible in water, for the production of reinforced rubber products. The adhesive thereby comprises an at least partially capped, low-molecular isocyanate, a wetting agent, a binder and also possibly further additives.

Abstract: The invention relates to a flame-retardant polyamide molding composition based on semicrystalline polyamides. This polyamide molding composition is based on (A) from 30 to 92% by weight of at least one aliphatic or semiaromatic, semicrystalline polyamide with melting point (Tm) in the range from 240° C. to 340° C.; (B) from 0 to 50% by weight of at least one filler and reinforcing agent; (C) from 8 to 18% by weight of at least one halogen-free flame retardant; (D) from 0 to 2.0% by weight of at least one barium carboxylate; (E) from 0 to 5% by weight of at least one additive; wherein the percentages by weight of components (A) to (E) give a total of 100%, and with the proviso that if the proportion of component (D) is in the range from 0 to 0.1% by weight the halogen-free flame retardant of component (C) is based on a barium phosphinate.

Abstract: The invention relates to the use of a UV absorber in the production of transparent polyamide products or polyamide molded parts. The use according to the invention is characterized in that at least one UV absorber having at least one substituted benzoyl group is added to a polyamide molding compound, by which means melts of polyamide molding compounds comprising these UV absorbers leave no visible blooming on surfaces with which they come into contact during the production or processing of polyamide products. Particularly preferred polyamide molding compounds produced according to the use according to the invention comprise PA 6I/MXDI, PA MACM12, PA MACMI/MACMT/12 or PA 6I/6T/MACMI/MACMT/PACMI/PACMT/12 as well as one or more UV absorbers in the form of a dibenzoylmethane compound and/or an aminohydroxybenzoyl benzoic acid ester.

Abstract: A multilayer backsheet (1) for a photovoltaic module according to the invention comprises a first outside layer (2), a second outside layer (3) and at least one inside layer (4, 5) which is arranged between these outside layers (2, 3). This at least one inside layer (4, 5) forms a water-vapor barrier and/or oxygen barrier. All these layers (2, 3, 4, 5) are composed of polymers. The multilayer backsheet (1) for a photovoltaic module according to the invention is characterized in that at least one of the two outside layers (2, 3) comprises a polyamide, and that the at least one inside layer (4, 5) consists of polymers which are no fluoropolymers and do not comprise any polyethylene. Inside layers (4, 5) made of partly aromatic polyesters are used only in combination with at least one outside adhesion promoter layer (6) made of block copolyesteramide.

Abstract: The invention relates to a polyamide moulding compound for producing moulded articles with a soft-touch surface, the polyamide moulding compound comprising a blend of an amine-terminated, amorphous polyamide and styrene-ethylene/butylene-styrene copolymer and also styrene-ethylene/butylene-styrene copolymer grafted with maleic anhydride. The invention relates furthermore to moulded articles which are produced with this moulding compound and the use thereof.

Abstract: An unreinforced, halogen-free polyamide moulding composition which is provided with flame retardants and from which it is possible to produce electric and/or electronic components which can be reliably soldered, i.e. in particular without blisters being formed in the soldering process, in particular at 260° C. and possibly higher temperatures after water absorption and in the case of critical designs of the components, and which have an elongation at break of at least 5% and reliably achieve the UL94 classification V0. These polyamide moulding compositions have the following composition: (A) 62-87% by weight of a partially aromatic, partially crystalline copolyamide having a melting point of 270° C. to 320° C.

Abstract: The invention relates to an optical filter which comprises at least one optically effective layer and a protective layer on both sides, with at least one of the protective layers being a non-stretched protective polyamide layer which is cast from the solution. The optical filter in accordance with the invention is characterized in that the at least one protective polyamide layer consists of PA MACMI/12 and optional aggregates chosen as required. The at least one protective polyamide layer has a content of laurolactam of 23 mole percent to 57 mole percent in relation to the entire polyamide.

