Patents Assigned to ENVISTA
  • Patent number: 11739223
    Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: August 29, 2023
    Assignee: ENVISTA
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
  • Publication number: 20230103027
    Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
    Type: Application
    Filed: May 10, 2022
    Publication date: March 30, 2023
    Applicant: Envista
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
  • Patent number: 11453790
    Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: September 27, 2022
    Assignee: ENVISTA
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen, Roscoe Linstadt
  • Patent number: 11352512
    Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: June 7, 2022
    Assignee: ENVISTA
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
  • Publication number: 20200347248
    Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
    Type: Application
    Filed: May 18, 2020
    Publication date: November 5, 2020
    Applicant: Envista
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen, Roscoe Linstadt
  • Publication number: 20200347247
    Abstract: In one embodiment, the present application discloses a surface binding compound of the Formula I or Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound of the Formula I or Formula II.
    Type: Application
    Filed: May 18, 2020
    Publication date: November 5, 2020
    Applicant: Envista
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen
  • Patent number: 10689407
    Abstract: In one embodiment, the present application discloses a photo-cleavable surface binding compound of the Formula I and Formula II: wherein the variables EG, EG1, SP1, SP2, SP3, Ar and BG are as defined herein. In another embodiment, the application discloses a method for forming a coating on a surface of a substrate using the surface binding compound.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: June 23, 2020
    Assignee: ENVISTA
    Inventors: Byung Jun Ahn, Bruce H. Lipshutz, Sam L. Nguyen, Roscoe Linstadt