Abstract: The disclosure belongs to the field of sewage treatment technology, in particular to a low-carbon nitrogen and phosphorus removal system and process for sewage treatment. The system of the disclosure includes a primary sedimentation fermentation tank, a mainstream modified A2O unit and a bypass anammox unit. The disclosure sets a denitrification phosphorus removal functional zone in the anoxic tank of the A2O system, and sets a deoxygenation zone in the aerobic tank. Combined with the primary sedimentation fermentation tank, the efficient utilization of the carbon source of the A2O process is strengthened. The system has good effluent quality and does not require the addition of a carbon source, and the aeration energy consumption is low, which achieves efficient and low-carbon nitrogen and phosphorus removal.

Abstract: To provide a resin composition that excels both in transparency and mechanical strength, as well as a formed article, and a formed article with hard coat layer. The resin composition contains 5 to 100 parts by mass of a glass filler, per 100 parts by mass of a resin component, the resin component containing 40 to 85 parts by mass of a polycarbonate resin that contains a structural unit represented by Formula (1), and 15 to 60 parts by mass of a thermoplastic resin other than the polycarbonate resin, the resin component and the glass filler demonstrating an absolute difference in refractive index of 0.0042 or smaller, and the resin component demonstrating a coefficient of dynamic friction, measured in compliance with ISO 19252, of 0.40 or smaller: In Formula (1), R1 represents a methyl group.

Abstract: A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a package component having a first mounting surface and a second mounting surface; and a first electronic component having a first conductive pad signal communicatively mounted on the first mounting surface through a first type connector; wherein the first type connector comprises a first solder composition having a lower melting point layer sandwiched between a pair of higher melting point layers, wherein the lower melting point layer is composed of alloys capable of forming a room temperature eutectic.

Abstract: A double-skin liner for a combustion chamber of a gas turbine. The double-skin liner includes an inner layer, an outer layer with an expansion gap provided on the outer layer, a gap covering element, a sealing element, a plurality of internal cooling holes provided on the inner layer, and a plurality of external cooling holes provided on the outer layer. When the inner layer expands due to temperature increase, a proximal section of the outer layer and a distal section of the outer layer distance from each other through lengthening the expansion gap.

Abstract: An electronic device is provided. The electronic device includes a carrier, a first electronic component, a second electronic component, and an encapsulant. The first electronic component is disposed at a first side of the carrier. The second electronic component is disposed at a second side of the carrier opposite to the first side. The encapsulant encapsulates the first electronic component and has an uneven thickness. The encapsulant is configured to reduce a warpage of the carrier.

Abstract: A device for thermionic arc extinction via anode ion depletion. The device includes a body including an inner compartment. The inner compartment includes at least an arc shield housing at least two arcing contacts, wherein the two arcing contacts are zinc-plated. The at least two zinc-plated arcing contacts further comprise a thickness and contact area customized based on a desired corrosion time of the zinc, wherein the corrosion time corresponds to extinction of the arc. A sensor is associated with the device. The sensor is configured to operate the movement of the at least two arcing contacts.

Abstract: A system and methods for a turbo-boost control system are disclosed for providing a driver of a vehicle with greater control over vehicle performance. The turbo-boost control system instructs an electronic control unit of the vehicle to increase the manifold pressure to a higher level before releasing the pressure through a waste gate so as to provide a greater power output of the engine. The turbo-boost control system includes a control module, a wiring harness, and a signal adjuster. The wiring harness couples the control module with a turbo inlet pressure sensor, a manifold absolute pressure sensor, and an electronic control unit of the vehicle. The control module sends signals to the electronic control unit based on input readings from the turbo inlet pressure sensor and the manifold absolute pressure sensor. The signal adjuster includes a rheostat that enables manual adjustment of the power output of the engine.

Abstract: An electronic device is provided. The electronic device includes a circuit pattern layer. The circuit pattern layer includes a first surface, a second surface recessed with respect to the first surface; and a third surface recessed with respect to the first surface and adjacent to and spaced apart from the second surface. The second surface and the third surface are mis-aligned with each other.

