Abstract: An electrical component having partial bodies, a base on which the partial bodies are arranged, and at least one connection contact for electrically connecting the partial bodies to a carrier. A method for producing an electrical component having one or more partial bodies is also disclosed.

Abstract: A mechanically stable main body having a cutout, into which an ESD protection element is at least partly embedded and mechanically fixed by means of a connection means. Electrical terminals of the protection element are connected to terminal pads on the top side of the main body by way of a structured metallic layer bearing on main body and protection element.

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

Abstract: A multi-layer component having a main body including a stack of alternately arranged dielectric layers and internal electrode layers. In an insulation region on the outer sides of the main body a length of a connecting line between adjacent internal electrode layers of unlike polarity is greater than a direct distance between the adjacent electrode layers. A method for producing a multi-layer component is also provided. The method includes providing a main body including a stack of alternately arranged dielectric layers and internal electrode layers. The method also includes extending the connecting line between adjacent internal electrode layers of unlike polarity on the outer sides of the main body.

Abstract: A green film composed of varistor material laminated on a ceramic main body, which is provided with metallizations on both sides, and is sintered to form a varistor layer. A terminating electrode pair completes the arrangement and allows the varistor layer to be operated as a varistor. The upper second electrode pair can serve directly as a terminal contact for mounting an electrical component.

Abstract: The present invention concerns a line filter (1), which is configured to be installed onto a system cable (2), wherein the line filter (1) comprises a magnetic component (4), wherein the line filter (1) defines a cable path (6) through the line filter (1), wherein the line filter (1) is configured to allow a placement of the system cable (2) along the cable path (6) at the time of an installation, thereby providing a magnetic coupling of the system cable (2) to the magnetic component (4), and wherein the line filter (1) comprises an insulation displacement connector (16) and a shunt component (5) wherein the insulation displacement connector (16) is configured to be tightened at the time of the installation, thereby providing a galvanic connection of the system cable (2) to the shunt component (5). Further, the present invention concerns a method of installing a line filter (1) onto a system cable (2).

Abstract: An electrical connection contact (5) for a ceramic component (2) is specified. The connection contact (5) comprises a first material (M1) and a second material (M2) arranged thereon, wherein the first material (M1) has a high electrical conductivity and the second material (M2) has a low coefficient of thermal expansion.

Abstract: The invention relates to a method for producing electrode foils (1) for capacitors (10), comprising the method steps of: A) providing a metal foil (1), B) transferring microstructures (2) located on a stamping die onto a main surface of the metal foil by a reforming process.

Abstract: An improved electroacoustic component is provided. The component includes a carrier wafer with a passivation layer, a piezoelectric layer above the passivation layer and an interdigitated transducer in an electrode layer on the piezoelectric layer. The component is configured to work with a shear mode.

Abstract: A packaging structure including at least one hermetically sealed cavity in which at least one microelectronic device is arranged, the cavity being formed between a substrate and at least one cap layer through which several release holes are formed; several separated portions of metallic material such that each of the separated portions of metallic material is arranged on the cap layer above and around one of the release holes and forms an individual and hermetical plug of said one of the release holes; at least one diffusion barrier layer comprising at least one non-metallic material, arranged on the cap layer and forming a diffusion barrier against an atmosphere outside the cavity at least around the release holes; and wherein parts of the diffusion barrier layer are not covered by the portions of metallic material.

Abstract: An electroacoustic component is disclosed. In an embodiment, the electroacoustic component includes a piezoelectric substrate comprising a rare earth metal and calcium oxoborates (RE-COB) and component structures arranged on the substrate, the component structures being suitable for converting between RF signals and acoustic waves, wherein the waves are capable of propagation in a direction x??, and wherein the direction x?? is determined by Euler angles (?, ?, ?), the Euler angles being selected from angle ranges (20 . . . 90, 95 . . . 160, 15 . . . 55), (20 . . . 85, 95 . . . 160, 95 . . . 125) and (15 . . . 25, 85 . . . 100, 0 . . . 175).

Abstract: A double backplate microphone having a good signal-to-noise ratio and being produceable at reduced manufacturing costs is provided. A microphone comprises a first backplate BP1, a second backplate BP2 and a membrane M. The microphone further comprises an amplifier AMP with a single-ended input port. The first backplate BP1 is electrically connected to the single-ended input port.

Abstract: A beading tool (1) for the beading of a workpiece (10) is provided, the beading tool (1) having a contact area (2), which is designed to interact with the workpiece (10), the contact area (2) having a multiplicity of local elevations (4) that are delimited from one another. Also provided is a housing part (10) for an electrochemical cell (100), which defines a cavity and has at least one indentation (6), a multiplicity of local depressions (5) being formed in the indentation (6).

Abstract: A component comprising a carrier, a chip component and a MEMS component is proposed, wherein the mechanically sensitive MEMS component is mounted below a half-shell on the carrier. The component is encapsulated with a molding compound in a transfer molding process.

Abstract: The present invention relates to a microphone arrangement (M) which has a charge pump (LP), which produces a DC voltage, a transducer (WA), which converts acoustic signals into electrical signals and which is connected to the charge pump (LP), and a control unit (VCLFS), which controls the charge pump (LP) and which adjusts the DC voltage produced by the charge pump (LP).

Abstract: A chip (2, 3) is arranged above a top side of a flexible support (1) and mechanically decoupled from the support. Electrical connections (8, 11) of the chip are embodied using a planar connection technique. The chip can be separated from the support by an air gap or a base layer (7) composed of a soft or compressible material.

Abstract: The present invention concerns a MEMS microphone assembly (1) comprising a MEMS transducer element (2) comprising a MEMS die (3), a back plate (4) and a diaphragm (5) displaceable in relation to the back plate (4), and a sound inlet (16) for acoustically coupling the MEMS transducer element (2) to the exterior of the MEMS microphone assembly (1), wherein the MEMS die (3) comprises an indentation (17) that forms at least a part of the sound inlet (16). Further, the present invention concerns a method of manufacturing said MEMS microphone assembly (1).

Abstract: The present invention relates to a method for producing a sensor (SEN), comprising the steps of arranging a sensor element (SE) on a carrier (TR), arranging a cover (AF) on the sensor element (SE), wherein the sensor element (SE) is enclosed between the cover (AF) and the carrier (TR), adhesively bonding a carrier film (TF) onto the cover (AF), and producing an opening (SO) in the carrier film (TF) and the cover (AF), wherein the openings (SO) in the carrier film (TF) and the cover (AF) at least partly overlap.

Abstract: A directional coupler, comprising a first high-frequency line for feeding a first high-frequency signal, a second high-frequency line for feeding a second high-frequency signal, and a coupling line for outputting signals from the first and the second high-frequency lines, wherein the coupling line comprises resistive segments, each comprising a predetermined impedance. Coupling properties and resistive damping and adapting properties can be integrated in the coupling line. A compact and low-cost construction of the directional coupler is thus made possible.

Abstract: The present invention refers to a flat back plate, e.g. for MEMS capacitors e.g. for MEMS microphones. For that the back plate comprises a tensile element that exerts a horizontal tensile stress on its environment.