Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
Type:
Grant
Filed:
May 10, 2022
Date of Patent:
August 29, 2023
Assignee:
ENVISTA
Inventors:
Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
Type:
Application
Filed:
May 10, 2022
Publication date:
March 30, 2023
Applicant:
Envista
Inventors:
Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
Type:
Grant
Filed:
May 18, 2020
Date of Patent:
September 27, 2022
Assignee:
ENVISTA
Inventors:
Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen, Roscoe Linstadt
Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
Type:
Grant
Filed:
May 18, 2020
Date of Patent:
June 7, 2022
Assignee:
ENVISTA
Inventors:
Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
Type:
Application
Filed:
May 18, 2020
Publication date:
November 5, 2020
Applicant:
Envista
Inventors:
Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen, Roscoe Linstadt
Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
Type:
Application
Filed:
May 18, 2020
Publication date:
November 5, 2020
Applicant:
Envista
Inventors:
Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
Type:
Grant
Filed:
January 27, 2017
Date of Patent:
June 23, 2020
Assignee:
ENVISTA
Inventors:
Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen, Roscoe Linstadt