Abstract: An apparatus and methods are provided for an air filter precleaner for an open air filter box. The air filter precleaner includes a filter medium between a base and a grating that are fastened over an opening into an interior of the air filter box. The filter medium comprises a sheet of filter material having a shape and a size suitable for being supported between the base and the grating. The base is a rigid member that supports the filter medium in a sheet configuration, such that the airstream passes through the filter medium before entering the air filter box. The grating is a rigid member comprising a screen portion surrounded by a frame that is configured to be fastened onto the air filter box. The screen portion comprises a shaped lattice that allows the airstream to pass through the filter medium before entering the air filter box.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a first electronic component, and an electronic device. The first electronic component is disposed over the substrate. The electronic device is at least partially embedded in the substrate. The electronic device includes a second electronic component and a reinforcement. The second electronic component is configured for providing a regulated voltage to the first electronic component. The reinforcement supports the second electronic component.

Abstract: Devices, systems, and methods are presented that employ high-surface gaseous solvent extraction of terpenoids, essential oil, and/or flavonoids from a liquid raw material at controlled temperature and pressure conditions. In some embodiments, the extraction is based on a rotary or falling film evaporator in which a steam jet is directed at a heated liquid film of raw material at elevated temperatures and reduced pressure.

Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.

Abstract: An electronic package includes an electronic structure, a first circuit pattern structure, a plurality of first solders and an encapsulant. The electronic structure includes an electronic device, and has a top surface and a bottom surface opposite to the top surface. The first circuit pattern structure is disposed over the top surface of the electronic structure. The first solders are disposed on the bottom surface of the electronic structure. The encapsulant encapsulates the electronic structure. At least a portion of the encapsulant is disposed between at least two of the plurality of first solders.

Abstract: An apparatus and a method are provided for an aircharger air intake system for filtering and conducting an airstream to an air intake of an engine. The aircharger air intake system includes an air filter comprising a filter medium configured to entrap particulates flowing within the airstream. An air box comprising one or more sidewalls and a mount wall is configured to support the air filter within an engine bay. The air box is configured to be mounted, or fastened, onto the engine. An intake tube is coupled with the air filter and configured to conduct the airstream to the air intake of the engine. The intake tube is configured to be coupled with an air temperature sensor or a mass air sensor of the engine. An adapter is configured to couple the intake tube with the air intake.

Abstract: A bone staple system configured to secure one or more bone segments and related methods is provided.

Abstract: A power module is disclosed. The power module includes a first conductive plate, a first power component, and a second power component. The first conductive plate has a first side and a second side opposite to the first side; The first power component is disposed at the first side. The second power component is disposed at a first location of the second side distinct from a second location of the second side. The second location is configured to transfer most heat from the first power component to the second power component if the second power component is disposed at the second location.

Abstract: A radial-type anti-backlash nut for use upon linear actuator leadscrews uses a separate housing resting upon the actuator’s main nut. The anti-backlash action is a multi-finger collet and spring setup located inside the housing. The collet tapers radially inward toward tips of the fingers at a specified taper angle. The whole interior length of an internal thread of the collet engages an external thread of the leadscrew. The housing is a pre-load nut with an internal tapered surface that mates with the collet fingers with substantially the same taper angle. The pre-load nut, when screwed onto external threads of the adjustment nut, both compresses a load spring and applies radially inward adjustable load force to the collet fingers against the leadscrew. Three tolerances adjust load: the taper angle of the main nut’s collet fingers, the spring load’s compression, and the collet finger mismatch with respect to the lead screw.

Abstract: A method and apparatus for removing volatiles and basic sediments and water from oil for delivery to a pipeline or storage.

Abstract: A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by the battery and the speaker. The chamber/space is devoid of any electronic component.

Abstract: The present disclosure provides a sensing package. The sensing package includes a carrier configured to face an object to be inspected and an emitter disposed adjacent to the carrier. The emitter is configured to emit a first light propagating in a first direction. The sensing package further includes a component configured to change the first light into a second light propagating in a second direction different from the first direction. An optical module and a method for detecting light are also provided.

Abstract: A universal controller having a housing is provided. The housing includes a first curved segment and a second curved segment, the first curved segment located on a first side of the housing and the second curved segment located on an opposite, second side of the housing, the first curved segment and the second curved segment symmetrical in shape and begin from a front surface of the housing and end at a rear surface of the housing enabling a user to grip a first side wall at a rear side of the housing and a second side wall at the rear side of the housing; and a cavity created at a bottom segment of the housing, the bottom segment coupled to a bottom support structure for receiving a first battery and a second battery to provide power to a plurality of electronic components of the universal controller.

Abstract: A method is performed to regulate access to electronic content based on content usage telemetry data. A first computer receives, from a second computer system, a request for access to electronic content. The first computer system determines, based on an access profile associated with the second computer system, that the second computer system is authorized to access the electronic content. A first authorization message indicating that the second computer system is authorized to access the electronic content is transmitted from the first computer system to the second computer system. The first computer system receives, from the second computer system, content usage telemetry data including data items indicating metrics of use of the electronic content by the second computer system. The first computer system modifies the access profile of the second computer system based on the content usage telemetry data.

Abstract: A resistance band exercise machine for performing various exercises. An embodiment includes a housing for a cable-pulley variable resistance system. Some embodiments are configured to receive one or more safety bars to set a starting position of an exercise. Some embodiments include a training partner assistantship feature for a training partner to assist the user by imparting a secondary force on the machine. The configuration of the cable-pulley variable resistance system may be in any manner based on the exercise. In some embodiments, a user performs an exercise on the resistance band exercise machine to overcome a primary (e.g., resistance bands) and secondary (e.g., springs) sources of variably increasing resistance from the cable-pulley variable resistance system.

Abstract: A method and apparatus for separating production fluids using a system designed to minimize the heating requirements through thermodynamic efficiency and reduce equipment costs.

Abstract: A semiconductor device includes: a substrate having a first surface and a second surface opposite to the first surface; an electronic component disposed on the first surface of the substrate; a sensor disposed adjacent to the second surface of the substrate; an electrical contact disposed on the first surface of the substrate; and a package body exposing a portion of the electrical contact.

Abstract: The present disclosure provides a semiconductor device package including a substrate having a first surface and a second surface opposite to the first surface, a first package body disposed on the first surface, and a conductive layer covering the first package body and the substrate. The conductive layer includes a first portion on the top surface of the first package body and a second portion on the lateral surface of the first package body and a sidewall of the substrate. The second portion of the conductive layer has a tapered shape. A method for manufacturing a semiconductor device package is also provided.

Abstract: A testing device is disclosed. The testing device includes a socket configured to support a DUT and a first detection module disposed at a first side of the socket and configured to detect a location relationship between the DUT and the socket.