Abstract: A system for rapidly heating a vehicle engine when the engine is below a pre-determined temperature allows for improved fuel efficiency after a vehicle cold-start. The system includes an organic Rankine cycle (ORC) loop having a two-phase ORC fluid traveling circuitously through a conduit. The ORC fluid is vaporized by a power electronics cooling device and by an evaporator in thermal communication with exhaust waste heat. The vaporized ORC fluid is passed through an expander to generate electrical power. When the vehicle engine is below the pre-determined temperature, heat from the vaporized ORC fluid is transferred directly or indirectly to the engine. When the vehicle engine is at or above the pre-determined temperature, heat from the vaporized ORC fluid is instead transferred to an alternate heat sink.

Abstract: A device that provides for the non-invasive data monitoring of analog IO of a Programmable Logic Controller (PLC) system. The output is ultimately displayed on an interface in real-time and is measured directly from the IO channel. This type of device allows the accurate reading and analysis of errors and erroneous data within a device and transmission of said data to disparate secondary devices for use.

Abstract: A laser welding member that has a high laser transmittance at a welding region and exhibits an excellent laser welding processability, and a molded article obtained by laser welding using this laser welding member. The laser welding member is obtained by injection molding of a thermoplastic polyester resin material, wherein a region to be laser welded in the member is at a location separated by a distance of at least 15 mm from a gate of an injection molding mold and has at least 30% of a light transmittance of laser light with a wavelength of 940 nm.

Abstract: A step hitch assembly providing a platform surface elevated from the ground level of a vehicle for facilitating access to a rooftop surfaces and elevated objects on or about the rooftop surface including a trailer hitch member attachable to a vehicle hitch receiver, a step platform having at least two substantially planar surfaces in substantially parallel alignment adjoined by a transverse panel to thereby define a space therebetween fastenable to the vehicle hitch receiver in alternative horizontally and vertical orientations and having a plurality of corresponding transverse spaced perforations sized and spaced in transverse alignment for detachable coupling of a tow accessory hitch receiver having receiver holes to corresponding spaced perforations and a locking member capable of alternatively securing the hitch receiver in an extended position wherein the hitch receiver ball protrudes from the step platform or in a retracted position wherein the tow accessory hitch receiver ball is retracted in the space

Abstract: There is provided a light curing molding ink set used for a manufacturing method for light curing molding using an ink-jet scheme, comprising a combination of a resin composition for a modeling material used for shaping the modeling material and a resin composition for a supporting material used for shaping the supporting material, wherein surface tension Mt (mN/m) of the resin composition for a modeling material is greater than surface tension St (mN/m) of the resin composition for a supporting material, and the surface tension Mt and the surface tension St satisfy the [0<Mt?St<5] expression, and this light curing molding ink set can afford a light cured article having the good dimensional accuracy.

Abstract: The present disclosure relates to a semiconductor device package. The semiconductor device package includes a substrate, a support structure, an electronic component and an adhesive. The support structure is disposed on the substrate. The electronic component is disposed on the support structure. The adhesive is disposed between the substrate and the electronic component and covers the support structure. A hardness of the support structure is less than a hardness of the electronic component.

Abstract: A semiconductor device package includes a substrate, a package body, a conductive layer, a dielectric layer, a magnetic layer, a first insulating layer and a coil. The package body is disposed on the substrate. The package body has a first part and a second part disposed above the first part. The conductive layer is disposed on the first part of the package body and is electrically connected to the substrate. The dielectric layer is disposed on the conductive layer. The magnetic layer is disposed on the dielectric layer. The first insulating layer is disposed on the magnetic layer. The coil is disposed on the first insulating layer. The coil has a first terminal electrically connected with the magnetic layer.

Abstract: An optical device includes a carrier including a light transmitting layer and a light shielding layer disposed on the light transmitting layer. The optical device further includes a light emitter disposed on the carrier and a light detector disposed on the carrier. The optical device further includes a light transmitting encapsulant encapsulating the light emitter and the light detector, and a light shielding wall disposed in the light transmitting encapsulant and in contact with the light transmitting encapsulant and the light shielding layer.

Abstract: A step motor comprises both a rotor and a stator winding assembly. The rotor has a plurality Nr of rotor teeth. The rotor fits within the stator winding assembly and is seated by bearings on an axial shaft to rotate within the stator winding assembly. The stator winding assembly includes a stator with a plurality of stator poles and is wound with coils that can be driven in a series of phases to magnetically interact with the rotor. Each stator pole has a plurality of stator teeth. The total number Ns of stator teeth on all poles of the stator is equal to or greater than the number of rotor teeth (Ns?Nr) to deliver more torque. Various embodiments of two-phase, three-phase and five-phase bipolar step motors having 8, 9 and 10 stator poles, respectively, and different numbers of teeth are provided, including two embodiments with nonuniform stators.

Abstract: An optical fiber interrogator for interrogating optical fiber that includes fiber Bragg gratings (“FBGs”). The interrogator includes a light source operable to emit phase coherent light, amplitude modulation circuitry optically coupled to the light source and operable to generate pulses from the light, and control circuitry communicatively coupled to the amplitude modulation circuitry that is configured to perform a method for interrogating the optical fiber. The method includes generating a pair of light pulses by using the amplitude modulation circuitry to modulate light output by the light source without splitting the light.

