Abstract: A semiconductor device package includes a first conductive structure, a stress buffering layer and a second conductive structure. The first conductive structure includes a substrate, at least one first electronic component embedded in the substrate, and a first circuit layer disposed on the substrate and electrically connected to the first electronic component. The first circuit layer includes a conductive wiring pattern. The stress buffering layer is disposed on the substrate. The conductive wiring pattern of the first circuit layer extends through the stress buffering layer. The second conductive structure is disposed on the stress buffering layer and the first circuit layer.
Type:
Grant
Filed:
May 25, 2021
Date of Patent:
August 8, 2023
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Inventors:
Chien-Mei Huang, Shih-Yu Wang, I-Ting Lin, Wen Hung Huang, Yuh-Shan Su, Chih-Cheng Lee, Hsing Kuo Tien
Abstract: Provided are a signaling coding and modulation method and a demodulation and decoding method and device, characterized in that the method comprises the steps of: extending signaling which has been subjected to first predetermined processing according to an extension pattern table to obtain an extended codeword, and conducting predetermined coding on the extended codeword to obtain a encoded codeword; conducting parity bit permutation on a parity bit portion in the encoded codeword and then splicing the permutated parity bits to the end of information bits in the encoded codeword, to obtain a permutated encoded codeword; according to the length of the signaling, punching the permutated encoded codeword according to a predetermined punching rule to obtain a punched encoded codeword; and conducting second predetermined processing on the punched encoded codeword to obtain a tuple sequence, which is used for mapping, and then mapping the tuple sequence.
Type:
Grant
Filed:
February 28, 2022
Date of Patent:
August 8, 2023
Assignee:
Shanghai National Engineering Research Center of Digital
Television Co., Ltd.
Inventors:
Wenjun Zhang, Yijun Shi, Dazhi He, Ge Huang, Hongliang Xu, Yao Wang
Abstract: Hybrid additive featured plates used to form an overall microchannel heat exchanger and corresponding method of manufacture are disclosed. Various additive manufacturing (AM) techniques may be used to form walls defining microchannel features on a plate substrate. The manufacturing method is a hybrid process in that leverages both additive and conventional manufacturing techniques to minimize both cost and fabrication time.
Type:
Grant
Filed:
August 31, 2021
Date of Patent:
August 8, 2023
Assignees:
National Technology & Engineering Solutions of Sandia, LLC, Vacuum Process Engineering, Inc.
Inventors:
Matthew David Carlson, Yasmin Dennig, Judith Maria Lavin, David M. Keicher, Carl Schalansky
Abstract: A shifter simulator system comprising a frame with a gear stick hinge, a gear stick that is hingedly connected to the frame via the gear stick hinge, and a moveable frame part configured for moving relative to the frame and provided with a first contact surface and a second contact surface. The shifter simulator system also includes a magnetic contact and a tilting element configured for tilting around a tilting axis via a tilting connection in response to a movement of the gear stick and providing a first lever, and wherein the tilting element is provided with a first contact element and a second contact element configured for engaging the respective first and second contact surfaces of the moveable frame part providing a second lever, and by moving the moveable frame part defining a shifter movement with the magnetic contact. The first and/or second levers are adjustable.
Abstract: Systems, methods, and other embodiments described herein relate to monitoring a vehicle user's health and initiating a vehicle action based on the user's health and emotional state. In one embodiment, a method includes, responsive to detecting an event based on sensor data, requesting a user place the user's hand on an electrodermal activity (EDA) sensor. The EDA sensor is fixed to a dual-sided transparent display. The method includes acquiring EDA data relating to the user via the EDA sensor, determining a condition of the user based on the EDA data, and implementing a vehicle action in response to the condition of the user.
Type:
Grant
Filed:
August 8, 2022
Date of Patent:
August 8, 2023
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc.
Inventors:
Frederico Marcolino Quintao Severgnini, Sean P. Rodrigues, Paul Donald Schmalenberg
Abstract: Multifunctional RF limiting amplifiers having various configurations and functions are disclosed. In a first configuration, the RF limiting amplifier includes an active load output circuit that allows one to adjust the output impedance based upon the anticipated connected load impedance. In a second configuration, the RF limiting amplifier includes a pair of emitter-followers to buffer the output of a first stage, allowing the RF limiting amplifier to drive one or more second stages. A third configuration includes a pair of RF limiting amplifiers with their outputs mixed to implement a down conversion function. The third configuration may be used to drive dual SAW resonators for detecting the presence of biological or chemical agents. The RF limiting amplifier may be implemented in either bipolar junction transistors or CMOS transistors.
Type:
Grant
Filed:
November 19, 2020
Date of Patent:
August 8, 2023
Assignee:
National Technology & Engineering Solutions of Sandia, LLC
Abstract: A container holds radioactive material. A sub-criticality controller protects the radioactive material from reaching a criticality from contact with the water. The sub-criticality controller includes a metallic composition having at least one metal component and at least one borate component bonded to the at least one metal component. The metallic composition forms borates when the metallic composition contacts the water.
Type:
Grant
Filed:
July 9, 2020
Date of Patent:
August 8, 2023
Assignee:
National Technology & Engineering Solutions of Sandia, LLC
Abstract: A semiconductor device package includes an electronic component and a substrate. The electronic component has a first surface and a second surface. The substrate is connected to the first surface of the electronic component through an adhesive layer. The substrate includes a first antenna disposed over the second surface of the electronic components through the adhesive layer.
