Abstract: A method for making integrated circuit wafers wherein the wafer has vias or other openings in the wafer which openings have a barrier/adhesion or other metal layer which is metallized to form the circuit comprising activating the metal layer and then sensitizing the metallic layer using a sensitizing displacement composition comprising preferably an alkaline palladium non-ammonia nitrogen (ethylene diamine) complex which is contacted with the wafer at a specially controlled pH. The wafer is activated using an activation solution which contains a complexing agent for any dissolved metal. The sensitizing solution also preferably contains a complexing agent for dissolved metal and preferably contains a second complexing agent such as EDTA to solubilize base metal contaminants.

Abstract: A method of electrowinning, electrorefining or electroforming of ductile copper deposits. The method uses an adduct of a tertiary alkyl amine with polyepichlorohydrin in amounts effective for ductilizing a copper deposit form a copper electrolyte.

Abstract: A process is provided for enhancing the wear resistance of aluminum and other materials by depositing on the substrate a nickel, cobalt, phosphorous alloy coating using an electroless plating bath to provide a plated alloy having a cobalt content of at least about 20% by weight and a % Co/% P weight ratio of at least about 5. A preferred bath contains an effective amount of glycolic acid or salts thereof. The alloy deposit is preferably plated over a zincated aluminum substrate.

Abstract: A method is provided for zincating aluminum substrates for metal plating thereon wherein the plated aluminum product has smoothness, dimensional integrity and increased production yield of the plated products. The substrates also have enhanced paramagnetic thermal stability of ENP coatings used on memory disk products. A zincate bath contains as additives Fe.sup.+3 and NaNO.sub.3, and a chelator to chelate the iron, with a preferred iron chelator being Rochelle Salt and with the amount of Fe.sup.+3 being controlled at a preferred concentration of 0.2 to 0.3 g/l. A preferred zincating method employs an etchant composition comprising HNO.sub.3, H.sub.2 S0.sub.4 and H.sub.3 PO.sub.4 to etch the aluminum substrate prior to zincating. Use of this etchant composition, either alone or with the zincate bath of the invention, is particularly effective for aluminum substrates which have been ground to a smoothness of less than 100 .ANG..

Abstract: A method and electrolyte bath for depositing Cu.sup.+1 ions from the cathode diffusion layer onto a zinc substrate. Halogen ions are used as additives to organophosphonate alkaline copper electrolytes for stabilizing Cu.sup.+1 in the cathode diffusion layer.

Abstract: A tungsten alloy electroplating bath. Highly ductile tungsten alloy deposits are facilitated using a sulfur co-depositing ductility additive such as: ##STR1## wherein R.sub.1 is selected from the group consisting of H.sub.1, alkyl, alkenyl, hydroxy, halogen, carboxy and carbonyl;"AR" designates a benzene or naphthalene moiety;R.sub.2 is selected from the group consisting of H, or an alkyl sulfonic acid, a Group I or Group II salt of an alkyl sulfonic acid, a benzene, a sulfonate, a naphthalene sulfonate, a benzene sulfonamide, a naphthalene sulfonamide, an ethylene alkoxy, a propylene alkoxy; and R.sub.2 may be attached to "AR" to form a cyclic moiety; andR.sub.3 is selected from the group consisting of a benzene, a naphthalene, an unsaturated aliphatic group; and a benzenesulfonate group.The additive provides ductility improvements in tungsten alloy electroplates deposited from the solution.

Abstract: A plating system and method is provided for electroplating silicon wafers with copper using an insoluble anode wherein the electrolyte is agitated or preferably circulated through an electroplating tank of the system and a portion of the electrolyte is removed from the system when a predetermined operating parameter is met. A copper containing solution having a copper concentration greater than the copper concentration of the removed portion is added to the copper plating system simultaneously or after electrolyte removal, in a substantially equal amount to the electrolyte removed from the system and balances the amount of copper plated and removed in the removal stream. In a preferred method and system, an electrolyte holding tank is provided which serves as a reservoir for circulating electrolyte. The addition of the copper containing solution and removal of working electrolyte is also preferably made from the holding tank.

Abstract: An electrically conductive paint for providing EMI/RFI shielding for housings of electronics components comprises a cross-linked organic resin binder containing cross-linkable functional groups such as OH groups, electrically conductive metallic particles, preferably a mixture of silver flakes and silver-coated copper flakes, a solvent, a cross-linking agent which cross-links with itself and with the functional groups of the organic binder and preferably a catalyst which accelerates cross-linking of the cross-linking agent and organic binder. Using such a paint formulation it has been found that thinner coatings can be used while still exceeding the properties needed for EMI/RFI shielding of housing for electronic components. A rheological additive which is an organic derivative of castor oil is preferably used to control the viscosity and spraying characteristics of the paint especially in a paint composition containing silver coated copper flakes.

