Abstract: An augmented reality inspection system includes a computing device having a processor and a non-transitory computer readable memory, a camera and display device communicatively coupled to the computing device, and a machine-readable instruction set stored in the non-transitory computer readable memory. The machine-readable instruction set causes the augmented reality inspection system to capture an image of a portion of a vehicle with the camera, compare the image of the portion of the vehicle to an image of an acceptable vehicle configuration, determine whether features within the image of the portion of the vehicle matches at least one acceptable vehicle configuration based on the image of the acceptable vehicle configuration, and in response to determining that the features does not match at least one acceptable vehicle configuration, present on the display device a highlighted portion identifying the features within the image of the portion of the vehicle that does not match.

Abstract: Systems, methods, and other embodiments described herein relate to a manner of extending the use of originally-equipped automotive vehicle sensors to environmental mapping. In one embodiment, a method includes acquiring sensor data from a vehicle-equipped detachable sensor of an environment around a non-automotive entity when the vehicle-equipped detachable sensor is mounted to the non-automotive entity. The vehicle-equipped detachable sensor is capable of sensing a portion of an environment around an automotive vehicle and configured to communicate with a computing device. The vehicle-equipped detachable sensor is also structured to be detached from the automotive vehicle and mounted to the non-automotive entity. Further, the method includes receiving a mapping request from the computing device. The method also includes, in response to the mapping request, building a map, from the acquired sensor data, of an area traveled by the non-automotive entity.

Abstract: An appliance lid hinge assembly includes a cam arm pivotally connected a base. A cam arm control system includes a spring rod adapted to move in a sliding reciprocal manner. A spring urges the spring rod toward an extended position. The spring rod is movable toward a retracted position. The cam arm is engaged with the spring rod through a cam follower such that: (i) pivoting movement of the cam arm in an opening direction corresponds with movement of the spring rod from the retracted position toward the extended position; and, (ii) pivoting movement of the cam arm in a closing direction opposite the opening direction corresponds with movement of the spring rod from the extended position toward the retracted position. An optional damper exerts a damping force on the spring rod or other part of the cam arm control system when the cam arm moves in a closing direction.

Abstract: A multiple layer metallic laminate having more desirable electrical properties as compared to known embodiments includes multiple layers of metallic sheets clad together. The multiple layer laminate composite includes at least a first metallic layer having good soldering properties, such as commercially available nickel or nickel alloys, a second metallic layer having good resistance welding properties, such as commercial available steels or stainless steels, a third metallic layer having low electrical resistivity properties, such as commercially available copper and copper alloys, a fourth metallic layer have good resistance welding properties, such as commercially available steels or stainless steels, and a fifth metallic layer having good soldering properties, such as commercially available nickel or nickel alloys.

Abstract: The present invention provides for a method for dissolving and/or depolymerizing lignin comprising: (a) providing a composition comprising lignin, (b) contacting the composition with a strong hydrogen donor, such as a polyol, to form a first solution, (c) incubating the first solution at a temperature equal to or less than 100° C., whereby at least 20% by weight of the lignin is dissolved, (d) optionally introducing an oxidation agent to the first solution to form a second solution, wherein the temperature of the second solution is equal to or less than 100° C., whereby lignin is depolymerized, and (e) optionally introducing an anti-solvent to the second solution to precipitate the depolymerized lignin.

Abstract: A device and method for mitigating a vehicle collision are disclosed. The device and method include monitoring for an object within a vehicle travel path that includes a heightened travel hazard level. Upon detecting the object within the vehicle travel path, a closing distance rate, relative to the object, is compared with a closing threshold. When the closing distance rate compares unfavorably with the closing threshold, a secondary vehicle travel path based on the closing distance rate is determined, producing a determined secondary vehicle travel path. A command data output is generated for transmission to autonomously engage the determined secondary vehicle travel path.

Abstract: Various embodiments provide a method of simulating a leak in a pipeline. The method includes: receiving a fluid stream from a fluid supply; and outputting the received fluid stream through an outlet such that the received fluid stream hits an outer surface of the pipeline at a location opposite the outlet such that a vibration is caused in the pipeline. Some other embodiments provide a corresponding system for simulating a leak in a pipeline, and a corresponding outlet for coupling a conduit to a pipeline.

Abstract: An injection station of an injection blow molding machine. The injection station comprises a lower die plate and an upper die plate, with lower and upper die plates being shiftable relative to one another between an open position and a closed position. The injection station additionally includes one or more lower mold halves rigidly secured to the lower die plate. The injection station additionally includes one or more upper mold halves floatingly secured to the upper die plate such that positions of the upper mold halves are configured to be adjusted with respect to the upper die plate. Each of the lower mold halves corresponds with an upper mold half to present one or more mold cavities when the lower and upper die plates are in the closed position.

Abstract: Described herein are various technologies pertaining to randomizing logic associated with dangling nodes in a digital circuit design. A dangling node is an input to or output from a logic gate in the digital circuit design that is identified as not impacting a desired output of the digital circuit design. Randomizing the logic associated with a dangling node can include deleting a logic gate, adding a logic gate, replacing a logic gate with another logic gate, etc. Randomizing the logic associated with the dangling node prevents hardware trojans that may have been inserted into the circuit design from being implemented in a circuit that is generated based upon the design.

Abstract: A press-in fastener incorporates a compound wave pattern into the shank knurl. The knurl is generally aligned vertically but instead of a straight uniform knurl pattern, the rows of knurls have an undulating curved shape that alternates from a narrow to a wider cross-section as they transverse axially along the length of the pin shank. The knurls are arranged in straight or serpentine longitudinal rows equally spaced around a circumference of the shank. At least one of the rows has a wavy cross-sectional profile in a radial plane containing the longitudinal axis wherein said profile consists of a series of contiguous alternating crests and valleys. The compound wavy configuration of the knurls yields a number of benefits without adversely affecting the manufacturing process. The knurl configuration also reduces the installation force and disruption of the host material while maintaining a better lock on the host material.

