Abstract: The present invention provides a sensor mounted wafer, including: a lower case in which a mounting groove is formed; a circuit board on which a plurality of electronic components having different heights are mounted, and placed in the mounting groove; an upper case in which a plurality of insertion grooves having different depths are formed, and bonded together to the lower case so that the plurality of electronic components are inserted into the plurality of insertion grooves; and an adhesive layer placed between the mounting groove and the plurality of insertion grooves, in which the insertion grooves are formed to have different depths according to the heights of the plurality of the electronic components.

Abstract: A sensor mounted wafer includes a lower case, a circuit board, a metal layer, an upper case and lower case. A mounting groove is formed on a surface of the lower case. An electronic component is mounted on the circuit board, and placed in the mounting groove. The upper case having an insertion groove on a surface of the upper case, wherein the electronic component is inserted into the insertion groove, and the upper case is bonded together to the lower case. The metal layer placed on at least one surface of the lower case and the upper case.