Abstract: A communication device for receiving an interrogation signal at a first carrier frequency and for transmitting a response signal at a second carrier frequency is disclosed. The interrogation signal comprises the first carrier frequency modulated at the second carrier frequency. The communication device includes a sensor coupled to a demodulator. The sensor receives a low frequency input used to further modulate the interrogation signal. The demodulator demodulates the low frequency input from the first carrier frequency to thereby generate the response signal comprising the second carrier frequency and the low frequency input. The demodulator preferably includes a pyroelectric demodulator, a piezoelectric demodulator, or a detector diode. The demodulator preferably has a frequency response less than the first carrier frequency but greater than the second carrier frequency.

Abstract: A novel tubular or profile shapes of co-extruded multilayer polymers. These materials contain tens to thousands of layers of milli-, micro- to nano-polymer layers. These new shapes contain contiguous layers of milli- to nano-polymer layers in three dimensions and these contiguous layers may be twisted or turned to further expand the potential microlayer geometries.

Abstract: In order to provide a method for producing a molded article by means of which a molded article with good temperature resistance is easily producible, it is proposed that the method includes providing a mixture including a powdered base material which includes a pre-fired and/or ground cordierite material and/or a pre-fired and/or ground mullite material; producing a molded article by molding the mixture; and firing the molded article so that particles of the base material are bonded to one another while preserving the particulate property.

Abstract: The present disclosure relates to a semiconductor package structure and a method of manufacturing the same. The semiconductor package structure includes a semiconductor substrate having a first surface and a second surface opposite the first surface. The semiconductor substrate has a space extending from the second surface to the first surface and an insulation body is disposed in the space. The semiconductor package structure includes conductive posts in the insulation body.

Abstract: In one or more embodiments, a substrate includes a patterned conductive layer and a reference layer. The patterned conductive layer includes a pair of first conductive traces, a pair of second conductive traces and a reference trace between the pair of first conductive traces and the pair of second conductive traces. The reference layer is above the patterned conductive layer and defines an opening.

Abstract: An injection apparatus including a plasticizing unit (2) that plasticizes a raw material resin and an injection unit (3) that injects a plasticized molten resin. The plasticizing unit includes a heating cylinder (20) having a foaming gas injection valve and a screw (21) provided inside the heating cylinder. The rotation and advance and retreat movements of the screw are controlled such that a raw material resin is plasticized by the screw and a foaming gas injected from a foaming gas injection valve is dissolved in the plasticized molten resin. After the screw retreats to a prescribed position according as the molten resin accumulates in the front end side of the heating cylinder by the screw that is rotating, the screw advances with rotating to cause the molten resin which has been accumulated in the front end side of the heating cylinder to be transferred to the injection unit.

Abstract: A vapor chamber includes a wick structure created by an additive selective laser sintering process. The wick structure includes a substrate, a first copper powder layer, a second copper powder layer, and a plurality of additional layers. The first copper powder layer is deposited across the substrate, wherein the first copper powder layer is subsequently selectively fused via a fusing instrument. The second copper powder layer is deposited across the first copper powder layer, wherein the second copper powder layer is subsequently selectively fused via the fusing instrument. Additionally, a plurality of additional copper powder layers are deposited wherein each additional layer is deposited on the previous layer, wherein each of the additional copper powder layers is selectively fused with a predetermined structure.

Abstract: A solar tracking device having: a primary optical sensor (30); at least two auxiliary optical sensors (70a, 70b); and a housing. The housing has an upper surface (80) with a central hole (100; 62; 82) below which the primary sensor (30) is disposed and light wells (22; 25), disposed laterally around the central hole (100; 62; 82), in which each of the respective auxiliary sensors (70a, 70b) is disposed. Each light well (22; 25) has a bottom surface (15) on which the associated auxiliary sensor (70a, 70b) is disposed, an aperture (84) in the upper surface, and sidewalls (22) connecting the upper surface and the bottom surface. One of the sidewalls (22) is a light-reflective surface (25) disposed parallel to a tangent of the central hole, all other sidewalls being light-absorbing.

Abstract: A carrier wave generating unit for generating a carrier wave signal; a modulating unit for generating a modulated wave signal by performing amplitude modulation on the carrier wave signal generated by the carrier wave generating unit with an audio signal; an adding unit for adding the carrier wave signal generated by the carrier wave generating unit and the modulated wave signal generated by the modulating unit to generate a signal; an ultrasonic emitter for emitting the signal generated by the adding unit, and an ultrasonic emitter arranged on the central axis of the ultrasonic emitter and ahead of the emitting surface of the ultrasonic emitter, for emitting the carrier wave signal generated by the carrier wave generating unit in the same direction as the emitting direction of the ultrasonic emitter are included, wherein the phase of the carrier wave signal emitted by the ultrasonic emitter is opposite to that of the carrier wave signal included in the signal emitted by the ultrasonic emitter.

Abstract: A fluid permeable member includes a support body provided in a lower portion thereof with a support plate having a fluid permeable through-hole, and a fluid permeable anodic oxide film disposed on the support plate.

