Patents Assigned to Engineering Advancement Association of Japan
  • Patent number: 7598074
    Abstract: A reaction tank (5) holds crushed cells comprising a pellicle of Bacillus midousuji cultured in the presence of a chlorinated aromatic compound such as dioxins and holds wastewater comprising a contaminated matter such as fly ash which comprises dioxins and which is produced by washing of a facility such as an incinerator. Air is supplied by a blower (6) to a matter held in the reaction tank (5). Accordingly, dioxins having three or more chlorine atoms in the contaminated matter can be decomposed, and the contaminated matter can be easily cleaned at a site where dioxins generate such as a washing or dismantling site of an incineration facility.
    Type: Grant
    Filed: March 19, 2004
    Date of Patent: October 6, 2009
    Assignees: Takasago Thermal Engineering Co., Ltd., Engineering Advancement Association of Japan
    Inventors: Sadayori Hoshina, Atsushi Takahashi, Noboru Iiyama, Hitoshi Inaba
  • Patent number: 6172294
    Abstract: A thermoelectric semiconductor is formed of a sintered semiconductor layer and metal layers arranged on sides of opposite end faces of the sintered semiconductor layer. These metal layers are to inhibit a reaction between the sintered semiconductor layer and solder layers through which electrodes are joined to the sintered semiconductor layer. The sintered semiconductor layer and the metal layers have been obtained beforehand by integrally sintering a semiconductor powder layer and metal sheets arranged on sides of opposite end faces of the semiconductor powder layer.
    Type: Grant
    Filed: April 12, 1999
    Date of Patent: January 9, 2001
    Assignees: Technova Inc., Engineering Advancement Association of Japan
    Inventors: Katsuhiro Tsuno, Tsuyoshi Tosho, Hideo Watanabe
  • Patent number: 6159434
    Abstract: A fuel reforming apparatus comprising a liquid feed heating portion, an evaporation portion, a steam superheating portion, a reforming portion, a shift reaction portion, a CO oxidization portion, a catalytic combustion portion, and a heat recovery portion. These portions are constituted by flat plates provided with heat-transfer fins in the interior and are stacked into an integral structure, thereby obtaining a temperature distribution along a stacked direction so that the flat plate elements reach a temperature suitable for reforming, combustion, evaporation, shift, and CO oxidization.
    Type: Grant
    Filed: February 10, 1998
    Date of Patent: December 12, 2000
    Assignee: Engineering Advancement Association of Japan Mitsubishi Denki Kabushiki Kaisha
    Inventors: Yoshihide Gonjo, Teruo Sugimoto, Minoru Satoh
  • Patent number: 5959341
    Abstract: A thermoelectric semiconductor is formed of a sintered semiconductor layer nd metal layers arranged on sides of opposite end faces of the sintered semiconductor layer. These metal layers are to inhibit a reaction between the sintered semiconductor layer and older layers through which electrodes are joined to the sintered semiconductor layer. The sintered semiconductor layer and the metal layers have been obtained beforehand by integrally sintering a semiconductor powder layer and metal sheets arranged on sides of opposite end faces of the semiconductor powder layer.
    Type: Grant
    Filed: July 28, 1997
    Date of Patent: September 28, 1999
    Assignee: Technova Inc. and Engineering Advancement Association of Japan
    Inventors: Katsuhiro Tsuno, Tsuyoshi Tosho, Hideo Watanabe