Abstract: A socket assembly for accommodating an IC chip or package (IC) provided with a socket body having a generally rectangular configuration. A plurality of flat plate-like contact pins are arranged forming rows in parallel with each other so as to form rows along four sides of the socket body, respectively. Each contact pin has a base portion and an arm which extends curved upward from the base portion. An upward contact portion for coming into contact with a terminal of an IC is formed on one end of the base portion of the contact pin, and a connecting portion for the connection to the printed circuit board is formed on the other end of the base portion. Four sliders are arranged along the four sides of the socket body, respectively.

Abstract: An IC socket which has a moving plate provided so that it can laterally move with respect to a base member, an operation member vertically moveably provided with respect to the base member, and at least one actuation member for moving contact pins arranged on the base member from a contact position to a non-contact position with respect to terminals of an IC package by laterally moving the moving plate in accordance with the depression of the operation member. The actuation member is arranged along the end surface of the moving plate.

Abstract: An IC socket adapted to establish an electrical connection between an IC package and a printed board includes a socket body having a mount portion on which the IC package is mounted, a number of contact pins disposed on the socket body in substantially equally adjacent arrangement, each of the contact pins having one end to be connected to a terminal of the IC package and another end to be connected to the printed board, and an interval widening member provided for the socket body for widening a pitch interval between the other ends of adjacent contact pins so as to provide a predetermined distance therebetween.