Abstract: A method of forming a capacitive substrate in which at least one capacitive dielectric layer of material is screen or ink jet printed onto a conductor and the substrate is thereafter processed further, including the addition of thru-holes to couple selected elements within the substrate to form at least two capacitors as internal elements of the substrate. The capacitive substrate may be incorporated within a larger circuitized substrate, e.g., to form an electrical assembly. A method of making an information handling system including such substrates is also provided.
Type:
Grant
Filed:
February 13, 2006
Date of Patent:
November 11, 2008
Assignee:
Endicott Interconect Technologies, Inc.
Inventors:
Rabindra N. Das, John M. Lauffer, How T. Lin, Voya R. Markovich
Abstract: A circuitized substrate which includes a conductive paste for providing electrical connections. The paste, in one embodiment, includes a binder component and at least one metallic component including microparticles. In another embodiment, the paste includes the binder and a plurality of nano-wires. Selected ones of the microparticles or nano-wires include a layer of solder thereon. A method of making such a substrate is also provided, as are an electrical assembly and information handling system adapter for having such a substrate as part thereof.
Type:
Grant
Filed:
October 6, 2005
Date of Patent:
October 28, 2008
Assignee:
Endicott Interconect Technologies, Inc.
Inventors:
Rabindra N. Das, John M. Lauffer, Roy H. Magnuson, Voya R. Markovich