Abstract: A semiconductor device includes a first high potential power supply, a second low potential power supply, a third power supply having a potential higher than the first, a fourth power supply having a potential more negative than the second, and an anti-fuse element having a node at each end, one of which is connected to the fourth power supply. A driver transistor has a source connected to the third power supply, a gate connected to a control node and a drain connected to one end of the anti-fuse element. A decoding circuit includes a load transistor connected between the third power supply and the control node and at least one selection transistor connected between the second power supply and the control node. A decision circuit is connected to the first and second power supplies. The decision circuit decides the resistance value of the anti-fuse element. The anti-fuse element is rendered electrically conductive in response to activation of the driver transistor as selected by the decoding circuit.

Abstract: In a memory module including a plurality of DRAM chips which transmit/receive a system data signal with a predetermined data width and at a transfer rate and which transmit/receive an internal data signal having a larger data width and a lower transfer rate as compared with the system data signal, the transfer rate of the system data signal is restricted. Current consumption in DRAMs constituting the memory module is large, hindering speed increases. For this memory module, a plurality of DRAM chips are stacked on an IO chip. Each DRAM chip is connected to the IO chip by a through electrode, and includes a constitution for mutually converting the system data signal and the internal data signal in each DRAM chip by the IO chip. Therefore, wiring between the DRAM chips can be shortened, and DLL having a large current consumption may be disposed only on the IO chip.