Patents Assigned to Engineering
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Patent number: 10155674Abstract: The disclosure is directed to a surface having a binding component applied thereto for the adsorption or capture of pathogens and organic molecules or materials. The surface may be a component of a porous or nonporous substrate. The binding component may also bind a photocatalyst to the surface for photocatalytic destruction of the captured pathogens and organic molecules or materials.Type: GrantFiled: December 19, 2012Date of Patent: December 18, 2018Assignee: National Technology & Engineering Solutions of Sandia, LLCInventors: Thomas Austin Stewart, May D. Nyman
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Patent number: 10155255Abstract: A method for storing hazardous materials within a pile by installing a drill casing a perforated casing section into a well installed in the pile, inserting a pipe or hose having an opening into the drill casing, aligning the opening of the pipe or hose with at least one perforated casing section, sealing the drill casing to isolate air or fluid flowing into or out of the drill casing so that the air or fluid only flows into or out of the drill casing through the at least one perforated casing section, pulling or pushing air or fluid through the pipe or hose at a pressure sufficient to open void spaces within the pile, and injecting hazardous materials through the pipe or hose at pressure sufficient to cause the hazardous materials to fill the void spaces.Type: GrantFiled: November 2, 2016Date of Patent: December 18, 2018Assignee: DIFFERENTIAL ENGINEERING INC.Inventor: Thomas Joseph Seal
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Patent number: 10155192Abstract: A system and process for selectively separating H2S from a gas mixture which also comprises CO2 is disclosed. A water recycle stream is fed to the absorber in order to create a higher concentration absorbent above the recycle feed and having a greater H2S selectivity at lower acid gas loadings, and a more dilute absorbent below the recycle feed and having a greater H2S selectivity at higher acid gas loadings. Also disclosed is a system and process for selectively separating H2S by utilizing two different absorbents, one absorbent for the upper section of the absorber, tailored to have a greater H2S selectivity at lower acid gas loadings, and a second absorbent for the lower section of the absorber, tailored to have a greater H2S selectivity at higher acid gas loadings.Type: GrantFiled: June 1, 2016Date of Patent: December 18, 2018Assignee: EXXONMOBIL RESEARCH AND ENGINEERING COMPANYInventors: Carla S. Pereira, Michael Siskin, Himanshu Gupta
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Patent number: 10158254Abstract: A resonant coupling power transmission system includes a resonance type power transmission device 1 having a resonance type power supply 11 to supply power, and a resonance type transmission antenna 13 to transmit the power supplied by the resonance type power supply 11, and a resonance type power reception device 2 having a resonance type reception antenna 21 to receive the power transmitted by the resonance type transmission antenna 13, and a reception circuit 23 to supply the power received by the resonance type reception antenna 21 to a load, and the characteristic impedance of each of the functional units is set in such a way that there is provided a correlation among the resonance characteristic value of the resonance type power supply 11, that of the resonance type transmission antenna 13, and that of the resonance type power reception device 2.Type: GrantFiled: September 2, 2014Date of Patent: December 18, 2018Assignee: Mitsubishi Electric Engineering Company, LimitedInventors: Yoshiyuki Akuzawa, Kiyohide Sakai, Toshihiro Ezoe
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Patent number: 10157855Abstract: The present disclosure relates to a semiconductor device package and a manufacturing method thereof. The semiconductor device package includes a carrier, at least one electronic component, a first magnetic layer and a second magnetic layer. The carrier has a top surface on which the electronic component is disposed. The first magnetic layer is disposed on the top surface of the carrier and encapsulates the electronic component. The second magnetic layer is disposed on the first magnetic layer and covers a top surface and a lateral surface of the first magnetic layer. A permeability of the first magnetic layer is less than a permeability of the second magnetic layer.Type: GrantFiled: June 3, 2015Date of Patent: December 18, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Wei-Hsuan Lee, Chien-Yeh Liu, Sung-Mao Li, Jaw-Ming Ding
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Patent number: 10157817Abstract: A cooling structure includes a first substrate layer including an array of cooling channels, a second substrate layer including a nozzle structure, an outlet manifold, and an outlet, a third substrate layer including an inlet, and inlet manifold, and one or more flow directing features are disposed within the inlet manifold. The one or more flow directing features include one or more micro-pillars extending into the cooling fluid flow path from the inlet manifold, the first substrate layer includes one or more first substrate layer through-holes, the second substrate layer includes one or more second substrate layer-through holes, and the third substrate layer includes one or more third-substrate layer through holes. The first substrate layer through-holes, the second substrate layer through-holes, and the third substrate layer through-holes are aligned into one or more TSVs and metallized.Type: GrantFiled: January 26, 2018Date of Patent: December 18, 2018Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Feng Zhou, Ercan M. Dede
