Patents Assigned to Epserv Tech Corporation
  • Signal connection assembly of cooling module
    Patent number: 6999313
    Abstract: An improved signal connection assembly of cooling module comprises a housing and a cooling module; a panel on the housing has at least one window and the window has a first connecting structure; the cooling module is coupled the window and has a second connecting structure coupled to the first connecting structure thereon for transmitting the control signal, the power supply, or the power supplied by the power supply to the cooling module.
    Type: Grant
    Filed: April 22, 2003
    Date of Patent: February 14, 2006
    Assignee: Epserv Tech Corporation
    Inventor: Shoei-Yuan Shih