Patents Assigned to Engineering
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Publication number: 20180115133Abstract: A connector assembly having a housing and a shaft; at least a groove in the housing or on the shaft; one of the housing and the shaft has a first component and a second component; there being at least a first groove configuration and a second groove configuration resulting from two different relative positions of the first and second components; the first and second groove configurations resulting in a first insertion force and a first removal force of the shaft into and from the housing and a second insertion force and a second removal force of the shaft into and from the housing, respectively.Type: ApplicationFiled: December 12, 2017Publication date: April 26, 2018Applicant: Bal Seal Engineering, Inc.Inventors: Jeff Frederick, Derek Changsrivong, Pere Pla-Junca, Peter J. Balsells, Richard Dawson
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Publication number: 20180112495Abstract: The presently disclosed technology is directed toward the removal of plugs in a pipeline segment by installing one or more clamping devices onto a pipeline. The clamping device will have the ability to access the inside of the pipeline segment and inject media designed to dissolve the plug.Type: ApplicationFiled: October 25, 2017Publication date: April 26, 2018Applicant: Stress Engineering Services, Inc.Inventors: Armando Rebello, Walter Lane Alexander, JR.
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Publication number: 20180111582Abstract: A button bridge system can include a curtain side airbag and a button bridge attached to the curtain side airbag. The button bridge can be attached to the curtain side airbag at various portions of the curtain side airbag such that a lower portion of curtain side airbag can be folded to a predetermined fold length. The lower portion of curtain side airbag and a corresponding portion of the button bridge can be stored in a storage position such that the button bridge is pulled taut when the curtain side airbag is deployed.Type: ApplicationFiled: October 24, 2016Publication date: April 26, 2018Applicant: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.Inventors: Joshua L. MOBERG, John J. LAVOIE-MAYER, John A. SCHEICK
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Patent number: 9954225Abstract: Provided is a positive electrode material for a lithium battery with an atomic ratio expressed by the formula (I) Lia(MxMn2-x)(O4-yZy) for 0.8?a?1.2, 0?x?1 and 0?y?1 in which M is one or more of Li, Na, K, Ca, Mg, Al, Ti, Sc, Ge, V, Cr, Zr, Co, Ni, Zn, Cu, La, Ce, Mn, Hf, Nb, Ta, Mo, W, Ru, Ag, Sn, Pb and Si and Z is one or more of OH, halogens, N, P, S and O, and the primary particles of the positive electrode material have a spheroidal topography. The adjacent (111) family planes of the primary particles are connected by curved surfaces without obvious edges. A preparing method of a positive electrode material for a lithium battery and a lithium battery are also provided. The positive electrode material of the present invention provides a good high-temperature cycling performance and filling capability.Type: GrantFiled: May 23, 2011Date of Patent: April 24, 2018Assignees: NINGBO INSTITUTE OF MATERIALS TECHNOLOGY AND ENGINEERING, CHINESE ACADEMY OF SCIENCES, HUBEI WANRUN NEW ENERGY TECHNOLOGY DEVELOPMENT CO. LTDInventors: Yonggao Xia, Zhaoping Liu, Yaletu Saixi
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Patent number: 9951480Abstract: Various monolithic pavers are described herein. The monolithic pavers described herein are one-piece pavers with no seams, joints, or connections. A monolithic paver can be formed via three dimensional (3D) printing or molding. The monolithic paver is designed to carry applied loads to paver support(s) via structural members of the monolithic paver. The monolithic paver is formed to include parallel structural members that are spaced with gaps there between. The parallel structural members include top flanges and webs. The parallel structural members can also include bottom flanges. Moreover, the monolithic paver can have exterior sides that have tongues and grooves formed there along; tongues can be formed along adjoining exterior sides of the monolithic paver.Type: GrantFiled: March 31, 2017Date of Patent: April 24, 2018Assignee: GILLIAM HARRIS ENGINEERING, LLCInventor: Gilliam Stelling Harris
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Patent number: 9951836Abstract: The present invention relates to a shock absorber system for a vehicle comprising a main unit (100) adapted to be deformed in the event of an impact with a first energy level and a secondary unit (200) shorter in length than the main unit (100), adapted to be subjected to loads as a complement of the main unit (100), after a first deformation phase of the main unit (100), when the system receives an impact with a second energy level greater than the first, the secondary unit (200) being configured to orient the resultant of a force applied on a downstream structure (30) in a direction not parallel to the longitudinal axis of this downstream structure.Type: GrantFiled: October 9, 2014Date of Patent: April 24, 2018Assignee: AUTOTECH ENGINEERING A.I.E.Inventors: Christophe Cazes, Gregory Gatard, Emmanuel Leroy, Matthieu Niess
