Patents Assigned to Engineered Materials, Inc.
-
Publication number: 20250178324Abstract: A barrier film substrate includes a first layer including a polymer and a transition metal having chemical sequestering properties such that, upon exposure of the barrier film substrate to one or more chemical vapors, a reaction occurs between the transition metal and the one or more chemical vapors. A second layer is aligned with the first layer. The second layer includes a polymer having impeding properties such that, upon the exposure of the barrier film substrate to the one or more of the chemical vapors, the second layer substantially blocks passage of the one or more of the chemical vapors through the barrier film substrate. One or more additional layers is aligned with at least one of the first layer or the second layer to provide structural support for the first layer and the second layer.Type: ApplicationFiled: February 3, 2025Publication date: June 5, 2025Applicant: Engineered Materials, Inc.Inventors: Keith W. Donaldson, Marshall Grove, Joe Marks
-
Patent number: 12214574Abstract: A barrier film substrate includes a first layer including a polymer and a transition metal having chemical sequestering properties such that, upon exposure of the barrier film substrate to one or more chemical vapors, a reaction occurs between the transition metal and the one or more chemical vapors. A second layer is aligned with the first layer. The second layer includes a polymer having impeding properties such that, upon the exposure of the barrier film substrate to the one or more of the chemical vapors, the second layer substantially blocks passage of the one or more of the chemical vapors through the barrier film substrate. One or more additional layers is aligned with at least one of the first layer or the second layer to provide structural support for the first layer and the second layer.Type: GrantFiled: November 6, 2020Date of Patent: February 4, 2025Assignee: ENGINEERED MATERIALS, INC.Inventors: Keith W. Donaldson, Marshall Grove, Joe Marks
-
Patent number: 12207644Abstract: An active barrier to termites and other insects includes a polymeric or paper substrate; and a copper-carbon matrix, wherein the copper-carbon matrix is incorporated into or is coated onto the polymeric or paper substrate. The resulting combination of the substrate and copper-carbon matrix allows for the creation of films, tapes, coated paper and fabric, or molded or formed parts that interfere with and block the passage or entry beyond the barrier of termites or other insects. Uses may be as diverse as but not limited to underlayment(s) for temporary, semi-permanent or permanent structures as well as films and barriers for walls, roofs of permanent, semi-permanent or temporary structures, or interior spaces, cabinets, or vehicles or protecting equipment, telecommunication gear, electronics or other assets that may be impacted, damaged or degraded by termite or other such insect infestation.Type: GrantFiled: February 5, 2021Date of Patent: January 28, 2025Assignee: Engineered Materials, Inc.Inventors: Keith Donaldson, John Franey, Nancy Harper
-
Patent number: 11291199Abstract: An active barrier to termites and other insects includes a polymeric or paper substrate; and a copper-carbon matrix, wherein the copper-carbon matrix is incorporated into or is coated onto the polymeric or paper substrate. The resulting combination of the substrate and copper-carbon matrix allows for the creation of films, tapes, coated paper and fabric, or molded or formed parts that interfere with and block the passage or entry beyond the barrier of termites or other insects. Uses may be as diverse as but not limited to underlayment(s) for temporary, semi-permanent or permanent structures as well as films and barriers for walls, roofs of permanent, semi-permanent or temporary structures, or interior spaces, cabinets, or vehicles or protecting equipment, telecommunication gear, electronics or other assets that may be impacted, damaged or degraded by termite or other such insect infestation.Type: GrantFiled: July 28, 2015Date of Patent: April 5, 2022Assignee: Engineered Materials, Inc.Inventors: Keith Donaldson, John Franey, Nancy Harper
-
Publication number: 20210161121Abstract: An active barrier to termites and other insects includes a polymeric or paper substrate; and a copper-carbon matrix, wherein the copper-carbon matrix is incorporated into or is coated onto the polymeric or paper substrate. The resulting combination of the substrate and copper-carbon matrix allows for the creation of films, tapes, coated paper and fabric, or molded or formed parts that interfere with and block the passage or entry beyond the barrier of termites or other insects. Uses may be as diverse as but not limited to underlayment(s) for temporary, semi-permanent or permanent structures as well as films and barriers for walls, roofs of permanent, semi-permanent or temporary structures, or interior spaces, cabinets, or vehicles or protecting equipment, telecommunication gear, electronics or other assets that may be impacted, damaged or degraded by termite or other such insect infestation.Type: ApplicationFiled: February 5, 2021Publication date: June 3, 2021Applicant: Engineered Materials, Inc.Inventors: Keith DONALDSON, John FRANEY, Nancy HARPER
-
Publication number: 20210053325Abstract: A barrier film substrate includes a first layer including a polymer and a transition metal having chemical sequestering properties such that, upon exposure of the barrier film substrate to one or more chemical vapors, a reaction occurs between the transition metal and the one or more chemical vapors. A second layer is aligned with the first layer. The second layer includes a polymer having impeding properties such that, upon the exposure of the barrier film substrate to the one or more of the chemical vapors, the second layer substantially blocks passage of the one or more of the chemical vapors through the barrier film substrate. One or more additional layers is aligned with at least one of the first layer or the second layer to provide structural support for the first layer and the second layer.Type: ApplicationFiled: November 6, 2020Publication date: February 25, 2021Applicant: Engineered Materials, Inc.Inventors: Keith W. Donaldson, Marshall Grove, Joe Marks
-
Patent number: 10882289Abstract: A barrier film substrate includes a first layer including a polymer and a transition metal having chemical sequestering properties such that, upon exposure of the barrier film substrate to one or more chemical vapors, a reaction occurs between the transition metal and the one or more chemical vapors. A second layer is aligned with the first layer. The second layer includes a polymer having impeding properties such that, upon the exposure of the barrier film substrate to the one or more of the chemical vapors, the second layer substantially blocks passage of the one or more of the chemical vapors through the barrier film substrate. One or more additional layers is aligned with at least one of the first layer or the second layer to provide structural support for the first layer and the second layer.Type: GrantFiled: August 14, 2018Date of Patent: January 5, 2021Assignee: Engineered Materials, Inc.Inventors: Keith W. Donaldson, Marshall Grove, Joe Marks
-
Publication number: 20160135443Abstract: An active barrier to termites and other insects includes a polymeric or paper substrate; and a copper-carbon matrix, wherein the copper-carbon matrix is incorporated into or is coated onto the polymeric or paper substrate. The resulting combination of the substrate and copper-carbon matrix allows for the creation of films, tapes, coated paper and fabric, or molded or formed parts that interfere with and block the passage or entry beyond the barrier of termites or other insects. Uses may be as diverse as but not limited to underlayment(s) for temporary, semi-permanent or permanent structures as well as films and barriers for walls, roofs of permanent, semi-permanent or temporary structures, or interior spaces, cabinets, or vehicles or protecting equipment, telecommunication gear, electronics or other assets that may be impacted, damaged or degraded by termite or other such insect infestation.Type: ApplicationFiled: July 28, 2015Publication date: May 19, 2016Applicant: Engineered Materials, Inc.Inventors: Keith Donaldson, John Franey, Nancy Harper