Patents Assigned to Ercon, Inc.
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Patent number: 5843342Abstract: A composition comprising conductive particles and polymeric material selected from the group of polymers, pre-polymers and mixtures thereof wherein at least about 5 percent by weight of the particles included in the composition have been subjected to treatment such that the particles have chloride at least on their surface prior to inclusion in the composition.Type: GrantFiled: March 6, 1995Date of Patent: December 1, 1998Assignee: Ercon, Inc.Inventor: John Ehrreich
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Patent number: 5305644Abstract: A force sensor component comprising a dimensionally stable body of electrically conductive material, the body having a selected outer surface formed into a predetermined topography; the body including an electrically conductive material in an amount sufficient to render the body electrically conductive at least throughout the selected outer surface of the body; the predetermined topography of the outer surface of the body comprising a plurality of interconnecting ridges across the outer surface of the body.Type: GrantFiled: September 2, 1992Date of Patent: April 26, 1994Assignee: Ercon, Inc.Inventor: John Ehrreich
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Patent number: 5207950Abstract: A composition comprising chlorided and non-chlorided conductive particles and polymeric material selected from the group of polymers, pre-polymers and mixtures thereof wherein at least about 5 percent by weight of the particles included in the composition have been subjected to treatment such that the particles have chloride at least on their surface prior to inclusion in the composition.Type: GrantFiled: March 16, 1989Date of Patent: May 4, 1993Assignee: Ercon, Inc.Inventor: John Ehrreich
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Patent number: 5194205Abstract: A force sensor component is formed including a dimensionally stable body of electrically conductive material, the body having a selected outer surface formed into a predetermined topography; the body including an electrically conductive material in an amount sufficient to render the body electrically conductive at least throughout the selected outer surface of the body; the predetermined topography of the outer surface of the body including a plurality of interconnecting ridges across the outer surface of the body.Type: GrantFiled: October 16, 1990Date of Patent: March 16, 1993Assignee: Ercon, Inc.Inventor: John Ehrreich
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Patent number: 4836955Abstract: An improved silver-coated copper-based powder which is characterized by extraordinary stability, in terms of electroconductivity, when the powder is utilized with organic resin to form electroconductive compositons. The powder is made by subjecting it to an intensive heat treatment after the silver is coated thereon.Type: GrantFiled: November 3, 1987Date of Patent: June 6, 1989Assignee: Ercon, Inc.Inventor: John E. Ehrreich
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Patent number: 4786437Abstract: Unfavorable interaction is prevented between (a) electroconductive particle fillers and (b) organic resin binders of the type which are normally instable with respect to viscosity when aged in contact with said fillers. Moreover, electroconductivity degradation is also avoided. In a preferred mode of the invention, the particle surface is treated with a coating of an interfacial pacifying agent such as a tetravalent tin compound which both enhances the electroconductive performance of the particles and also is sufficiently compatible with the resin binder to migrate into the binder sufficiently to avoid undue gelling of the binder by particle-borne contamination or residues of such contamination.Type: GrantFiled: May 13, 1987Date of Patent: November 22, 1988Assignee: Ercon, Inc.Inventor: John E. Ehrreich
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Patent number: 4716081Abstract: An improved silver-coated copper-based powder which is characterized by extraordinary stability, in terms of electroconductivity, when the powder is utilized with organic resin to form electroconductive compositions. The powder is made by subjecting it to an intensive heat treatment after the silver is coated thereon.Type: GrantFiled: July 19, 1985Date of Patent: December 29, 1987Assignee: Ercon, Inc.Inventor: John E. Ehrreich
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Patent number: 4683082Abstract: Unfavorable interaction is prevented between (a) electroconductive particle fillers and (b) organic resin binders of the type which are normally instable with respect to viscosity when aged in contact with said fillers. Moreover, electroconductivity degradation is also avoided. In a preferred mode of the invention, the particle surface is treated with a coating of an interfacial pacifying agent such as a tetravalent tin compound which both enhances the electroconductive performance of the particles and also is sufficiently compatible with the resin binder to migrate into the binder sufficiently to avoid undue gelling of the binder by particle-borne contamination or residues of such contamination.Type: GrantFiled: March 27, 1985Date of Patent: July 28, 1987Assignee: Ercon, Inc.Inventor: John E. Ehrreich
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Particle filled flexible coating composition of aromatic polyester and vinylidene chloride copolymer
Patent number: 4592961Abstract: A coating composition having surprisingly superior physical properties, particularly when highly-filled with small particles and bonded to a flexible film of a polymeric substrate. The composition consists essentially of (1) a homogeneous binder formed of relatively hard, high-tensile, aromatic polyester compounded with a vinylidene chloride copolymer such that the copolymer serves as means to increase the elongation, toughness and heat resistance of the binder and (2) the filler. The process of forming such a binder comprises formation of a homogeneous polymeric solution wherein each of the polymers is intimately distributed within the same solvent phase.Type: GrantFiled: October 9, 1984Date of Patent: June 3, 1986Assignee: Ercon, Inc.Inventor: John E. Ehrreich -
Patent number: 4435214Abstract: Improved compositions of the type using metal flake in resin binders. The distribution of the flakes can be much enhanced using relatively small quantities of an ultra-thin, non-planar metal flake. Enhanced electroconductivity is a particular advantage of the invention.Type: GrantFiled: June 6, 1983Date of Patent: March 6, 1984Assignee: Ercon, Inc.Inventor: John E. Ehrreich
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Patent number: 4407674Abstract: Novel electrically-conductive compositions comprising an organic resin matrix and flakes of a novel conductive silver powder which is characterized by extreme thinness. The novel silver powder, and a novel process for preparing metal powders, are also described.Type: GrantFiled: October 2, 1981Date of Patent: October 4, 1983Assignee: Ercon, Inc.Inventor: John E. Ehrreich
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Patent number: 4319920Abstract: Novel electrically-conductive compositions comprising an organic resin matrix and flakes of a novel conductive silver powder which is characterized by extreme thinness. The novel silver powder, and a novel process for preparing metal powders, are also described.Type: GrantFiled: March 3, 1980Date of Patent: March 16, 1982Assignee: Ercon, Inc.Inventor: John E. Ehrreich