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Patent number: 9954885Abstract: The present invention discloses a software/hardware device with uncertain service function and structural characterization and a method for scheduling the same. The device comprises a policy generator, a scheduler and a plurality of heterogeneous functional equivalents with equivalent functions, wherein, the policy generator is configured for providing a scheduling policy for the heterogeneous functional equivalents to the scheduler; the scheduler is configured for receiving an external service request, determining heterogeneous functional equivalents that provide a service to the external service request according to the scheduling policy given by the policy generator, assigning the service request to the determined heterogeneous functional equivalents, and outputting a service response which has an uncertain relation with uncertain structural characterization according to a feedback and the scheduling policy given by the policy generator.Type: GrantFiled: February 8, 2016Date of Patent: April 24, 2018Assignees: Shanghai RedNeurons Co., Ltd., China National Digital Switching System Engineering & Technological R&D CenterInventors: Jiangxing Wu, Yuxiang Hu, Fan Zhang, Qinrang Liu, Julong Lan, Zhiming Wang, Junfei Li, Jianhui Zhang, Yufeng Li, Ke Song, Xingming Zhang, Shuai Wei
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Patent number: 9953930Abstract: A semiconductor package structure includes a substrate, a semiconductor element, an encapsulant, an adhesion layer and a metal cap. The semiconductor element is disposed on the substrate. The encapsulant covers the semiconductor element. The adhesion layer is disposed on the encapsulant. The metal cap is attached to the encapsulant by the adhesion layer, and the metal cap is conformal with the encapsulant.Type: GrantFiled: October 20, 2016Date of Patent: April 24, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ying-Ta Chiu, Chiu-Wen Lee, Dao-Long Chen, Po-Hsien Sung, Ping-Feng Yang, Kwang-Lung Lin
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Patent number: 9954357Abstract: A power supply system offshore plant comprises: a generator; an AC/DC converter converting, AC generated from the generator into DC to supply the direct current to a DC bus; a power load connected to the DC bus to generate regenerative power; a first power storage unit for storing power when a voltage of the DC bus is maintained at a level of a first threshold value or higher for a first time period, and supplying the stored power to the DC bus when the voltage of the DC bus is maintained at a level of a second threshold value or lower for a second time period; and a first resistance unit for consuming power when the voltage of the DC bus is maintained at the level of the first threshold value or higher for a third time period. The third time period is longer than the first time period.Type: GrantFiled: December 18, 2014Date of Patent: April 24, 2018Assignee: DAEWOO SHIPBUILDING & MARINE ENGINEERING CO., LTD.Inventors: Ho Young Jung, Young Ho Bae
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Patent number: 9955590Abstract: The present disclosure relates to redistribution layer structures useful in semiconductor substrate packages, semiconductor package structures, and chip structures. In an embodiment, a redistribution layer structure includes a dielectric layer, an anti-plating layer, and a conductive material. The dielectric layer defines one or more trenches. The conductive material is disposed in the trench(es), and the anti-plating layer is disposed on a surface of the dielectric layer.Type: GrantFiled: October 21, 2015Date of Patent: April 24, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventor: Chao-Fu Weng
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Patent number: 9951799Abstract: An open/shut valve mechanism for detecting that a piston member of a hydraulic pressure cylinder has reached an unclamp position comprises: a valve body reception hole that communicates with a unclamp hydraulic pressure operating chamber, a valve body movably received in the valve body reception hole and having an annular concave engagement portion on its external circumferential portion; a spherical body that is movably installed in a cylinder main body and that can engage with the concave engagement portion; and an engagement portion that is formed on an auxiliary rod and with which the spherical body can engage; and when hydraulic pressure is charged into the unclamp hydraulic pressure operating chamber and the piston member has reached its unclamp position, the valve body receives the hydraulic pressure, a portion of the spherical body engages to the engagement portion and the valve body changes over to the valve closed position; and, when the piston member has shifted from its unclamp position, the spherType: GrantFiled: September 20, 2013Date of Patent: April 24, 2018Assignee: Pascal Engineering CorporationInventor: Takayuki Kawakami