Abstract: A partial vacuum brake booster line is produced from a polyamide blend molding compound having a polyamide blend component and an impact resistance component. The polyamide blend component of the polyamide blend molding compound comprises the following polyamides: (A) 25 to 65 wt.-% of at least one partially crystalline polyamide having a melt enthalpy of >40 J/g and having an average of at least 8 C atoms per monomer unit, selected from a group which consists of the polyamides PA 11, PA 610, PA 612, PA 1010, PA 106, PA 106/10T, PA 614, and PA 618; (B) 0 to 25 wt.-% of at least one amorphous and/or microcrystalline polyamide, the microcrystalline polyamide having a melt enthalpy in the range from 4 to 40 J/g; and (C) 1 to 55 wt.-% of at least one polyamide having an average of at most 6 C atoms per monomer unit. The impact resistance component is formed from: (D) 5 to 35 wt.-% of a non-polyamide elastomer or of a mixture of non-polyamide elastomers. All specifications in wt.

Abstract: What is described is a polyamide moulding material based on semicrystalline polyamides for production of LED housings or housing components with high strength, high long-term reflectivity and low blistering tendency. The polyamide moulding material proposed consists of the following components (A) 40 to 80% by weight of at least one semiaromatic polyamide based on at least 70 mol % of aromatic dicarboxylic acids and at least 70 mol % of aliphatic diamines having 4 to 18 carbon atoms and having a melting temperature in the range from 270° C. to 340° C. (B) 10 to 30% by weight of titanium dioxide particles (C) 5 to 20% by weight of glass fibres (D) 5-30% by weight of calcium carbonate. The percentages by weight of components (A) to (D) together add up to 100%, with the proviso that components (B), (C) and (D) meet the following conditions: (B)+(C)+(D)=20 to 60% by weight; weight ratio of (C)/(D) in the range from 0.25 to 1.

Abstract: Disclosed is an impact-resistant modified polyamide moulding compound which is suitable in particular for the production of containers having a good oxygen barrier and low-temperature impact strength. Also disclosed are containers which are produced from the thermoplastic polyamide moulding compound. In particular, storage or transport containers for industrial chemicals, agrochemicals, the cosmetic industry, pharmaceutical industry or foodstuffs industry can be produced from the polyamide moulding compound of the invention.

Abstract: The invention relates to a two-layered plastic tubing piece for pressurized fluid conduits comprising an inner layer and an outer layer. The inner layer is formed from a first mixture comprising an elastomeric co-polyolefin or a blend of a partially crystalline polyolefin and a synthetic olefin rubber, as well as a homopolyamide. The outer layer is formed from a second mixture comprising a homopolyamide. According to the invention, both mixtures of the inner layer and the outer layer comprise the same homopolyamide wherein an impact modifier from the class of acid-modified ethylene-?-olefin copolymers is added to each of these mixtures and wherein the homopolyamide has a melting point of above 200° C. and has an average of at least 8 C atoms per monomer unit. The two-layered plastic tubing piece according to the invention is preferably formed as a fluid conduit for automobiles, in particular as a cooling line for automobiles.

Abstract: A polyamide molding composition is described, comprising at least one transparent polyesteramide in a proportion by weight of from 70 to 99.99% by weight; at least one further polymer in a proportion by weight of from 0 to 30% by weight; at least one photochromic dye in a proportion by weight of from 0.01 to 2% by weight; and also optionally further dyes and/or additives. The invention further encompasses articles manufactured therefrom, e.g. foils, for the coating of photochromic ophthalmic lenses, or the like.

Abstract: Polyamide moulding composition, in particular for use for components of electronic and/or electrical components, having the following composition: (A) 30-100% by weight of a partially aromatic, partially crystalline copolyamide made up of 100% by weight of diacid fraction composed of: 72.0-98.3% by weight of terephthalic acid (TPA) and/or naphthalenedicarboxylic acid; 28.0-1.7% by weight of isophthalic acid (IPA) and 100% by weight of diamine fraction composed of: 51.0-80.0% by weight of 1,6-hexanediamine (HMDA); 20.0-49.0% by weight of aliphatic, unbranched C9-C12-diamine; (B) 0-70% by weight of fillers and reinforcing materials; (C) 0-25% by weight of flame retardants; (D) 0-5% by weight of additives; where the components (A)-(D) add up to 100% by weight.