Abstract: A manufacturing method and structure for a MIS Heterojunction Bipolar Transistor (HBT) is provided including a GaAs substrate which has a collector region; a base layer coupled to the collector region; the ultra-thin insulating layer including a rare earth oxide coupled to the base layer; and an emitter structure including metal layers coupled to the ultra-thin insulating layer.
Abstract: A semiconductor wafer composite is used as a basis for fabricating semiconductor chips, especially compound semiconductor devices. The semiconductor wafer composite advantageously comprises a metallic substrate 210 and multiple semiconductor tiles 220 bonded to the surface of the metallic substrate 210. The semiconductor wafer composite is effectively used as a single large semiconductor wafer for volume fabrication, and can be used to fabricate semiconductor devices in a similar manner.