Abstract: An electronic component such as a surface acoustic wave component has a chip a piezoelectric substrate with electrically conductive structures thereon and a base plate having external electrical terminal elements that are contacted to the electrically conductive structures of the chip. A protective film is applied onto the chip surface carrying the electrically conductive structures. The surface of the protective film facing away from the piezoelectric substrate carries electrical contact elements that are connected, to the electrically conductive structures of the chip via through-contacts in the protective film and/or directly via bumps, as well as to the electrical terminal elements of the base plate.

Abstract: The invention is directed to a layer stack for the acceptance of a liquid having a suction layer (1) with high absorbency sufficing for sucking up the liquid from the edge of the layer stack into its middle and having a first storage layer (2) with low absorbency that is not sufficient for sucking up the liquid from the edge of the layer stack up to its middle between which an intermediate layer (3) composed of non-absorbent material and adjoining the first storage layer (3) is arranged, whereby a non-absorbent edge layer (7) is arranged at that side of the first storage layer (2) facing away from the intermediate layer (3), and whereby the intermediate layer (3) comprises through holes (4) whose plurality, size and distribution is selected such that some of the liquid suctioned up by the suction layer (1) can proceed via the holes (4) to the first storage layer and thoroughly saturate this.

Abstract: Reduction-stable COG ceramic compounds having a high dielectric constant, particularly for multi-layer capacitors or LC filters with Cu electrodes, on the basis of the material system BaO—Nd2O3—Sm2O3—TiO2 in the region of the phase formation of rhombic bronzes with additives of a glass frit from the systems: (A) ZnO—B2O3—SiO2, (B) K2O—Na2O—BaO—Al2O3—ZrO2—ZnO—SiO2—B2O3 or (C) Li2O—BaO—B2O—SiO2, have the general formula BaII6−x(SmyNd1−y)8+2x/3Ti18O54+p wt. % glass frit with 1<x<2, 0.5<y<1.0 and 3<p<10.

Abstract: An aluminum electrolyte capacitor with reduced inductivity is installed in a metal housing that is closed by a cover disk provided with metallic lead-throughs. Electrically conductive bodies are arranged at the cover disk at a region of high magnetic fields when current flows.

Abstract: In order to be able to produce an electrically conductive, positive connection between an end electrode of a gas-filled discharge path and a lead more simply in fabrication-oriented terms, the raised terminal region, which is provided at the end electrode, is provided with a blind hole into which the one end of the lead is introduced and joined thereat to the terminal region with a laser welding.

Abstract: A low-inductance electrolytic capacitor has an additional current guidance being provided from the winding via the pot and an electrically conductive disk to the negative lead-through, so that the current is divided for reducing the self-inductance.

Abstract: Method for adjusting the filter characteristic of a microwave ceramic filter which has coupled ceramic resonators, that are ceramic resonators configured in a ceramic body, varies the distance between input/output connections and a grounding connection.

Abstract: A strip transmission filter having resonators with impedance skips in which the resonators are provided in a ceramic substrate. The strip transmission filter also includes capacitive couplings. The ceramic substrate has a metallic coating on all sides except for a face side. The coupling structures are at the face side of the substrate. The ceramic substrate is constructed in a stepped formation in a region of the coupling structures and at least one ground terminal. Thus, the adhesion of metallic coating is increased which, in turn, facilitates soldering.

Abstract: The present invention relates to a current transmission element which is used for transmitting a current by a pressure contact at the windings of a capacitor. The current transmission element includes a metalic mesh made of tin-placed wires or a woven mat made of tin-plated wires.