Abstract: A permanent curable photosensitive liquid dielectric polymer composition is disclosed for making copper printed circuit boards having at least one photosensitive dielectric polymer layer containing vias and circuitry thereon wherein the polymer layer has enhanced copper to dielectric adhesion. The dielectric composition preferably comprises an acrylated epoxy and a metal adhesion effective amount of amorphous silica. Printed circuit boards made using the photodefinable dielectric polymer and a method for making the printed circuit boards are also disclosed. A twice performed permanganate etching process for texturing the dielectric surface is also preferably used to further enhance the copper to dielectric adhesion.

Abstract: A method for removal of an organic film from a metal substrate comprising: (a) preparing a stripping bath comprising a mixture of a salting-out agent, a carboxylic acid, and an organic solvent, said organic solvent in a concentration at about or greater than its solubility limit in water and having a solubility limit of 1/2% to 50% by weight in water, wherein said organic solvent is selected from the group consisting of butoxy ethanol, hexoxy ethanol, butoxy-2-ethoxy ethanol, dibasic ester, 2-ethyl hexyl alcohol, straight chain alcohol having from 6 to 16 carbons, N-methyl-pyrrolidone, and mixtures thereof, and said carboxylic acid is selected from the group consisting of hydroxy carboxylic acids, lactic acid, glycolic acid, citric acid, malic acid, tartaric acid, and mixtures thereof, and said salting-out agent is selected from a group consisting of glucoheptonate, gluconate, and mixtures thereof, and (b) immersing said metal substrate in the stripping bath of step (a) for a predetermined period of time to l

Abstract: A process for tungsten alloy plating wherein a tungsten replenisher concentrate of tungsten ions pre-complexed with a hydroxy carboxylic acid is used for maintenance additions to the bath. A preferred additive includes from about 100 to about 120 g/l of tungsten ions complexed with from about 120 to about 220 g/l of citric acid. The process provides consistent cathode efficiency and produces ductile deposits of tungsten alloy electroplate.

Abstract: Polyacrylic acids are used in electrowinning and electrorefining baths as additives for grain refinement, dendrite reduction, and for reducing impurities in the electroplate.

Abstract: A passivate for tungsten alloy electroplates. The passivate includes an effective quantity of CrO.sub.3 in an aqueous bath having a pH of from about 3.5 to about 7.5.

Abstract: A copper electroplating process using alkoxylated dimercaptan ethers as an additive. The additives prevent dendritic formations which short out electrodes. Also provided is a method for polarizing the electrodes, allowing for current reduction and cost savings.

Abstract: A process and aqueous bath for bright dipping of a copper containing substrate. The bath includes: an acid, hydrogen peroxide and a bath soluble, peroxide stable constituent effective for creation and stabilization of a dissolution inhibiting film over the brightened substrate.

Abstract: A process is provided for plating zinc die cast substrates with an electroless nickel coating comprising depositing an electrolytic zinc layer on the substrate followed by depositing a first electroless nickel layer on the electrolytic zinc layer using a first alkaline electroless nickel bath and then depositing a finish electroless nickel layer on the first electroless nickel layer using an acidic electroless nickel bath. In a preferred embodiment, a second electroless nickel layer is deposited on the first electroless nickel layer using a second alkaline electroless nickel bath. It is preferred that at least one and preferably all of the electroless nickel baths contain an effective amount of antimony ions to enhance bath stability and metal to metal adhesion. Mechanical cleaning of the zinc die casting before plating is preferred.

Abstract: A brightening agent for use in tungsten alloy electroplating baths to replace hexavalent chromium plating or other hard lubrous coatings. Baths of the present invention comprise an effective amount of tungsten ions; an effective amount of a metal ion compatible with tungsten; one or more complexing agents; and an effective amount of a bath soluble alkoxylated hydroxy alkyne for providing brightening of a tungsten alloy electroplate.

Abstract: A method of removing metal from a feedstock solution containing dissolved metal ions which comprises passing the feedstock through an annular gap, the inner surface of which is cathodic to the metal ion and the outer surface of which is anodic in such a way that the flow is turbulent.Also claimed is an apparatus for removing metal from a feedstock which comprises a reactor afforded by an inner cathode tube, and an outer anode tube spaced therefrom by a narrow annular gap, direct electric current supply means to the anode and cathode, pump means for pumping feedstock into the said annular gap at high flow rates, a holding tank, pipe work connecting the holding tank to the said pump means and the pipe work connecting the end of the annular gap remote from the pump to the holding tank.

Abstract: A method is provided for producing paramagnetic electroless nickel-phosphorus (ENP) coatings on zincated aluminum substrates using an ENP bath containing antimony and/or cadmium ions and/or an adjusting operating pH, which coated substrates have enhanced retention of their paramagnetic properties after being exposed to elevated temperatures on the order of 310.degree. C. as, for example, when the ENP coated substrate is further treated by sputtering operations to form another metal layer on the coated substrate to produce magnetic memory disks.

Abstract: An aqueous bath for electrodepositing zinc and zinc alloys wherein the alloying metals are selected from the group consisting of iron, cobalt and nickel and containing an effective additive amount of a quaternary ammonium polymer to produce enhanced deposits. A process for electrodepositing zinc and zinc alloys using the baths of the invention is also disclosed.