Patents Assigned to Encap Technologies, Inc.
  • Patent number: 7262527
    Abstract: A plurality of stator segments 20 are linked together by a phase change material 22 enabling simplified winding and higher slot fill. Once wound this continuous structure can be formed into a toroidal core 17 for a stator assembly 40 used to make a motor 100. In a preferred embodiment, a monolithic body 42 of phase change material substantially encapsulates the conductors and holds the stator segments 20 in contact with each other in the toroidal core 17. Hard disc drives using the motor 100, and methods of constructing the motor 100 are also disclosed.
    Type: Grant
    Filed: June 26, 2006
    Date of Patent: August 28, 2007
    Assignee: Encap Technologies, Inc.
    Inventor: Griffith D. Neal
  • Patent number: 7154200
    Abstract: A motor has a stator substantially encapsulated within a body of thermoplastic material; and one or more solid parts used in the motor either within or near the body. The thermoplastic material has a coefficient of linear thermal expansion such that the thermoplastic material contracts and expands at approximately the same rate as the one or more solid parts. In another aspect, a motor for a hard disc drive comprises at least one conductor, at least one magnet, at least one bearing and a shaft; and a monolithic body of thermoplastic material substantially encapsulating the at least one conductor. The bearing is either encapsulated in the thermoplastic material, housed in a hollow cylindrical insert encapsulated in the thermoplastic material, or secured in a bore formed in the body of thermoplastic material. The motor has improved shock resistance.
    Type: Grant
    Filed: May 23, 2006
    Date of Patent: December 26, 2006
    Assignee: Encap Technologies, Inc.
    Inventor: Griffith D. Neal
  • Publication number: 20040105979
    Abstract: Moisture barrier resins comprising a film-forming, cross-linkable, partially hydrolyzed polymer and a cross-linking agent provide improved impermeability to moisture and extended release capabilities for various particles, substances and other core materials that are encapsulated with compositions which contain these resins.
    Type: Application
    Filed: August 14, 2003
    Publication date: June 3, 2004
    Applicant: Encap Technologies, Inc.
    Inventor: Robert G. Bayless