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Patent number: 10155374Abstract: A printing method for carrying out printing with respect to various printing target objects through a more appropriate method using an inkjet head, the printing method including a screen preparing step of preparing a mesh-like screen, an ink discharging step of discharging an ink droplet from the inkjet head to one surface of the screen, a viscosity increasing step of enhancing a viscosity of the ink on the screen, an ink push-in step of pushing the ink with enhanced viscosity from the one surface side toward other surface side of the screen, the step including pushing in the ink while a medium, or a target object of printing, and the other surface of the screen are making contact to attach the ink with enhanced viscosity to the medium, and an ink fixing step of fixing the ink attached to the medium to the medium.Type: GrantFiled: March 17, 2016Date of Patent: December 18, 2018Assignee: MIMAKI ENGINEERING CO., LTD.Inventor: Masaru Ohnishi
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Patent number: 10156402Abstract: The present disclosure is directed to systems, devices and methods for cooling a surface with a plurality of ejectors. The fluid provided to the micro-ejectors includes vapor formed at the surface. The vapor provides the driving force for driving fluid through the micro-ejectors.Type: GrantFiled: October 12, 2016Date of Patent: December 18, 2018Assignee: National Technology & Engineering Solutions of Sandia, LLCInventor: Matthew David Carlson
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Patent number: 10155022Abstract: The disclosure relates to a fat accumulation inhibitory peptide which essentially comprises an amino acid sequence represented by SEQ ID NO: 1, a pharmaceutical composition for preventing or treating obesity, which contains the peptide, and a health functional food for preventing or alleviating obesity, which contains the peptide. The fat accumulation inhibitory peptide according to the present invention has the function of inhibiting the differentiation of mesenchymal stem cells into adipocytes to thereby inhibit the accumulation of adipose tissue. Thus, the peptide according to the present invention is highly useful for the prevention or treatment of obesity.Type: GrantFiled: August 1, 2017Date of Patent: December 18, 2018Assignees: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION, NANO INTELLIGENT BIOMEDICAL ENGINEERING CORPORATION CO. LTD.Inventors: Chong-Pyoung Chung, Yoon Jeong Park, Jue-Yeon Lee, Jin Sook Suh, In Ho Jo, Yoon Shin Park
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Patent number: 10155282Abstract: In a friction stir welding method, a pair of plate materials is arranged opposing one another such that the ends thereof are butted together, after which friction stir welding is performed. A first shoulder is arranged at one surface of the pair of plate materials and a second shoulder is arranged at the other surface of the plate materials to sandwich therebetween a joint to be formed by friction stirring of the end parts of the plate materials, and the first shoulder and the second shoulder are rotated, thereby friction stirring the joint of the pair of plate materials. As the joint is friction stirred, the first shoulder and the second shoulder are moved from the other surface toward the one surface of the plate materials, thereby forming at the joint a protruding part protruding from the one surface of the plate materials as the friction stir welding is performed.Type: GrantFiled: July 15, 2014Date of Patent: December 18, 2018Assignee: MITSUBISHI HEAVY INDUSTRIES ENGINEERING, LTD.Inventor: Yoshinori Kato
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Patent number: 10156102Abstract: A gap sub has electrically-conductive parts held together by electrical insulators which engage in channels formed in the parts. The electrical insulators hold the parts in a spaced-apart electrically-insulated relationship. In some embodiments, the electrical insulators are removable to allow separation of the parts. An insulating oil or other fluid may fill the gap.Type: GrantFiled: May 8, 2015Date of Patent: December 18, 2018Assignee: Evolution Engineering Inc.Inventors: Patrick R. Derkacz, Aaron W. Logan, Justin C. Logan
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Patent number: 10155665Abstract: Methods are provided for synthesis of various types of zeolites using synthesis mixtures that contain a dominant structure directing agent and one or more secondary structure directing agents. Advantageously, the secondary structure directing agents may substantially not alter the crystal structure and/or morphology of the crystals generated by a synthesis mixture in the presence of the dominant structure directing agent.Type: GrantFiled: October 20, 2015Date of Patent: December 18, 2018Assignee: EXXONMOBIL RESEARCH AND ENGINEERING COMPANYInventors: Wenyih Frank Lai, Nicholas S. Rollman, Jenna L. Walp, William W. Lonergan
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Patent number: 10156114Abstract: A subsea connection system for connecting to a hub has a body with an interior passageway, a collet having a plurality of collet segments, an outer sleeve overlying the collet, and a poppet valve assembly positioned within the interior passageway of the body. The plurality of collet segments are movable between a locked position and an unlocked position. The poppet valve assembly is movable between an open position and a closed position in which the open position allows a fluid to flow through the interior passageway and the closed position blocks a flow of fluid through the interior passageway. The outer sleeve is movable so as to cause the plurality of collet segments to join to a hub.Type: GrantFiled: May 15, 2017Date of Patent: December 18, 2018Assignee: TRENDSETTER ENGINEERING, INC.Inventors: Jeffrey Partridge, Brent Cox
