Patents Assigned to Engineering
  • Publication number: 20250108650
    Abstract: A thermal printer includes a housing, a head cover, and a locking mechanism, wherein the locking mechanism includes a lever member and a lock member which are configured so that i) as an operation part is pressed down, the lock member rotates in a direction to move a claw away from the lock pin, and a lock is released by the claw being disengaged from the lock pin and ii) as the operation part of the lever member is pulled up, a portion of the lever member presses the lock member, whereby the lock member rotates in a direction to move the claw away from the lock pin, and the lock is released by the claw being disengaged from the lock pin.
    Type: Application
    Filed: November 3, 2024
    Publication date: April 3, 2025
    Applicant: Nippon Printer Engineering Inc.
    Inventor: Kouki EMORI
  • Patent number: 12268013
    Abstract: Disclosed is a high-resistance resistor based on silicon carbide. The resistor includes a semi-insulating 4H—SiC silicon carbide substrate, a silicon surface and a carbon surface of the silicon carbide substrate are provided with symmetrical atomic-thickness aluminum oxide insulating layers, thicknesses of the aluminum oxide insulating layers are 0.2 nm-2 nm, conductive metal electrodes are formed at two sides of the aluminum oxide insulating layers through evaporation, and thicknesses of the metal electrodes are 100 nm-500 nm. The present disclosure uses a high-resistance resistor based on silicon carbide that has the above structure, makes an ohmic contact electrode on a semi-insulating silicon carbide substrate, thus obtaining a resistor with a resistance of 100 T? or more, and satisfying requirements of the precision measurement industry.
    Type: Grant
    Filed: August 11, 2022
    Date of Patent: April 1, 2025
    Assignees: Talyuan University of Technology, Institute of New Materials and Chemical Engineering, Zhejiang University, Shanxi
    Inventors: Yuying Xi, Yanxia Cui, Kun Hu, Yuan Tian, Guohui Li, Bingshe Xu
  • Patent number: 12263463
    Abstract: The present disclosure relates to methods and systems for treating a fluid produced from a biorefinery to remove contaminants, such as metals and sulfur therefrom. Biomass is pyrolysed and activated to form activated carbon used to remove such contaminants. The fluid produced from the biorefinery may be one or more of a biofuel, a biogas, and wastewater.
    Type: Grant
    Filed: March 3, 2021
    Date of Patent: April 1, 2025
    Assignee: ExxonMobil Technology and Engineering Company
    Inventor: Everett J. O'Neal
  • Patent number: 12263438
    Abstract: Contactor structures are provided that can allow for improved heat management while reducing or minimizing the potential for contamination of process gas streams with heat transfer fluids. The contactor structures can include one or more sets of flow channels for process gas flows, such as gas flows introduced to allow adsorption of components from a gas stream or gas flows introduced to facilitate desorption of previously adsorbed components into a purge gas stream. The process gas flow channels can correspond to flow channels defined by a structural material of unitary structure. The unitary structure can correspond to the entire contactor, or the unitary structure can correspond to a monolith that forms a portion of the contactor. The contactor structures can also include one or more sets of flow channels for heat transfer fluids. The heat transfer flow channels can also be defined by the structural material of a unitary structure.
    Type: Grant
    Filed: May 20, 2022
    Date of Patent: April 1, 2025
    Assignees: ExxonMobil Technology and Engineering Company, Georgia Tech Research Corporation
    Inventors: Simon C. Weston, Ryan P. Lively, Matthew J. Realff, William J. Koros, Wenying Quan, Fengyi Zhang, Dong Hwi Jeong, Seongbin Ga, Stephen J. A. DeWitt, Yang Liu, Hannah E. Holmes
  • Patent number: 12267303
    Abstract: A structural encoding unit and an error correction decoding unit are divided. The structure encoding unit is divided into input branch processor and an input proxy processor; and the error correction decoding unit is divided into an output routing processor, an output proxy processor, an adjudication branch processor, an adjudication proxy processor and a voting processor. The input branch processor is used for duplicating and distributing messages, the arbitration branch processor is used for duplicating and distributing data, the voting processor is used for performing voting, and the output routing processor is used for selecting an output result from processing results of the output proxy processor according to a voting result of the voting processor.