Abstract: A cargo transport system includes a cassette for transporting a workpiece and dolly for transporting the cassette. The dolly includes a dolly frame and at least one wheel attached to the dolly frame for supporting the dolly on a surface. A track plate is attached to the dolly frame. The cassette is moveably mountable on the dolly and includes a cassette frame having first and second cassette conveyors engagable with the dolly for moveably supporting the cassette on the dolly. A first drive wheel is attached to the cassette frame between the first and second cassette conveyors. The first drive wheel is rotatable about a first axis of rotation and is operable for moving the cassette along a path-of-travel relative to the dolly. A location of the first axis of rotation is continuously adjustable relative to the cassette frame as the cassette moves along the path-of-travel.

Abstract: The present invention relates to methods and system configured to convert algal biomass into biofuels, alcohols, nutrients, biochar, chemical building block compounds, and/or other useful by-products. Exemplary methods include an integrated biochemical and thermochemical process that provides high purity biofuels and mixed alcohols, while minimizing waste and/or maximizing efficiency.

Abstract: Ray tracing can be used to detect hidden obstacles in an external environment of a vehicle. An outbound sensor signal can be transmitted into an external environment of the vehicle. The outbound sensor signal can be a LIDAR sensor signal. If a return sensor signal is not received for the outbound sensor signal, it can be determined whether an obstacle is located along a projected path of the outbound sensor signal. Such a determination can be made using one or more maps, such as a terrain map and/or a static obstacle map. Responsive to determining that an obstacle is located along the projected path of the outbound sensor signal, a driving maneuver for the vehicle relative to the obstacle can be determined. The vehicle can be caused to implement the determined driving maneuver.

Abstract: A fire protection sprinkler system and method of inerting a fire protection sprinkler system includes connecting an inerting system to the piping network of a fire protection sprinkler system having a piping network and at least one sprinkler head connected with the piping network. The inerting system includes an inert gas source that is adapted to supply inert gas to the piping network and an inerting gas vent assembly. The gas vent assembly has a gas vent adapted to discharge gas, a solenoid and a control. The solenoid is adapted to selectively open the gas vent and to close the gas vent. The gas vent discharges gas when the solenoid opens the gas vent and does not discharge gas when the solenoid closes the gas vent. The control is adapted to operate the solenoid in a manner that allows the gas vent to discharge gas for a limited amount of time.

Abstract: A part processing apparatus and method is disclosed that includes a media-blasting apparatus and a cleaning apparatus. The media-blasting apparatus is configured to blast a stream of media against a surface of a part, and the cleaning apparatus is configured to clean debris or particles from the surface of the part. The cleaning apparatus includes a first spray-and-wash unit, a first ultrasonic wash unit, a second ultrasonic wash unit, and a second spray-and-wash unit, which may be arranged in the listed order. Each of the units may be configured to utilize hot liquid or water to clean the part being processed. The first ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the first ultrasonic wash unit at a first frequency, and the second ultrasonic wash unit is configured to ultrasonically vibrate a liquid in the second ultrasonic wash unit at a second frequency.

Abstract: A downhole system comprises a main sensor, such as a gamma sensor, and a backup sensor. The backup sensor may be of a different type from the main sensor. In some embodiments the backup sensor is a high reliability sensor that may have a different sensitivity from the main sensor. The system operates both the main and backup sensors and generates calibration data for the backup sensor. If the main sensor fails the calibration data may be applied to process data from the backup sensor to yield an estimate of the data that the main sensor would have yielded if it had remained operational. The calibration data may compensate for temperature variations and/or temporal drift, for example.

Abstract: Provided are urea manufacturing method and apparatus, which can increase the conversion ratio into urea and to reduce the consumption of steam. The temperature of the reactor is increased by introducing the entire amount of raw material ammonia and introducing a portion of the decomposed gas from the stripper into the reactor. The raw material ammonia is preferably heated using the steam condensate generated in the purification step, and/or the steam generated by the heat of condensation of the decomposed gas and the unreacted substances in the condensation step. The heating temperature is preferably between 70 and 140° C.

Abstract: A semiconductor device package includes a first circuit layer, at least one electrical element, a first molding layer, an electronic component and a second molding layer. The at least one electrical element is disposed over a first surface of the first circuit layer and electrically connected to the first circuit layer. The first molding layer is disposed over the first surface of the first circuit layer. The first molding layer encapsulates an edge of the at least one electrical element, and a lower surface of the first molding layer and a lower surface of the at least one electrical element are substantially coplanar. The electronic component is disposed over a second surface of the first circuit layer and is electrically connected to the first circuit layer. The second molding layer is disposed over the second surface of the first circuit layer and encapsulates the electronic component.

Abstract: A method for fabricating a multi-layer porous wick structure including, providing a first mold set comprising a negative mold and a positive mold, introducing metal particles in the negative mold defining a first porous wick layer, and sintering the metal particles within the negative mold while interfaced with the positive mold to form the first porous wick layer. The method further includes providing a second mold set comprising a negative mold and a positive mold corresponding to the negative mold and assembling the first porous wick layer with the negative mold of the second mold set. The method further includes introducing filler particles into the negative mold of the second mold set to form a sacrificial layer with the first porous wick layer, introducing metal particles in the negative mold of the second mold set with the first porous wick layer and the sacrificial layer and sintering the metal particles, thereby forming the multi-layer porous wick structure.