Abstract: A method and system for language selection and synchronization in a vehicle are provided. The method includes receiving an audio representative of sounds captured within a vehicle, recognizing a language category for propagating information to a user of the vehicle according to the received audio, selecting the language category of the vehicle system according to the recognized language category in response to receiving a user acknowledgment, synchronizing the language category among a plurality of vehicle systems, and propagating information to the user of the vehicle using the synchronized language category.

Abstract: According to an embodiment of the disclosure, an apparatus for a flow of fluid includes a first and a second element that form an exponentially changing restriction between them for a flow of a fluid. At least one of the first and second elements is configured to move in response to changing pressures to change the restriction. One of the first and second elements includes a wall with one or more cutouts that have an admittance that changes exponentially with respect to the movement of the first or second element.

Abstract: A poppet valve assembly for a high-speed compressor, the poppet valve assembly including a cage that includes a plurality of counter bores disposed therein. The poppet valve assembly further includes a plurality of poppets, each poppet having a stem and a head. The head of each poppet has a maximum diameter that is less than approximately 0.75 inches. The stem of the poppet is disposed in each of said counter bores. The poppet valve assembly also includes a seat plate overlying said cage, said seat plate including a plurality of through bores axially aligned with the counter bores of the cage. Each through bore is sized to have a smaller diameter than the maximum diameter of the head. A lift spacer is disposed in each of the counter bores.

Abstract: A substrate including a dielectric layer and a patterned conductive layer adjacent to the dielectric layer is provided. The patterned conductive layer comprises a first conductive pad, the first conductive pad comprises a first portion having a first concave sidewall. The substrate further includes a protection layer disposed on the patterned conductive layer, and the protection layer covers the first portion of the first conductive pad.

Abstract: A semiconductor device package includes a semiconductor device, a conductive bump, a first encapsulant and a second encapsulant. The semiconductor device has a first surface, a second surface and a lateral surface. The second surface is opposite to the first surface. The lateral surface extends between the first surface and the second surface. The semiconductor device comprises a conductive pad adjacent to the first surface of the semiconductor device. The conductive bump is electrically connected to the conductive pad. The first encapsulant covers the first surface of the semiconductor device and a first portion of the lateral surface of the semiconductor device, and surrounds the conductive bump. The second encapsulant covers the second surface of the semiconductor device and a second portion of the lateral surface of the semiconductor device.

Abstract: A substrate for packaging a semiconductor device includes a first dielectric layer having a first surface and a second surface opposite to the first surface, a first patterned conductive layer adjacent to the first surface of the first dielectric layer, and a second patterned conductive layer adjacent to the second surface of the first dielectric layer and electrically connected to the first patterned conductive layer. The first patterned conductive layer includes a first portion and a second portion. Each of the first portion and the second portion is embedded in the first dielectric layer and protrudes relative to the first surface of the first dielectric layer toward a direction away from the second surface of the first dielectric layer. A thickness of the first portion of the first patterned conductive layer is greater than a thickness of the second portion of the first patterned conductive layer.

Abstract: Monitoring a health status of a current interruption device, such as a circuit breaker, is disclosed herein. For example, a device for monitoring a current interruption device may include a processor and a memory. The processor may execute instructions stored in the memory to cause the processor to monitor one or more current measurements of current from an electrical conductor that delivers electrical energy to a load. The processor may provide a signal indicating a health status of the current interruption device based at least in part on the one or more current measurements.

Abstract: According to the overload current limiting method for a voltage source converter, when a pole control system receives a water-cooling overload current limiting instruction, an active and reactive instruction are changed at the same time according to a specified slope, so that an absolute value of an arm current of the converter decreases in a fixed slope, and can be ensured that active power and reactive power fall to zero at the same time, and a water-cooling load limiting aim of the converter can be achieved by reducing the arm current. After a water-cooling overload power limiting instruction received by the pole control system is cancelled, a current value of the active power and the inactive power remain unchanged. When a water-cooling overload power limiting instruction is received again, decrease continues on the basis of current power values until the power falls to zero.

Abstract: Provided is a polyamide resin composition capable of yielding highly abrasion-resistant molded article, while keeping high mechanical strength, and, a molded article using the polyamide resin composition. The polyamide resin composition contains (A) polyamide resin, (B) polyolef in wax, and (C) at least one metal salt selected from alkali metal salt and alkali earth metal salt, and the (A) polyamide resin contains (a-1) semiaromatic polyamide resin.

Abstract: A layer protecting the surface of zirconium alloys used as materials for nuclear reactors is formed by a homogenous polycrystalline diamond layer prepared by chemical vapor deposition method. This diamond layer is 100 nm to 50 ?m thick and the size of the crystalline cores in the layer ranges from 10 nm to 500 nm. Maximum content of non-diamond carbon is 25 mol %, total content of non-carbon impurities is maximum up to 0.5 mol %, RMS surface roughness of the polycrystalline diamond layer has a value less than 40 nm and thermal conductivity of the layer ranges from 1000 to 1900 W?m?1?K?1. Coating of the zirconium alloys surface with the described polycrystalline diamond layer serves as a zirconium alloys surface protection against undesirable changes and processes in the nuclear reactor environment.