Abstract: In the disclosed solution, an electronic device (1) includes a printed circuit board (4) having a flexible part (4c), and a support part (5). The printed circuit board is bent by making use of the flexible part (4c) so that at least a part of the printed circuit board is over a second part of the printed circuit board (4). The support part (5) is adapted to support the flexible part (4c).

Abstract: In the solution put forth, an electrical device (1) comprises a hermetically sealed enclosure (2), at least one fuse (4) and other electrical components inside the enclosure (2), as well as a heatsink (5) outside the hermetically sealed enclosure (2). The at least one fuse (4) is connected to the heatsink (5) with heat conducting material (8). The heatsink (5) is adapted to conduct heat from the fuse to outside of the enclosure (2). The heatsink (5) features a channel (6) for a cooling medium for transferring heat from the heatsink (5) by making use of the cooling medium, whereby the heatsink (5) is a medium-cooled heatsink (5).