Patents Assigned to ENETSHOPS, LLC
  • Patent number: 12251927
    Abstract: A heat press device is provided that includes a support structure, a first platen and a heating element assembly that includes a heating element and a second platen. The heat press device further includes a movement assembly configured to change a pressure state between the first platen and the second platen when the heat press device is in a closed configuration. The heat press device can also include an indicator that is configured to convey the pressure state between the first platen and the second platen when the heat press device is in the closed configuration.
    Type: Grant
    Filed: November 27, 2023
    Date of Patent: March 18, 2025
    Assignee: Enetshops, LLC
    Inventors: Jimmy Lin, Dawei Cao
  • Patent number: 11878506
    Abstract: A heat press device is provided that includes a support structure, a first platen and a heating element assembly that includes a heating element and a second platen. The heat press device further includes a movement assembly configured to change a pressure state between the first platen and the second platen when the heat press device is in a closed configuration. The heat press device can also include an indicator that is configured to convey the pressure state between the first platen and the second platen when the heat press device is in the closed configuration.
    Type: Grant
    Filed: July 18, 2022
    Date of Patent: January 23, 2024
    Assignee: Enetshops, LLC
    Inventors: Jimmy Lin, Dawei Cao
  • Patent number: 11390065
    Abstract: A heat press device is provided that includes a support structure, a first platen and a heating element assembly that includes a heating element and a second platen. The heat press device further includes a movement assembly configured to change a pressure state between the first platen and the second platen when the heat press device is in a closed configuration. The heat press device can also include an indicator that is configured to convey the pressure state between the first platen and the second platen when the heat press device is in the closed configuration.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: July 19, 2022
    Assignee: ENETSHOPS, LLC
    Inventors: Jimmy Lin, Dawei Cao