Abstract: A strong-magnetic focused magnet system with a terahertz source includes a first superconducting main coil and a second superconducting main coil. The second superconducting main coil surrounds the outer surface of the first superconducting main coil, and the second superconducting main coil is coaxial with the first superconducting main coil.

Abstract: A system for improving performance or efficiency of operation of a vehicle. The system includes a sensor configured to detect current vehicle speed data and current vehicle slope data. The system includes a pedal control unit configured to detect current pedal position data. The system includes an electronic control unit (ECU) configured to determine expected driving power demand based on current vehicle speed data and vehicle slope data. The ECU is configured to determine detected driving power demand based on current pedal position data. The ECU is configured to detect a drafting condition when the expected driving power demand exceeds the detected driving power demand. The ECU is configured to adjust, when the drafting condition is detected, at least one of a chassis control setting, an engine control setting, a transmission control setting, or a hybrid control setting to improve performance or efficiency of operation of the vehicle.

Abstract: Described herein are various technologies pertaining to identifying counterfeit integrated circuits (ICs) by way of allowing the origin of fabrication to be verified. An IC comprises a main circuit and a test circuit that is independent of the main circuit. The test circuit comprises at least one ring oscillator (RO) signal that, when energized, is configured to output a signal that is indicative of a semiconductor fabrication facility where the IC was manufactured.

Abstract: A media conveyor mechanism for a printing apparatus includes an endless conveyor belt (BT) conveying a medium (M) in a Y direction; a belt driving unit having a first roller and a second roller which are arranged at an interval in the Y direction and parallel to an X direction, on which the conveyor belt (BT) is wrapped, and at least one of which drives the conveyor belt (BT), the first roller being fixed at a predetermined position in the Y direction, and second roller being switchable between a movable state and a fixed state; and an applying unit which applies constant equal force to both ends of the second roller in the X direction in a ?Y direction.

Abstract: An inactivation treatment apparatus includes a rotary kiln main body in which coal flows from an end side toward a tip side; a cooling tube arranged rotatably in conjunction with the rotary kiln main body and extends in the direction of the length of the rotary kiln main body, and in which cooling water can flow; and a treatment gas supply tube arranged rotatably in conjunction with the rotary kiln main body, and extends in the direction of the length of the rotary kiln main body, and can supply a treatment gas into the rotary kiln main body. In the apparatus, each of the cooling tube and the treatment gas supply tube is arranged to move past through a coal layer, which is a layer formed as the result of the sedimentation of the coal, in the rotary kiln main body when the rotary kiln main body rotates.

Abstract: The invention provides pneumatic shuttering of a focused or collimated aerosol particle stream. The aerosol stream can be collimated by an annular sheath of inert or non-inert gas. The apparatus propagates a sheathed aerosol stream through a series of aerodynamic lenses along the axis of a flow cell. The final lens is typically positioned above a substrate, so that direct material deposition is provided. A substantially perpendicularly-flowing gas external to the aerodynamic lens system is used to redirect the particle stream away from the flow axis and through an exhaust port, thereby shuttering the collimated aerosol stream. The pneumatic shutter enables printing of discreet structures, with on/off shuttering times of approximately 1 to 100 milliseconds.

Abstract: The present invention relates to a parallel image measurement method oriented to the insulating layer thickness of a radial symmetrical cable section. The method conducts the non-contact high-accuracy measurement based on the machine vision and the image analysis, adopts a GPU multi-core parallel platform for the high-speed measurement, extracts the useful information from the section image of the radial symmetrical cable, and then measures the insulating layer thickness. Compared with the prior art, the present patent can lower the time consumed for the accurate measurement, fill in the blank of the high-accuracy parallel image measurement of the insulating layer thickness of the radial symmetrical cable section in the domestic cable industry, break down the monopoly and technology blockade by related foreign manufacturers and improve the technology level of on-line testing of product quality in China, expedite the production automation progress of domestic manufacturer.

Abstract: The various technologies presented herein relate to mitigating or reducing sidelobe levels during operation of an antenna array. Power coefficients operating across an antenna array are tapered to facilitate a power concentration at central region of the antenna array while power coefficients of a lower magnitude are generated at the periphery of the antenna array. Power coefficient variation can be effected by at least one of electrical path length, number of antennas being powered in a particular antenna subarray, a number of T-splitters incorporated into an electrical path servicing an antenna, etc. Electrical coupling of a pre-T/R stripline and a post-T/R stripline can be achieved in conjunction with operation with a dielectric layer, wherein the dielectric layer acts as a dielectric at the Ku frequency band. Further, phase delay can be applied to at least one electrical signal to facilitate concurrent delivery of power across the antenna array.

Abstract: A computing system for a vehicle is provided. The computing system includes one or more processors for controlling operation of the computing system, and a memory for storing data and program instructions usable by the one or more processors. The processors are configured to execute instructions stored in the memory to determine if a vehicle fuel level or battery power level is below a predetermined threshold. If the vehicle fuel level or battery power level is below the threshold, it is determined if at least one energy conservation measure has been pre-selected by a user. If at least one energy conservation measure has been pre-selected by a user, it is determined whether or not a user approves implementation of the at least one energy conservation measure. If a user approves implementation of the at least one energy conservation measure, the at least one energy conservation measure is implemented.