Abstract: The present disclosure relates to packet routing using a registry to communicate packets between a first service and a second service of an electronic device. The electronic device may have memory that includes a registry having a table of services with at least one memory address of the second service being associated with consuming at least one packet type. The electronic device may store, in the first service, the at least one memory address of the second service and the at least one packet type. The electronic device may produce, via the first service, at least one packet of the at least one packet type. The electronic device may provide the at least one packet to the at least one memory address associated with the second service to allow the second service to consume data of the at least one packet.

Abstract: A reaction torque limiting backup wrench arrangement (1) has at least one fastener engaging means e.g. spanner (6) or socket (170), for a pressure boundary bolted joint nut (5) of a respective fastener (3). The backup wrench arrangement provides a reaction torque up to a threshold above which rotation allowed by motion of the fastener engaging means is determined by a magnitude of the reaction torque and force deflection characteristic of a biasing arrangement acting directly or indirectly on the fastener engaging means. Tension in the flexible tension element e.g. chain (7) urges the spanner (6) onto the nut (5) of the fastener permitting the spanner to displace when torque transmitted through a bolt to the nut or bolt head within the spanner exceeds a threshold torque, enabling the nut or bolt head to rotate, helping prevent bolt over-tightening, and helping indicate the bolt seizing or galling.

Abstract: A system including a camera configured to capture a first image of an offshore structure and a second image of the offshore structure, and a processor coupled to the camera, the processor configured to receive the first image and the second image from the camera, recognize a first visual pattern in the first image and the second image, extract pixel coordinates associated with a first position of the first visual pattern in the first image and a second position of the first visual pattern in the second image, and determine a first distance between the first position and the second position, or the first position of the first visual pattern and a first position of a second visual pattern fixably attached to the offshore structure in the first image.

Abstract: The present disclosure relates to a semiconductor device package including a substrate, a semiconductor device and an underfill. The substrate has a first surface and a second surface angled with respect to the first surface. The semiconductor device is mounted on the first surface of the substrate and has a first surface facing the first surface of the substrate and a second surface angled with respect to the first surface of the substrate. The underfill is disposed between the first surface of the semiconductor device and the first surface of the substrate. The second surface of the substrate is located in the substrate and external to a vertical projection of the semiconductor device on the first surface of the substrate.

Abstract: A method for stress-induced magnetic field signal acquisition and stress measurement is disclosed. The method can include the following steps: a1, conducting AC magnetization on a to-be-tested structure by using an AC magnetic field with preset frequencies and strengths, and acquiring the excitation magnetic field signals in at least one cycle; a2, subtracting the excitation magnetic field signals in at least one cycle of a stress-free sample having the same material as the to-be-tested structure from the excitation magnetic field signals acquired in step a1 to obtain a stress-induced magnetic field signals of the to-be-tested structure; a3, quantitatively assessing the stresses in the to-be-tested structure by comparing the mean values of the stress-induced magnetic field signals acquired in step a2 with the pre-calibrated relationship of stresses and the mean values of the stress-induced magnetic field signals for the material of the to-be-tested structure.

Abstract: The present disclosure pertains to systems and methods to selectively interrupt a communication link. In one embodiment, a system may comprise a first communication port and a second communication port, each of which comprises a plurality of differential pairs of electrical wires. A control select circuit may be in communication with the first communication port and the second communication port and may comprise a plurality of solid-state switches operable to transition between a first configuration and a second configuration. In the first configuration the differential pairs of electrical wires are electrically connected to corresponding differential pairs of electrical wires in the second communication port. In the second configuration, the differential pairs of wires are shunted through a resistor to dissipate energy associated with an electrical signal. A control port may be operable to cause the plurality of solid-state switches to transition between the first configuration and the second configuration.

Abstract: The present invention comprises a radio frequency modem with a precision timebase that utilizes a novel method of scheduling tasks to minimize average power draw of the system and extend life while running on limited power supplies. Additionally, the invention may optionally utilize the time base required for frequency hopping or spread spectrum communications as the basis for these higher powered tasks.

Abstract: A semiconductor device package includes a first semiconductor device having a first surface, an interconnection element having a surface substantially coplanar with the first surface of the first semiconductor device, a first encapsulant encapsulating the first semiconductor device and the interconnection element, and a second semiconductor device disposed on and across the first semiconductor device and the interconnection element.

Abstract: A semiconductor device package is provided, which includes a semiconductor device, a redistribution layer, an under bump metallurgy (UBM) structure, a passivation layer and a protection layer. The semiconductor device has an active surface. The redistribution layer is disposed on the active surface of the semiconductor device and electrically connected to the semiconductor device. The UBM structure is disposed on the redistribution layer. The passivation layer is disposed on the redistribution layer and surrounding the UBM structure and having a first surface. The protection layer is disposed on the redistribution layer and having a first surface. The first surface of the passivation layer is substantially coplanar with the first surface of the protection layer.

Abstract: A substrate includes a first dielectric layer having a first surface and a second dielectric layer having a first surface disposed adjacent to the first surface of the first dielectric layer. The substrate further includes a first conductive via disposed in the first dielectric layer and having a first end adjacent to the first surface of the first dielectric layer and a second end opposite the first end. The substrate further includes a second conductive via disposed in the second dielectric layer and having a first end adjacent to the first surface of the second dielectric layer. A width of the first end of the first conductive via is smaller than a width of the second end of the first conductive via, and a width of the first end of the second conductive via is smaller than the width of the first end of the first conductive via.