Abstract: An interposer is provided which includes a PCB having compliant pins connected to a first surface of the PCB. A plurality of vias located in the PCB are connected to the compliant pins and extend from the first surface toward a second surface of the PCB. A method for making an interposer is also provided.

Abstract: A die package is provided including a circuit board with a recess for a die mounting area. A cap receiving area is located in the circuit board at least partially around the recess for the die mounting area. A cap located in the cap receiving area includes resilient contacts corresponding to at least some contact pad locations on one of a die or a secondary circuit board affixed to die to establish contact between the resilient contacts on the cap and the contact pad locations. A die for use with the die package can include contact pads in the heretofore unused center area of the die, as well as the typical peripheral contact pads, allowing more IO connections, more efficient connections and greater contact pad areas.

Abstract: An interposer and method for making same is disclosed. A metallic sheet is formed with a plurality of spring members. A first sheet of insulative material is provided on a top surface of the metallic sheet and a second sheet of insulative material is provided on a bottom surface of the metallic sheet. The insulative material sheets each include a plurality of flaps wherein each flap at least partially corresponds to a particular one of the spring members in the metallic sheet. A conductive material is located in a predefined pattern on the first and second insulative sheets having a conductive contact portion extending onto the flaps. Vias are connected to the conductive material and extend through metallic and insulative sheets to provide electrical connectivity.

Abstract: A method for making a contact begins by providing a sheet of material. A portion of the sheet is deep drawn to form a cavity having at least one sidewall, the cavity extending away from a rim formed by a non-drawn portion of the sheet. At least one spring member is defined from the at least one sidewall and is bent such that at least a portion of the at least one spring member extends beyond the rim.

Abstract: An electrical interposer including first and second surfaces is provided. A plurality of compliant pins are connected to the first surface of the substrate, each of the compliant pins having a drawn body with at least one side wall extending along a longitudinal axis thereof substantially perpendicular to the substrate. A plurality of contact elements are connected to the substrate for making electrical contact with a device facing the second surface of the substrate. Electrical paths connect the compliant pins to the contact elements.

Abstract: An electrical connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. In particular, the multiple number of contact elements includes a first contact element and a second contact element whereby the first contact element has an operating property different than an operating property of the second contact element. In one embodiment, the operating property includes a mechanical or an electrical property. For example, the first contact element can have a larger elasticity than the second contact element.

Abstract: A connector for electrically connecting to pads of a land grid array formed on an electronic component includes a dielectric layer including opposing first and second surfaces, and a multiple number of contact elements extending above the first surface of the dielectric layer. Each contact element includes a conductive portion disposed to engage a respective pad of the land grid array for providing electrical connection to the land grid array. The connector further includes an electrical circuit formed on or within the dielectric layer. The electrical circuit is electrically connected to at least one of the multiple number of contact elements. In one embodiment, the electrical circuit includes an electrical component, such as a decoupling capacitor. In another embodiment, the electrical circuit operates to connect two contact elements together. For instance, the contact elements connecting to the ground potential can be connected together through the electrical circuit.