Abstract: Vision-assist systems and methods include use of processor(s) and a communicatively coupled feedback device and environmental sensing device upon which generated feedback is based. Machine readable instructions stored on a memory module cause the system to perform the following when executed by the processor(s): record a first metric corresponding to a level of reliance by a user on the feedback device at a first time; record a second metric corresponding to the level of reliance by the user on the feedback device at a second time after the first time; and record an awarded amount of reliance points when the second metric is less than the first metric, indicative of a decrease on a reliance by the user on the vision-assist system. The awarded amount of reliance points corresponds to a percentage by which the second metric decreases compared to the first metric.

Abstract: A bonding structure enabling fast and reliable methods to fabricate a substantially homogeneous bondline with reduced dependency of a thickness limitation is disclosed. Also, this system creates a bondline targeted for performance in power electronics. This system is highly adaptable as various structures and fabrication options may be implemented. This enables diverse fabrication selection and creates less dependency on outside conditions. The disclosed system is at least applicable to wafer-to-wafer, die-to-wafer, die-to-substrate, or die-to-die bonding.

Abstract: An inductor includes a coil substrate, an encapsulation material containing a magnetic material and selectively covering the coil substrate, and first and second external electrodes formed on the exterior of the encapsulation material. The coil substrate includes a laminate of stacked structures each including a conductive track and first and second connection parts on opposite sides of the conductive track in a single wiring layer. The conductive tracks are connected in series to form a helical coil. The first connection parts are connected by a first via to form a first electrode terminal connected to a first end of the helical coil. The second connection parts are connected by a second via to form a second electrode terminal connected to a second end of the helical coil. The first and second external electrodes are connected to the first and second electrode terminals, respectively.

Abstract: A system and method for installing a section of heat shrink tubing on a wire is disclosed. The system includes an infeed guide that receives the continuous length of tubing and initially opens the tubing from a compressed condition. The continuous length of tubing is received in a cutting guide and cut to a desired length. After cutting, a pair of spaced support jaws move together to open the cut section of tubing. A funnel having a first opening and a second opening is moved into engagement with the section of tubing such that the second opening is received within the section of tubing. A wire is inserted into the funnel which guides the wire into the cut section of tubing. Once the wire is received within the cut section of tubing, the funnel and support jaws are removed and the wire is removed with the section of support tubing installed thereon.

Abstract: A low-cost weight-measurement and sensing system is provided. The system may include a sensor assembly configured to be mounted between a floor pan of a vehicle and a seat of the vehicle. The sensor assembly may include a plurality of sensor modules. Each sensor module of the plurality of sensor modules may be configured to sense a force applied thereupon and generate a reading representative of the force applied thereupon in response thereto to provide a plurality of sensor readings. The system may also include a control module connected to the plurality of sensor modules. The control module may be configured to determine a weight of an occupant of the seat of the vehicle based on the plurality of sensor readings.

Abstract: A sensor module for use in a low-cost weight-measurement and sensing system is provided. The sensor module may include a substrate configured to be mounted between a floor pan of a vehicle and a seat of the vehicle. The sensor module may further include a force sensing element disposed upon the substrate. The force sensing element may be configured to sense a force applied thereupon, and generate a reading representative of the force applied thereupon in response thereto to provide a sensor reading. The sensor module may also include a wiring harness connected to the force sensing element. The wiring harness may be configured to transmit the sensor reading to a control module. The substrate may define an aperture configured to surround a fastening element used to fasten the seat to the floor pan of the vehicle.

Abstract: A semiconductor process includes: applying an encapsulation material on an upper surface of a first substrate to encapsulate a die and first conductive parts, wherein the encapsulation material is a B-stage adhesive; forming a plurality of openings on the encapsulation material to expose the first conductive parts; pressing a second substrate onto the encapsulation material to adhere a lower surface of the second substrate to the encapsulation material, wherein the second substrate includes second conductive parts, and each of the first conductive parts contacts a corresponding one of the second conductive parts; and heating to fuse the first conductive parts and the corresponding second conductive parts to form a plurality of interconnection elements and solidify the encapsulation material to form a C-stage adhesive.

Abstract: A substrate structure includes a carrier, a first metal layer, a circuit layer and a dielectric layer. The carrier has a first surface and a second surface. The first metal layer is disposed on the first surface of the carrier. The circuit layer is disposed on the first metal layer. The dielectric layer covers the circuit layer and defines a plurality of openings to expose portions of the circuit layer and portions of the first metal layer.

Abstract: A fixed latency configurable tap or fixed-tap digital filter may filter a signal in a fixed amount of time, regardless of the number of taps. The filter may include one or more of a clock, a plurality of registers in a shift register, an adder, an accumulator, and/or a scaler. In at least one embodiment, a running average may be maintained as samples are received such that the latency remains fixed with a constant number of clock cycles.

Abstract: A substrate includes a first dielectric structure, a first circuit layer, a second dielectric structure and a second circuit layer. The first circuit layer is embedded in the first dielectric structure, and does not protrude from a first surface of the first dielectric structure. The second dielectric structure is disposed on the first surface of the first dielectric structure. The second circuit layer is embedded in the second dielectric structure, and is electrically connected to the first circuit layer. A first surface of the second circuit layer is substantially coplanar with a first surface of the second dielectric structure, and a surface roughness value of a first surface of the first circuit layer is different from a surface roughness value of the first surface of the second circuit layer.