Patents Assigned to EPIC MEMS (XIAMEN) CO., LTD
  • Publication number: 20230396228
    Abstract: An acoustic wave device and a filter. The acoustic wave device comprises: a substrate, a lower electrode layer, a piezoelectric layer, and an upper electrode layer, which are sequentially stacked from bottom to top, where at least one air cavity is disposed in the substrate at a region corresponding to the upper electrode layer, and at least one of: a first hanging bridge is located at a portion of the upper electrode layer which connects to outside, first hanging roofs are located at an edge and an inner portion of the upper electrode layer, and at least one via hole runs through one of the first hanging roofs which is located at the inner portion of the upper electrode layer; a quantity of the at least one air cavity is greater than one; or the upper electrode layer has a recess extending along a horizontal direction.
    Type: Application
    Filed: December 8, 2020
    Publication date: December 7, 2023
    Applicant: EPIC MEMS (XIAMEN) CO., LTD
    Inventors: Bohua PENG, Nianchu HU, Bin JIA
  • Patent number: 10958236
    Abstract: A hybrid acoustic resonator. An interdigital electrode is provided in a first region of a surface of a piezoelectric film facing away from a substrate, and forms an interdigital transducer. At least two trenches are provided in a second region of the surface of the piezoelectric film facing away from the substrate. A bulk-acoustic-wave propagation portion is formed between adjacent trenches. A bulk-acoustic-wave electrode is provided on a side surface of the bulk-acoustic-wave propagation portion, and there is an air gap at a surface of the bulk-acoustic-wave electrode facing away from the bulk-acoustic-wave propagation portion. Thereby, the hybrid acoustic resonator includes both the surface acoustic resonator and the bulk acoustic resonator. An acoustic wave in the bulk-acoustic-wave propagation portion and an acoustic wave in the interdigital transducer are both transmitted along a transversal direction.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: March 23, 2021
    Assignee: EPIC MEMS (XIAMEN) CO., LTD
    Inventors: Ping Li, Nianchu Hu, Bin Jia
  • Publication number: 20200389146
    Abstract: A hybrid acoustic resonator. An interdigital electrode is provided in a first region of a surface of a piezoelectric film facing away from a substrate, and forms an interdigital transducer. At least two trenches are provided in a second region of the surface of the piezoelectric film facing away from the substrate. A bulk-acoustic-wave propagation portion is formed between adjacent trenches. A bulk-acoustic-wave electrode is provided on a side surface of the bulk-acoustic-wave propagation portion, and there is an air gap at a surface of the bulk-acoustic-wave electrode facing away from the bulk-acoustic-wave propagation portion. Thereby, the hybrid acoustic resonator includes both the surface acoustic resonator and the bulk acoustic resonator. An acoustic wave in the bulk-acoustic-wave propagation portion and an acoustic wave in the interdigital transducer are both transmitted along a transversal direction.
    Type: Application
    Filed: November 12, 2018
    Publication date: December 10, 2020
    Applicant: EPIC MEMS (XIAMEN) CO., LTD
    Inventors: Ping LI, Nianchu HU, Bin JIA