Abstract: A system and method for forming a bonded integrated circuit, comprising dispensing a dielectric material on a first side of an integrated circuit, shaping the dielectric material on the first side of the integrated circuit to form a first dielectric surface; and dispensing a conductive material between a first printed circuit board (PCB) top surface and a top surface of the integrated circuit to form a first connection, the first connection situated on the first dielectric surface.

Abstract: The present disclosure can relate to a thermionic emission device. The thermionic emission device can include a substrate layer, an insulating layer deposited onto an uppermost surface of the substrate layer, and an electron emitting layer deposited onto an uppermost surface of the insulating layer. The electron emitting layer, the insulating layer, and the substrate layer each can include a first etching and a second etching oriented according to a photoresist pattern applied to an uppermost surface of the electron emitting layer. The first etching and the second etching can converge to form a cavity in the substrate layer beneath a beam suspended above the cavity. The beam can comprise an unetched region of the electron emitting layer and the insulating layer oriented between the first etching and the second etching.

Abstract: The present disclosure can relate to a thermionic emission device. The thermionic emission device can include a substrate layer, an insulating layer deposited onto an uppermost surface of the substrate layer, and an electron emitting layer deposited onto an uppermost surface of the insulating layer. The electron emitting layer, the insulating layer, and the substrate layer each can include a first etching and a second etching oriented according to a photoresist pattern applied to an uppermost surface of the electron emitting layer. The first etching and the second etching can converge to form a cavity in the substrate layer beneath a beam suspended above the cavity. The beam can comprise an unetched region of the electron emitting layer and the insulating layer oriented between the first etching and the second etching.

Abstract: MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.

Abstract: MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.

Abstract: MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.