Abstract: An environment-resistant module which provides both thermal and vibration isolation for a packaged micromachined or MEMS device is disclosed. A microplatform and a support structure for the microplatform provide the thermal and vibration isolation. The package is both hermetic and vacuum compatible and provides vertical feedthroughs for signal transfer. A micromachined or MEMS device transfer method is also disclosed that can handle a wide variety of individual micromachined or MEMS dies or wafers, in either a hybrid or integrated fashion. The module simultaneously provides both thermal and vibration isolation for the MEMS device using the microplatform and the support structure which may be fabricated from a thin glass wafer that is patterned to create crab-leg shaped suspension tethers or beams.
Type:
Grant
Filed:
April 14, 2014
Date of Patent:
April 23, 2019
Assignees:
E-PACK, INC., THE REGENTS OF THE UNIVERSITY OF MICHIGAN
Inventors:
Khalil Najafi, Sang-Hyun Lee, Sang Woo Lee, Jay Stewart Mitchell, Onnop Srivannavit