Abstract: A controller may use energy packets to control a prime mover of a machine. The controller may include an energy packet measurement control to calculate energy packets, perform post-processing actions on the energy packets to generate processed energy packets, and convert the processed energy packets into a fuel valve reference. Post-processing may include a calibration correction to remove measurement artifacts.

Abstract: A wiring structure includes a test pattern layer. The test pattern layer includes a test circuit pattern and a heat dissipating structure. The heat dissipating structure is disposed adjacent to the test circuit pattern, and is configured to reduce temperature rise of the test circuit pattern when a power is applied to the test circuit pattern.

Abstract: Aspects of the present disclosure provide a betatron for accelerating electrons. For example, the betatron can include magnet core parts spaced apart by an air gap. At least one main coil can be arranged on the magnet core parts. A betatron tube can be arranged in the air gap for electrons to circulate therein. A control circuit can be electrically coupled to the main coil. The control circuit can be configured to control a main coil current flowing through the main coil, such that as the control circuit increases the main coil current during a current ramp up period, the control circuit maintains the main coil current at a constant level during an injection period when the electrons are injected into the betatron. The current ramp up period can include a short pause and the injection period.

Abstract: Devices, systems, methods, and techniques for multicast failover handling in a computer communication network are disclosed. The methods herein described are particularly suited to software-defined networks (SDNs), and comply with requirements for assuring delivery of network traffic to each destination from a source engaged in multicast network traffic dissemination, assured delivery of each data packet as introduced into the network by the source device and avoidance of duplicate delivery of data. The methods herein are agile and respond rapidly to changes in a network while traffic is on the network.

Abstract: Devices, systems, methods, and techniques for multicast failover handling in a computer communication network are disclosed. The methods herein described are particularly suited to software-defined networks (SDNs), and comply with requirements for assuring delivery of network traffic to each destination from a source engaged in multicast network traffic dissemination, assured delivery of each data packet as introduced into the network by the source device and avoidance of duplicate delivery of data. The methods herein are agile and respond rapidly to changes in a network while traffic is on the network.

Abstract: A mounting pad system for securing equipment, such as an HVAC outdoor unit or a standby generator, is provided in the form of a lightweight fillable pad member having a plurality of receivers located on a top surface of the pad member. The receivers are associated with attachment points located on the equipment and are used to secure the equipment to the pad. The pad member contains a filling port on its top surface and is configured as a molded hollow shell containing a gelling material which, when mixed with water, provides support to reduce deflection of the pad member caused by the equipment secured to the pad, prevents damage to the pad that would otherwise be caused by the expansion of internal contents upon freezing and prevents leakage of internal contents of the fillable pad in the event of an unintended breach in the hollow shell. The pad member is provided with at least one through-hole that acts as a supporting structure.

Abstract: An electronic device is disclosed. The electronic device includes a first electronic component and a power regulating structure configured to provide a first power to the first electronic component. The power regulating structure includes a first component and a second component at least partially overlapped with the first component from a top view.

Abstract: A microelement transfer system includes a microelement carrier. The microelement carrier includes a first plate, a second plate, and a microelement support. The first plate has a plurality of first through-holes corresponding to respective microelements. The second plate is provided on the first plate and has a second through-hole having a smaller inner diameter than that of the first through-hole. At least one of the first plate and the second plate is made of an anodic oxide film material. The microelement support includes a carrier substrate on which the microelements are temporarily fixed. The microelement transfer system relatively moves at least one of the microelement carrier and the microelement support in at least one direction so that each of the microelements comes into contact with a side wall of a corresponding one of the first through-holes and detaches to be released from the temporarily fixed state.

Abstract: The present disclosure provides a semiconductor device. The semiconductor device includes a carrier having a first side and a second side adjacent to the first side. The semiconductor device also includes a first antenna adjacent to the first side and configured to operate at a first frequency and a second antenna adjacent to the second side and configured to operate at a second frequency different from the first frequency. An method of manufacturing a semiconductor device is also provided.