Abstract: To match the soldering of an assembled printed-circuit board (13) to its assembly configuration, the circuit board (13) is brought in contact with a soldering wave (21) for a first time along a predetermined path (57, 58), and thereupon the circuit board is rotated about a vertical axis and is brought into contact, preferably with the same soldering save (21), a second time, along predetermined paths from the same direction during its motion along the paths (57, 58). The printed circuit board (13) may be rotated by an angle (.alpha.) depending on the assembly configuration relative to the direction of flow (56) of the soldering wave (21).

Abstract: A machine for cutting the lead ends of components mounted at printed-wiring boards, also referred to as printed circuits, comprising at least one rotating driven cutting disk, a grinding device for grinding such cutting disk, the cutting disk and the grinding device being relatively movable towards one another.