Patents Assigned to Equilasers, Inc.
  • Laser-driven microwelding apparatus and process
    Patent number: 5938952
    Abstract: A microelectronic packaging and interconnection apparatus and method in which dual ball bonds, metal bumps, or TAB bonds are formed by pulsed laser irradiation, but not conventional heating, compression or acoustic (e.g., ultrasonic) methods. A miniature loop forming tool is used to form a metallic wire loop, one end of which is welded to an IC bond pad while the other end of which is welded to an IC package bonding finger, thus forming ball bonds at both ends of the interconnection.
    Type: Grant
    Filed: January 22, 1997
    Date of Patent: August 17, 1999
    Assignee: Equilasers, Inc.
    Inventors: Chang-Ming Lin, Richard C. Sam