Patents Assigned to Engendren Corporation
  • Patent number: 10088241
    Abstract: The present invention relates to a multi-mode thermal management assembly with a selectable coolant flow path, and in particular to an assembly that selectably removes latent and/or sensible heat. Coolant (working fluid) is routed through openings in the bottom of the thermal management assembly. The assembly can have two heat exchangers (coolers), each having side-by-side vertical paths whereby coolant both enters and exits from the heat exchangers at their respective bottoms. Plumbing is provided that can be selected to route coolant for one of the user selected cooling modes. Valves allow the user to select at least between a combination mode (latent cooling with sensible reheat) and a sensible only cooling mode. In the combination mode, the latent heat exchanger cools and dehumidifies, and the sensible heat exchanger partially reheats the air while requiring no additional work to be done on the system by external power consuming devices.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 2, 2018
    Assignee: Engendren Corporation
    Inventor: Alan P. Meissner