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Patent number: 10158104Abstract: A casing for a battery assembly may include a first casing portion having a first base portion and a pair of first leg portions extending generally perpendicularly to the first base portion. At least one of the first leg portions may have a flared end. The casing may further include a second casing portion with a second base portion and a pair of second leg portions extending generally perpendicularly to the second base portion. At least one of the second leg portions may have a flat end. The casing portions are attached at a joint including the flat end attached to the flared end. In some embodiments, a battery assembly may include at least one power cell and a casing including a first casing portion and a second casing portion attached together at a joint. The joint may be under tension. The casing applies pressure to the power cell.Type: GrantFiled: July 21, 2017Date of Patent: December 18, 2018Assignee: SWIFT ENGINEERING, INC.Inventors: Andrew Streett, Matthew Barrientos
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Patent number: 10156139Abstract: The present invention relates to an apparatus for soil disturbance at the back of a shield tunnel, wherein: the apparatus is formed by a fitting I and a fitting II connected by means of three bolts that form equal angles; the fitting I is a short circular pipe; an end surface of a fitting end of the fitting I is provided with a water passage; a pipe wall of the pipe is provided with 2-8 water spouts; the fitting II is a long circular pipe whose inner and outer diameters are consistent with those of the fitting I; a fitting end of the fitting II is provided with two O-shaped water stop rings; a pipe wall of the fitting II is provided with three water inlets that form equal angles and are in communication with the water passage of the fitting I.Type: GrantFiled: August 23, 2016Date of Patent: December 18, 2018Assignee: POWERCHINA HUADONG ENGINEERING CORPORATION LIMITEDInventors: Wenhua Chen, Jing Hou, Jie Zhang, Yangchun Dai, Kewei Cui
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Patent number: 10156044Abstract: An intersecting track includes: two main tracks; a pair of first guide portions disposed in the main tracks and guide a pair of first guide wheels of the vehicle; a pair of crossover tracks disposed over the main tracks to intersect each other; a second guide portion disposed inside each of the pair of crossover tracks and guides a second guide wheel; a switching portion that switches a direction of the vehicle to a direction along the main tracks and a direction along the crossover track; and a switching device disposed in an intersecting area of the second guide portions in the pair of crossover tracks, selectively switches a direction to a direction along one of the second guide portions and a direction along the other of the second guide portions, and guides the second guide wheel in any one of the directions.Type: GrantFiled: February 18, 2015Date of Patent: December 18, 2018Assignee: MITSUBISHI HEAVY INDUSTRIES ENGINEERING, LTD.Inventors: Kosaku Murase, Eisuke Okano, Yutaka Doi
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Patent number: 10157821Abstract: A semiconductor package includes: a substrate including a conductive pad; a semiconductor device including a conductive member; and a connection element between the conductive pad and the conductive member, wherein the connection element has a sidewall, and an angle of the sidewall relative to the conductive pad is equal to or less than about 90 degrees.Type: GrantFiled: May 30, 2017Date of Patent: December 18, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Chao Cheng Liu
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Publication number: 20180357186Abstract: A number of software routines comprising at least two software routines are created for an interface unit of a computer system having a first and a second interface processor for forwarding input data from a peripheral to a processor of the computer system on which software is programmed. A first subset of the software routines is assigned to a first category provided for task-synchronous data transfer, and a second subset of the software routines are assigned to a second category provided for continuous data transfer. The first interface processor is programmed with the first subset and the second interface processor with the second subset of software routines. During execution of the software, the first subset is cyclically executed by the first interface processor at a first cycle rate, and the second subset is cyclically executed by the second interface processor at a second cycle rate.Type: ApplicationFiled: June 1, 2018Publication date: December 13, 2018Applicant: dSPACE digital signal processing and control engineering GmbHInventors: Matthias FROMME, Jochen SAUER, Matthias SCHMITZ
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Publication number: 20180358291Abstract: A method for manufacturing a semiconductor device package includes providing a substrate having a first surface and a second surface opposite to the first surface; disposing a passive component layer on the first surface of the substrate; after disposing the passive component layer, forming at least one via in the substrate, wherein the via penetrates the substrate and the passive component layer; and disposing a conductive layer on the passive component layer and filling the via with the conductive layer.Type: ApplicationFiled: June 8, 2017Publication date: December 13, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien-Hua CHEN, Sheng-Chi HSIEH, Cheng-Yuan KUNG
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Publication number: 20180358501Abstract: A semiconductor package device comprises a substrate, a light emitter, a light detector and a transparent conductive film. The substrate as a first surface and a second surface opposite to the first surface. The light emitter is disposed on the first surface of the substrate and has a light emission area adjacent to the first surface of the substrate. The light detector is disposed on the first surface of the substrate and has a light receiving area adjacent to the first surface of the substrate. The transparent conducting film is disposed on the second surface of the substrate.Type: ApplicationFiled: June 9, 2017Publication date: December 13, 2018Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Cheng-Ling HUANG, Ying-Chung CHEN