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Patent number: 9950319Abstract: The present disclosed are a high exchange-capacity anion exchange resin with dual functional-groups and method of synthesis thereof. The invention relates to the field of environmental function material synthesis and application. The resin is based on chloromethylated polystyrene-divinylbenzene polymer as matrix, and by primary amination and quaternization, yields an anion exchange resin with dual functional-groups having both a weak base anionic group and a strong base anionic group. The anion exchange resin not only has high adsorption capacity for water-born nitrate ions, but also can effectively squelch natural organic acids such as phytic acid in water, thus simultaneously removing nitrate ions and phytic acid organic matter from water. Therefore, the resin has a broad application potential in the fields of drinking water treatment, groundwater remediation, and advanced urban sewage treatment.Type: GrantFiled: July 13, 2015Date of Patent: April 24, 2018Assignees: NANJING UNIVERSITY, NANJING UNIVERSITY YANCHENG ENVIRONMENTAL PROTECTION TECHNOLOGY AND ENGINEERING RESEARCH INSTITUTEInventors: Jinnan Wang, Yi Wang, Xin Yang, Cheng Cheng, Chen Chen
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Patent number: 9951603Abstract: A method for using a downhole probe. The method comprises providing a probe, at least one vertical cross section of the probe having an area of at least pi inches squared. The method further comprises inserting the probe into a bore of a drill collar and passing a drilling fluid through the bore of drill collar at a flow velocity of less than 41 feet per second.Type: GrantFiled: December 7, 2012Date of Patent: April 24, 2018Assignee: Evolution Engineering Inc.Inventors: Jili (Jerry) Liu, Patrick R. Derkacz, Aaron W. Logan, Justin C. Logan, David A. Switzer
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Patent number: 9951290Abstract: A method for improving corrosion protection and friction coefficient in an engine or other mechanical component lubricated with a lubricating oil by using as the lubricating oil a formulated oil. The formulated oil has a composition comprising a lubricating oil base stock as a major component, and a mixture of (i) at least one organic molybdenum compound, and (ii) at least one borated ester, as a minor component. Corrosion protection and friction coefficient are improved as compared to corrosion protection and friction coefficient achieved using a lubricating oil containing a minor component other than the mixture of (i) at least one organic molybdenum compound, and (ii) at least one borated ester.Type: GrantFiled: March 31, 2016Date of Patent: April 24, 2018Assignee: EXXONMOBIL RESEARCH AND ENGINEERING COMPANYInventors: Jason Z. Gao, Samuel C. Bainbridge, Luca Salvi
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Patent number: 9950889Abstract: A film intermittent carrying device: includes a film delivering mechanism, a delivering and accumulating mechanism, accumulating the film and discharging the film, a winding and accumulating mechanism accumulating the film while discharging in an amount corresponding to an amount of the film discharged, and a film winding mechanism taking-up the film constantly. The delivering and accumulating mechanism includes first and second fixed rollers, an upstream-side movable roller moving to pass through a middle position between the first and second fixed rollers, and an upstream-side friction preventive unit configured to reduce a friction between the film and the upstream-side movable roller.Type: GrantFiled: June 14, 2012Date of Patent: April 24, 2018Assignee: Nittoku Engineering Co., LtdInventor: Yuji Higeta
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Patent number: 9951396Abstract: A quench system includes an enclosure defining a quench chamber sized to receive hot castings, and bulk air fans in fluid communication with the quench chamber and configured to establish a bulk flow of cooling air that surrounds and extracts heat from the hot castings at a first cooling rate. The quench system also includes a pressurized cooling system in fluid communication with a plurality of nozzles within the quench chamber and configured to spray a plurality of a directed flows of cooling fluid onto the hot castings to extract heat at a second cooling rate. The quench system further includes a programmable controller configured to sequentially activate the bulk air fans to cool the casting at the first cooling rate for a first predetermined period of time, and then activate the pressurized cooling system to cool the casting at the second cooling rate for a second predetermined period of time.Type: GrantFiled: September 16, 2015Date of Patent: April 24, 2018Assignee: Consolidated Engineering Company, Inc.Inventor: Scott P. Crafton
