Abstract: A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region.
Type:
Grant
Filed:
June 8, 2009
Date of Patent:
May 19, 2015
Assignee:
EPCOS AC
Inventors:
Wolfgang Pahl, Hans Krueger, Peter Demmer