    Type: Grant
    Filed: June 7, 2021
    Date of Patent: April 1, 2025
    Assignees: CHINA NATIONAL DIGITAL SWITCHING SYSTEM ENGINEERING & TECHNOLOGICAL R&D CENTER, PURPLE MOUNTAIN LABORATORIES
    Inventors: Lei He, Jiangxing Wu, Qinrang Liu, Ke Song, Shuai Wei, Jianliang Shen, Libo Tan, Yu Li, Quan Ren, Jun Zhou, Min Fu, Weili Zhang, Ruihao Ding, Yiwei Guo
  • Patent number: 12263602
    Abstract: A robot calibration method based on pose constraint and force sensing includes the following steps: establishing a kinematic model, a geometric error model, and a non-geometric error model; installing an end calibration device to an end of a robot, and installing to the geometric constraint device into a working space of the robot; dragging the robot, constraining various calibration spheres of the end calibration device into various V-shaped grooves on the geometric constraint device to achieve pose constraint; then dragging the calibration spheres to V-shaped grooves on different surfaces, and calibrating a geometric parameter error of the robot using a deviation between a nominal end pose measured twice and an actual value; reading an end force by a force sensor to calibrate the non-geometric error model; identifying kinematic model parameters of a corresponding robot; and compensating an identified kinematic model parameter error to a controller of the robot.
    Type: Grant
    Filed: June 20, 2023
    Date of Patent: April 1, 2025
    Assignee: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING, CHINESE ACADEMY OF SCIENCES
    Inventors: Guilin Yang, Jianhui He, Silu Chen, Hongyu Wan, Jingbo Luo, Ye Tang, Zhihui Zhang, Qingying Chen, Chi Zhang
  • Patent number: 12266941
    Abstract: The present invention relates to the technical field of power generation of power systems, in particular to an offshore integrated power supply system based on clean energy. The integrated power supply system comprises a power generation unit for providing energy, an energy storage unit for storing energy, a load unit for consuming energy, an energy management system, and a fuel cell, wherein the power generation unit comprises a photovoltaic power generation system, a wind power generation system, and a tidal power generation system; the energy storage unit comprises hydrogen storage and a battery pack; and the energy management system connects the power generation unit, the load unit, and the energy storage unit, and allocates the surplus energy from the power generation unit to the hydrogen storage and the battery pack after satisfying the load unit.
    Type: Grant
    Filed: May 9, 2024
    Date of Patent: April 1, 2025
    Assignees: Ningbo Electric Power Design Institute Co. Ltd, Ningbo Institute of Materials Technology & Engineering, Chinese Academy of Sciences, Ningbo Yongyao Power Investment Corporation Co., Ltd
    Inventors: Kai Shu, Wanbing Guan, Jun Wu, Xuanjun Chen, Yueping Yang, Yang Zhang, Zixiang Pei, Weitao Wang, Haibo Bi, Tiancheng Fan, Yuting Liu
  • Patent number: 12266632
    Abstract: A package structure includes: 1) a circuit substrate; 2) a first semiconductor device disposed on the circuit substrate; 3) a first insulation layer covering a sidewall of the first semiconductor device; 4) a second insulation layer covering the first insulation layer; and 5) a third insulation layer disposed on the circuit substrate and in contact with the second insulation layer.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: April 1, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chi-Chih Shen, Jen-Chuan Chen, Tommy Pan
  • Patent number: 12266758
    Abstract: Provided is a composition containing a redox charge-transfer complex of an electron donor polymer and an electron acceptor compound where the anionic form of the electron acceptor has a reduction potential higher than the reduction potential of the electron donor polymer; at least one metal salt and at least one additive compound having a dielectric constant of 10 or greater. The composition is a free-flowing, substantially amorphous powder and is useful as a metal ion conducting component of electrolytic cells.
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: April 1, 2025
    Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Ryuta Sugiura, Mikhail Redko, Michael Jones, John G. Muldoon, Patrick J. Bonnick
  • Patent number: 12263811
    Abstract: Vehicle systems, computer-implemented methods, and computer program products to enhance the situational competency and/or the safe operation of a vehicle by automatically controlling the vehicle in response to a biometric attribute analysis of one or more objects detected within a predetermined threshold distance of the vehicle.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: April 1, 2025
    Assignees: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC, TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Geoffrey David Gaither, Allison McGowan, Nathan Westover
  • Patent number: 12267961
    Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.
    Type: Grant
    Filed: January 23, 2024
    Date of Patent: April 1, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chien-Fan Chen, Chien-Hao Wang
  • Patent number: 12264079
    Abstract: A soda ash and sodium bicarbonate production method is provided, in which solution mining, pretreatment, stripping, concentration, sodium carbonate decahydrate crystallization, separation, dissolution, sodium carbonate monohydrate crystallization, separation and drying are performed to obtain dense soda ash. A dissolved sodium carbonate decahydrate solution or a concentrated brine 3 is subjected to crystallization, separation and drying to produce sodium bicarbonate. A discharge liquid 1 generated in the sodium carbonate decahydrate crystallization and separation is subjected to causticization and evaporation to recycle sodium carbonate. Causticized sludge generated in causticization is calcined and then recycled for causticization. The process provided herein maximizes the resource utilization.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: April 1, 2025
    Assignee: CHINA TIANCHEN ENGINEERING CORPORATION
    Inventors: Jigang Wang, Lixiang Lu, Qingtian Feng
  • Patent number: 12266644
    Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.