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Patent number: 9954372Abstract: Disclosed herein are a variety of systems and methods for management of an electric power generation and distribution system. According to various embodiments, a system consistent with the present disclosure may be configured to analyze a data set comprising a plurality of generator performance characteristics of a generator at a plurality of operating conditions. The performance characteristics may be used to produce a generator capability model. The generator capability model may comprise a mathematical representation approximating the generator performance characteristics at the plurality of operating conditions. The system may further produce an estimated generator capacity at a modeled condition that is distinct from the generator performance characteristics of the data set and is based upon the generator capability model and may implement a control action based on the estimated generator capacity at the modeled condition.Type: GrantFiled: February 26, 2014Date of Patent: April 24, 2018Assignee: Schweitzer Engineering Laboratories, Inc.Inventors: Jedidiah W. Bartlett, Jeromy Streets
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Patent number: 9951235Abstract: Recordation and removal of an image that can be removed from a recording medium are facilitated with suitable workability. An ink composition for forming an image using an ink jet scheme on a recording medium, and removing the image from the recording medium by dissolving the image by a solvent after having fixed the formed image by light irradiation, and an ink composition that is to become a base of an image layer formed on the recording medium using the ink jet scheme, and that is for removing the image layer from the recording medium by dissolving the ink composition by the solvent after having fixed the formed image layer by the light irradiation that are according to the present disclosure include a photocurable compound that is cured by receiving light irradiation and dissolved by a solvent while in a cured state.Type: GrantFiled: September 23, 2015Date of Patent: April 24, 2018Assignee: MIMAKI ENGINEERING CO., LTD.Inventors: Ayumi Sakaguchi, Masaru Ohnishi, Hironori Hashizume
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Patent number: 9951201Abstract: Provided is a method to produce resin particles having a uniform particle size by a suspension polymerization method, and to provide a method for simply producing resin particles having high dispersibility into an organic binder or an organic solvent, wherein a resin particle assemblage comprises a resin particle assemblage in which an ester moiety constituting a sorbitan fatty acid ester having no polyoxyalkylene group is buried in the resin particles, and a large number of sorbitan moieties bonded with the ester moiety exist on a surface of resin particles, and a coefficient of variation (CV value) of a mean particle diameter of the resin particles forming the resin particle assemblage is in the range of 30% or less.Type: GrantFiled: December 10, 2012Date of Patent: April 24, 2018Assignee: Soken Chemical & Engineering Co., LTD.Inventors: Satoru Yamamoto, Aya Kokaya, Chie Tsuchiya
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Patent number: 9953931Abstract: A semiconductor device package comprises a substrate, a first electronic component, first and second conductive pads, a first frame board, an encapsulation layer, and a conductive layer. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component, the first and second conductive pads, and the first frame board are on the first surface of the substrate. The first frame board surrounds the first electronic component and comprises a first conductive via and a second electronic component. The encapsulation layer encapsulates the first electronic component and the first frame board. The conductive layer is on the first frame board and the encapsulation layer. The first conductive via is electrically connected to the second conductive pad and the conductive layer, and the second electronic component is electrically connected to the first conductive pad.Type: GrantFiled: October 25, 2016Date of Patent: April 24, 2018Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INCInventors: Chih Sheng Yao, Huan Wun Li, Yu-Chih Lee, Wei-Hsuan Lee