Abstract: The present invention relates to a condenser microphone assembly comprising an electro-acoustic transducer element comprising a diaphragm and a back plate, signal processing circuitry operatively connected to the transducer element so as to process signals generated by the transducer element, and a mode-setting circuitry for selectively setting the condenser microphone assembly in a test mode or an operational mode. The electro-acoustic sensitivity of the condenser microphone assembly, when operated in the test mode, is at least 40 dB lower than the corresponding electro-acoustic sensitivity of the assembly when operated in the operational mode. The present invention further relates to a method for determining a performance parameter of a signal processing circuitry mounted inside a housing of an assembled condenser microphone assembly.

Abstract: The present invention relates to a condenser microphone assembly comprising a capacitive electro-acoustic transducer element comprising a diaphragm and a back-plate operatively connected to a DC bias voltage, a fast charge pump adapted to generate the DC bias voltage, and a controllable or programmable current source operatively connected to the DC bias voltage to draw a predetermined DC current there from. The controllable or programmable current source is responsive to a difference between a representative of a detected DC bias voltage and a DC reference voltage.

Abstract: A miniature microphone assembly comprises a capacitive-microphone transducer, a microphone carrier, and an integrated circuit die. The capacitive-microphone transducer includes a microphone-electrical contact or terminal. The microphone carrier comprises a carrier electrical contact or terminal formed on a first surface of the microphone carrier. An integrated circuit die includes a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a hydrophobic layer or coating. The side surfaces of the integrated circuit die and/or the capacitive-microphone transducer may also include the hydrophobic layer or coating.

Abstract: The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: The present invention relates to a condenser microphone assembly comprising a condenser microphone transducer comprising adjacently positioned diaphragm and back-plate members having an air gap there between. Moreover, the assembly comprises a deep sub-micron MOS integrated circuit die comprising a preamplifier comprising a first signal input terminal for receipt of electrical signals generated by the condenser microphone transducer. The first signal input terminal is operatively coupled to an input stage of the preamplifier, said input stage comprising a thick-oxide transistor. The present invention further relates to a deep sub-micron MOS integrated circuit die comprising a thick-oxide transistor-based preamplifier.

Abstract: A MEMS microphone comprising a MEMS transducer having a back plate and a diaphragm as well as controllable bias voltage generator providing a DC bias voltage between the back plate and the diaphragm. The microphone also has an amplifier with a controllable gain, and a memory for storing information for determining a bias voltage to be provided by the bias voltage generator and the gain of the amplifier.

Abstract: The present invention relates to a condenser microphone assembly comprising a capacitive electro-acoustic transducer element comprising a diaphragm and a back-plate operatively connected to a DC bias voltage, a fast charge pump adapted to generate the DC bias voltage, and a controllable or programmable current source operatively connected to the DC bias voltage to draw a predetermined DC current there from. The controllable or programmable current source is responsive to a difference between a representative of a detected DC bias voltage and a DC reference voltage.

Abstract: The present invention relates to a condenser microphone assembly comprising an electro-acoustic transducer element comprising a diaphragm and a back plate, signal processing circuitry operatively connected to the transducer element so as to process signals generated by the transducer element, and a mode-setting circuitry for selectively setting the condenser microphone assembly in a test mode or an operational mode. The electro-acoustic sensitivity of the condenser microphone assembly, when operated in the test mode, is at least 40 dB lower than the corresponding electro-acoustic sensitivity of the assembly when operated in the operational mode. The present invention further relates to a method for determining a performance parameter of a signal processing circuitry mounted inside a housing of an assembled condenser microphone assembly.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.

Abstract: A solid state silicon-based condenser microphone comprising a silicon transducer chip (1). The transducer chip includes a backplate (13) and a diaphragm (12) arranged substantially parallel to each other with a small air gap in between, thereby forming an electrical capacitor. The diaphragm (12) is movable relative to the backplate (13) in response to incident sound. An integrated electronic circuit chip (3) or ASIC is electrically coupled to the transducer chip (1). An intermediate layer (2) fixes the transducer chip (1) to the integrated electronic circuit chip (3) with the transducer chip (1) on a first side of the intermediate layer (2) and the integrated electronic circuit chip (3) on a second side of the intermediate layer (2) opposite the first side. The intermediate layer (2) has a sound inlet (4) on the same side as the ASIC giving access of sound to the diaphragm.