Patents Assigned to Encap Technologies, LLC.
  • Microencapsulated particles and process for manufacturing same
    Patent number: 8394497
    Abstract: Microencapsulated particles having improved resistance to moisture and extended release capabilities are produced by microencapsulating the particles in a film-forming, cross-linked, hydrolyzed polymer.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: March 12, 2013
    Assignee: Encap Technologies, LLC
    Inventor: Robert G. Bayless
  • Microencapsulated particles and process for manufacturing same
    Patent number: 8003211
    Abstract: Microencapsulated particles having improved resistance to moisture and extended release capabilities are produced by microencapsulating the particles in a film-forming, cross-linked, hydrolyzed polymer.
    Type: Grant
    Filed: December 2, 2008
    Date of Patent: August 23, 2011
    Assignee: ENCAP Technologies, LLC
    Inventor: Robert G. Bayless
  • Microencapsulated particles and process for manufacturing same
    Patent number: 7297404
    Abstract: Microencapsulated particles having improved resistance to moisture and extended release capabilities are produced by microencapsulating the particles in a film-forming, cross-linked, hydrolyzed polymer.
    Type: Grant
    Filed: August 16, 2004
    Date of Patent: November 20, 2007
    Assignee: Encap Technologies, LLC
    Inventor: Robert G. Bayless
  • Moisture barrier resins
    Patent number: 6899958
    Abstract: Moisture barrier resins comprising a film-forming, cross-linkable, partially hydrolyzed polymer and a cross-linking agent provide improved impermeability to moisture and extended release capabilities for various particles, substances and other core materials that are encapsulated with compositions which contain these resins.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: May 31, 2005
    Assignee: Encap Technologies, LLC.
    Inventor: Robert G. Bayless
  • Microencapsulated particles and process for manufacturing same
    Patent number: 6833191
    Abstract: Microencapslated particles having improved resistance to moisture and extended release capabilities are produced by microencapsulating the particles in a film-forming, cross-linked, hydrolyzed polymer.
    Type: Grant
    Filed: November 14, 2002
    Date of Patent: December 21, 2004
    Assignee: Encap Technologies, LLC
    Inventor: Robert G. Bayless
  • Microencapsulated particles and process for manufacturing same
    Patent number: 6562460
    Abstract: Microencapsulated particles having improved resistance to moisture and extended release capabilities are produced by microencapsulating the particles in a film-forming, cross-linked, hydrolyzed polymer.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: May 13, 2003
    Assignee: Encap Technologies, LLC
    Inventor: Robert G. Bayless