Type:
Grant
Filed:
October 22, 2020
Date of Patent:
August 8, 2023
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: Methods disclosed herein include using additive manufacturing to create a joint between a first metallic material and a second metallic material that is different from the first metallic material, wherein the porosity of the joint is less than about 0.1 percent by volume measured according to ASTM B-962. The additive manufacturing can be performed such that no intermetallic brittle phase forms between the first metallic material and the second metallic material.
Type:
Grant
Filed:
January 10, 2020
Date of Patent:
August 8, 2023
Assignee:
Exxon Mobil Technology and Engineering Company
Abstract: A semiconductor package device includes a wiring structure, a semiconductor chip and an encapsulant. The semiconductor chip is electrically connected to the wiring structure. The encapsulant is disposed on the wiring structure and covers the semiconductor chip. A roughness (Ra) of a surface of the encapsulant is about 5 nm to about 50 nm.
Type:
Grant
Filed:
July 6, 2021
Date of Patent:
August 8, 2023
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: Fungi that are genetically inactivated for the mstC gene (or a homolog thereof) are provided, which can also be genetically modified to increase production of heterologous proteins from a glucoamylase promoter. Methods of using these fungi, for example to degrade a biomass, are also provided.
Type:
Grant
Filed:
January 28, 2021
Date of Patent:
August 8, 2023
Assignees:
Battelle Memorial Institute, National Technology & Engineering Solutions of Sandia, LLC
Inventors:
Scott E. Baker, Jon K. Magnuson, Morgann C. Reilly, Joonhoon Kim, John Gladden, Jed J. Lynn
Abstract: A tunable metamaterial structure can have a flexible substrate that is elastically deformable. The tunable metamaterial structure can have a photo-responsive stiffness-modulating patch. The photo-responsive stiffness-modulating patch can be fixed to a surface of the flexible substrate. The photo-responsive stiffness-modulating patch can include a piezoelectric element and a photo-responsive element. The piezoelectric element and the photo-responsive element are electrically connected to one another.
Type:
Grant
Filed:
February 2, 2021
Date of Patent:
August 8, 2023
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: System for providing a conduit sealingly to a through-opening in a plate-shaped construction element so that at least one pipe and/or cable can extend through the conduit and so that after sealing remaining space in the conduit a completely sealed-off pipe and/or cable penetration through the plate-shaped construction element is obtained, wherein the system is such that it is mechanically mountable, wherein the system is further such that it is mountable from only one side of the plate-shaped construction element, by only one worker.
Abstract: A conductive structure includes a core portion, a plurality of electronic devices and a filling material. The core portion defines a cavity. The electronic devices are disposed in the cavity of the core portion. The filling material is disposed between the electronic devices and a sidewall of the cavity of the core portion.
Type:
Grant
Filed:
January 25, 2021
Date of Patent:
August 8, 2023
Assignee:
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
Abstract: The present disclosure is directed to methods that provide a secure communication protocol by utilizing one step process of authenticating and encrypting data without having to exchange symmetric keys or needing to renew or re-issue digital identities fundamental to asymmetric encryption methodology.
Type:
Grant
Filed:
July 8, 2021
Date of Patent:
August 8, 2023
Assignee:
National Technology & Engineering Solutions of Sandia, LLC
Abstract: A battery pack assembly includes a battery pack, a first elongated terminal connector, a second elongated terminal connector, and a biasing member. The battery pack includes a plurality of battery cells each having a terminal. The first elongated terminal having a plurality of first recesses. The second elongated terminal having plurality of second recesses. The first elongated terminal connector and the second elongated terminal connector movable between an engaged position and a disengaged position. The biasing member extends between the first elongated terminal and the second elongated terminal, and the biasing member biases the first elongated terminal and the second elongated terminal towards the engaged position. In the engaged position, the plurality of first recesses are engaged with the terminals of the plurality of battery cells and the plurality of second recesses are engaged with the terminals of the plurality of battery cells.
Type:
Grant
Filed:
March 2, 2020
Date of Patent:
August 8, 2023
Assignee:
Toyota Motor Engineering & Manufacturing North America, Inc.
Abstract: The present invention relates to architected stamps having beneficial printing properties. In particular, negative Poisson ratio structures and/or porous reservoirs can be employed to control fluid dynamics and to provide metered ink transfer.
Type:
Grant
Filed:
November 23, 2020
Date of Patent:
August 8, 2023
Assignee:
National Technology & Engineering Solutions of Sandia, LLC
Inventors:
Bryan James Kaehr, Michael Alfonso Gallegos, Chelsea M. Garcia, Peter Randall Schunk, Ethan Benjamin Secor
Abstract: Systems and methods of a seatbelt with head restraint are provided. A seatbelt assembly for a vehicle may include a plurality of airbags and an electrostatic clutch to control a deployment of the plurality of airbags. The electrostatic clutch may be operable to limit a movement of the plurality of airbags relative to each other to define a deployment shape of the airbags. Associated vehicles including the seatbelt assembly are provided. Associated methods are also provided.
Type:
Grant
Filed:
September 9, 2022
Date of Patent:
August 8, 2023
Assignees:
TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH
AMERICA, INC., TOYOTA JIDOSHA KABUSHIKI KAISHA
Inventors:
Phouvadol P. Khouphongsy, Umesh Gandhi, Danil Prokhorov, Yuyang Song, Paul Gilmore