    Type: Grant
    Filed: February 8, 2021
    Date of Patent: April 1, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chang-Yu Lin, Chi-Han Chen, Chieh-Chen Fu
  • Patent number: 12264893
    Abstract: An archery bow is provided including opposing limbs and a riser. The riser can include a riser handle and one or more primary riser elongated elements extending away from the handle to respective limbs. The primary riser elongated elements can be straight, elongated round or other shaped tubes, rods or bars constructed optionally from a composite or other material. Vents can be included in ports of the riser to facilitate escape of air when riser elongated elements are installed in those ports. The riser can include one or more connector lugs disposed between tube portions to facilitate attachment of accessories to the elongated elements. The elongated elements can be bonded, adhered or otherwise fixed to the riser handle, struts, lugs and/or limb pockets, which can be constructed from a metal such as aluminum, titanium or an alloy, and which can handle significant moments and forces transferred via the elongated elements.
    Type: Grant
    Filed: October 24, 2023
    Date of Patent: April 1, 2025
    Assignee: Grace Engineering Corp.
    Inventors: Nathaniel E. Grace, Casey Warren Carew
  • Patent number: 12266610
    Abstract: A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.
    Type: Grant
    Filed: September 12, 2022
    Date of Patent: April 1, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yencheng Kuo, Shao-Lun Yang
  • Patent number: 12264691
    Abstract: An artificial muscle includes a housing including an electrode region, an expandable fluid region, a first film layer, and a second film layer. The first film layer and the second film layer each include an inner protective layer having a first elasticity, an outer protective layer having a second elasticity, and a reinforcing layer provided between the inner protective layer and the outer protective layer, the reinforcing layer having a third elasticity greater than the first elasticity of the inner protective layer and the second elasticity of the outer protective layer. The artificial muscle further includes an electrode pair positioned in the electrode region of the housing and between the first film layer and the second film layer, and a dielectric fluid housed within the housing.
    Type: Grant
    Filed: September 11, 2023
    Date of Patent: April 1, 2025
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Michael P. Rowe, Maduran Palaniswamy, Shardul Panwar
  • Patent number: 12263130
    Abstract: A therapeutic motion device includes a support structure including a first support portion and a second support portion. The first support portion rotatably coupled to the second support portion and at least one of the first support portion and the second support portion is movable relative to the other of the first support potion and the second support portion. First and second actuation arms extend from the first and second support portions, respectively. An artificial muscle drive unit couples the first actuation arm to the second actuation arm, the artificial muscle drive unit including one or more artificial muscles expandable in a movement direction to provide a movement force to at least one of the first support portion and the second support portion.
    Type: Grant
    Filed: July 17, 2020
    Date of Patent: April 1, 2025
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Michael P. Rowe, Danil Prokhorov
  • Patent number: 12263876
    Abstract: An extended collapsible wagon including a handle, a first supporting frame, and a second supporting frame. The first supporting frame and the second supporting frame are connected with a pair of connecting members. Each connecting member comprises three scissor hinge structures. A folding base frame is provided below the receiving space defined between the first and second supporting frames and the pair of connecting members, to provide a sturdy support structure for the flexible container. The folding base frame includes first and second base frame panels located below respective one of two adjacent scissor hinge structures and a third base frame panel having two sub-panels pivotally connected to fold below the third scissor hinge structure. The first base frame is pivotally connected to the second base frame panel, and the second base frame is pivotally connected to the third base frame, so as to form the foldable base frame.
    Type: Grant
    Filed: March 10, 2022
    Date of Patent: April 1, 2025
    Assignee: MAXTON ENGINEERING LTD.
    Inventor: Shou Qiang Zhu
  • Patent number: 12263835
    Abstract: Systems include a controller programmed to instruct a sensor to detect an object in an environment of a vehicle in response to an activation of a fall-on-car prevention function, determine a first value of a parameter pertaining to the object at a first time with the sensor, determine a second value of the parameter pertaining to the object at a second time with the sensor, and automatically cause an action to occur based on a comparison of the first value of the parameter and the second value of the parameter.
    Type: Grant
    Filed: August 18, 2022
    Date of Patent: April 1, 2025
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Seyhan Ucar, Emrah Akin Sisbot, Kentaro Oguchi
  • Patent number: 12266618
    Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a carrier having a first side and a second side adjacent to the first side. The semiconductor device also includes a first antenna adjacent to the first side and configured to operate at a first frequency and a second antenna adjacent to the second side and configured to operate at a second frequency different from the first frequency. An method of manufacturing a semiconductor device is also provided.
    Type: Grant
    Filed: February 18, 2022
    Date of Patent: April 1, 2025
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jenchun Chen, Shyue-Long Louh