Abstract: Provided is a method of manufacturing a coil unit in a thin film type for a compact actuator, and more particularly, a method of manufacturing a coil unit in a thin film type for a compact actuator in which a buffer layer is formed on a coil layer to prevent cracks in the coil layer and a substrate. According to the method of manufacturing the coil unit in a thin film type for a compact actuator of the present invention, the buffer layer is formed on the coil layer so that an impact to the coil layer during a back-grinding process for thinning a substrate is absorbed, thereby preventing the substrate and the coil layer from breaking due to the back-grinding process and compensating for a difference of deformation between the coil unit and the substrate according to a difference of coefficients of thermal expansion.

Abstract: Disclosed is an optical image stabilization (OIS) structure that prevents camera shake occurring in a smartphone camera, and a camera module having the same. The OIS structure includes: a base housing provided with an OIS coil; a lens housing disposed over the base housing to be apart therefrom; and an OIS leaf spring for allowing the base housing and the lens housing to be elastically coupled to each other.

Abstract: Provided is a method of manufacturing a coil unit in a thin film type for a compact actuator, and more particularly, a method of manufacturing a coil unit in a thin film type for a compact actuator in which a buffer layer is formed on a coil layer to prevent cracks in the coil layer and a substrate. According to the method of manufacturing the coil unit in a thin film type for a compact actuator of the present invention, the buffer layer is formed on the coil layer so that an impact to the coil layer during a back-grinding process for thinning a substrate is absorbed, thereby preventing the substrate and the coil layer from breaking due to the back-grinding process and compensating for a difference of deformation between the coil unit and the substrate according to a difference of coefficients of thermal expansion.

Abstract: Provided is a method of manufacturing a coil unit in a thin film type for a compact actuator, and more particularly, a method of manufacturing a coil unit in a thin film type for a compact actuator in which a buffer layer is formed on a coil layer to prevent cracks in the coil layer and a substrate. According to the method of manufacturing the coil unit in a thin film type for a compact actuator of the present invention, the buffer layer is formed on the coil layer so that an impact to the coil layer during a back-grinding process for thinning a substrate is absorbed, thereby preventing the substrate and the coil layer from breaking due to the back-grinding process and compensating for a difference of deformation between the coil unit and the substrate according to a difference of coefficients of thermal expansion.

Abstract: Disclosed is an optical image stabilization (OIS) structure that prevents camera shake occurring in a smartphone camera, and a camera module having the same. The OIS structure includes: a hexahedral base housing provided with an OIS coil; a hexahedral lens housing disposed over the base housing to be apart therefrom; and an OIS leaf spring for allowing the base housing and the lens housing to be elastically coupled to each other.

Abstract: An alternative current (AC) direct drive light emitting diode (LED) power supply handling an overvoltage. The AC direct drive LED power supply includes a power input unit receiving AC power, a rectifier unit for generating an undulating current by rectifying the AC power, an LED array unit connected to receive the undulating current from the rectifier unit and formed of one or more LED modules, a constant current control unit connected to the LED array unit at a connecting point and controlling so as to allow a certain rated current or less to flow by modifying a waveform of the undulating current applied to the LED array unit, and a voltage-based current control unit adjusting the undulating current flow according to the voltage level at the connecting point.

Abstract: Provided is an alternative current (AC) direct drive light emitting diode (LED) power supply handling an overvoltage. The AC direct drive LED power supply includes a power input unit receiving an AC power, a rectifier unit for generating an undulating current by rectifying the AC power outputted from the power input unit, an LED array unit connected to receive the undulating current from the rectifier unit and formed of one or more LED modules, a constant current control unit connected to the LED array unit and controlling so as to allow a certain rated current or less to flow by modifying a waveform of the undulating current applied to the LED array unit, and a voltage-based current control unit driven by a voltage of both ends of the constant current control unit and continuously decreasing a current value of an overvoltage supplied form the power input unit according to a level of the overvoltage.

Abstract: Provided is an alternative current (AC) direct drive light emitting diode (LED) power supply handling an overvoltage. The AC direct drive LED power supply includes a power input unit receiving an AC power, a rectifier unit for generating an undulating current by rectifying the AC power outputted from the power input unit, an LED array unit connected to receive the undulating current from the rectifier unit and formed of one or more LED modules, a constant current control unit connected to the LED array unit and controlling so as to allow a certain rated current or less to flow by modifying a waveform of the undulating current applied to the LED array unit, and a voltage-based current control unit driven by a voltage of both ends of the constant current control unit and continuously decreasing a current value of an overvoltage supplied form the power input unit according to a level of the overvoltage.