Patents Assigned to Enclosure Technologies, Inc.
  • Patent number: 6220887
    Abstract: A stabilizer for holding a circuit card in an electrical port is provided. The stabilizer includes a frame. A lever having a pivotal mounting with respect to the frame is included. The lever has a portion for making contact with an edge of the circuit card to urge the circuit card towards the electrical port. The stabilizer has a fulcrum to set an angle of inclination of the lever with respect to the frame. The fulcrum contacts the lever between the lever's pivotal mounting and the circuit card.
    Type: Grant
    Filed: September 28, 1998
    Date of Patent: April 24, 2001
    Assignee: Enclosure Technologies, Inc.
    Inventor: David C. Downs
  • Patent number: 5997676
    Abstract: An apparatus and related method for manufacturing a full-fashioned glove from similar or dissimilar polymeric material includes a controller that actuates various components in the apparatus, a thumb mold that forms a thumb portion from two layers of a first material and a hand mold which forms a plurality of fingers and a cuff from the first material and a second material. Both the thumb mold and hand mold have appropriate cavities with apertures therethrough wherein a vacuum source, actuated by the controller, draws the appropriate material toward the surface of the mold prior to closure thereof. Upon closure of the molds, a fusing element is energized by the controller and the materials are fused to one another to form the appropriate portion of the full-fashioned glove. After the glove is removed from the remaining materials, it can be employed in various types of manufacturing industries.
    Type: Grant
    Filed: December 15, 1997
    Date of Patent: December 7, 1999
    Assignee: Enclosure Technologies, Inc.
    Inventors: Eran J. P. Jurrius, Robert L. Karam, Jr., James E. Jurrius
  • Patent number: 5728255
    Abstract: An apparatus and related method for manufacturing a full-fashioned glove from similar or dissimilar polymeric material includes a controller that actuates various components in the apparatus, a thumb mold that forms a thumb portion from two layers of a first material and a hand mold which forms a plurality of fingers and a cuff from the first material and a second material. Both the thumb mold and hand mold have appropriate cavities with apertures therethrough wherein a vacuum source, actuated by the controller, draws the appropriate material toward the surface of the mold prior to closure thereof. Upon closure of the molds, a fusing element is energized by the controller and the materials are fused to one another to form the appropriate portion of the full-fashioned glove. After the glove is removed from the remaining materials, it can be employed in various types of manufacturing industries.
    Type: Grant
    Filed: June 10, 1996
    Date of Patent: March 17, 1998
    Assignee: Enclosure Technologies, Inc.
    Inventors: Eran J. P. Jurrius, Robert L. Karam, Jr., James E. Jurrius
  • Patent number: 5616199
    Abstract: A device for electronically seam fusing similar or dissimilar multiple polymeric materials by placing the materials between two opposing plates, wherein the plates have cooling tubes disposed within the plates and have the required combination of heating elements, non-stick heat barriers, and configuration enhancers disposed thereon. The opposing plates are then closed by a force which is regulated by a control feature which also governs the timing, length and temperature that is utilized by the heat elements and cooling tubes of the invention. Upon completion of the electronic seam fuse cycle, the multiple layers of polymeric materials are fused together, and separated if desired, thus creating a seam that is as strong or stronger than the individual material. The selection of seam fusing process parameters is determined by employing an optimization process that considers the impact each process parameter has in combination with one another.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: April 1, 1997
    Assignee: Enclosure Technologies, Inc.
    Inventors: Eran J. P. Jurrius, Robert L. Karam, Jr.
  • Patent number: 5472549
    Abstract: A device for electronically seam fusing similar or dissimilar multiple polymeric materials by placing the materials between two opposing plates, wherein the plates have cooling tubes disposed within the plates and have the required combination of heating elements, non-stick heat barriers, and configuration enhancers disposed thereon. The opposing plates are then closed by a force which is regulated by a control feature which also governs the timing, length and temperature that is utilized by the heat elements and cooling tubes of the invention. Upon completion of the electronic seam fuse cycle, the multiple layers of polymeric materials will be fused together, and separated if desired, thus creating a seam that will be as strong or stronger than the individual material.
    Type: Grant
    Filed: July 8, 1994
    Date of Patent: December 5, 1995
    Assignee: Enclosure Technologies, Inc.
    Inventors: Eran J. P. Jurrius, Robert L. Karam, Jr.