Abstract: A displacement soldering device comprising a container for molten solder, a support structure for supporting a printed circuit board (PCB) over the surface of solder in the container, means for displacing the surface using a partial vacuum, when molten, vertically relative to the container and support structure into contact with a PCB when supported thereby to effect a soldering operation thereon.

Abstract: A displacement soldering device having first and second ends to support, a PCB over the surface of molten solder in a container, and a support structure handling mechanism having, a first member to which said first end is pivotally attached, a latch, to which said second end is pivotally attached, moveable between latched and unlatched operational positions, said latch in its latched position being pivotally supported on said member and in its unlatched position permitting said support structure to pivot downwardly about said first end, means for lateral displacement of said support structure between a soldering position and a PCB access position, means for unlatching said latch when said solder is displaced into contact with a PCB supported by said support structure, means for latching said latch subsequent to a soldering operation, and means for elevating said support structure during said lateral displacement from said soldering position and for lowering said support structure during said lateral displacem