Patents Assigned to Ercon, Inc.
  • Patent number: 5843342
    Abstract: A composition comprising conductive particles and polymeric material selected from the group of polymers, pre-polymers and mixtures thereof wherein at least about 5 percent by weight of the particles included in the composition have been subjected to treatment such that the particles have chloride at least on their surface prior to inclusion in the composition.
    Type: Grant
    Filed: March 6, 1995
    Date of Patent: December 1, 1998
    Assignee: Ercon, Inc.
    Inventor: John Ehrreich
  • Patent number: 5305644
    Abstract: A force sensor component comprising a dimensionally stable body of electrically conductive material, the body having a selected outer surface formed into a predetermined topography; the body including an electrically conductive material in an amount sufficient to render the body electrically conductive at least throughout the selected outer surface of the body; the predetermined topography of the outer surface of the body comprising a plurality of interconnecting ridges across the outer surface of the body.
    Type: Grant
    Filed: September 2, 1992
    Date of Patent: April 26, 1994
    Assignee: Ercon, Inc.
    Inventor: John Ehrreich
  • Patent number: 5207950
    Abstract: A composition comprising chlorided and non-chlorided conductive particles and polymeric material selected from the group of polymers, pre-polymers and mixtures thereof wherein at least about 5 percent by weight of the particles included in the composition have been subjected to treatment such that the particles have chloride at least on their surface prior to inclusion in the composition.
    Type: Grant
    Filed: March 16, 1989
    Date of Patent: May 4, 1993
    Assignee: Ercon, Inc.
    Inventor: John Ehrreich
  • Patent number: 5194205
    Abstract: A force sensor component is formed including a dimensionally stable body of electrically conductive material, the body having a selected outer surface formed into a predetermined topography; the body including an electrically conductive material in an amount sufficient to render the body electrically conductive at least throughout the selected outer surface of the body; the predetermined topography of the outer surface of the body including a plurality of interconnecting ridges across the outer surface of the body.
    Type: Grant
    Filed: October 16, 1990
    Date of Patent: March 16, 1993
    Assignee: Ercon, Inc.
    Inventor: John Ehrreich
  • Patent number: 4836955
    Abstract: An improved silver-coated copper-based powder which is characterized by extraordinary stability, in terms of electroconductivity, when the powder is utilized with organic resin to form electroconductive compositons. The powder is made by subjecting it to an intensive heat treatment after the silver is coated thereon.
    Type: Grant
    Filed: November 3, 1987
    Date of Patent: June 6, 1989
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4786437
    Abstract: Unfavorable interaction is prevented between (a) electroconductive particle fillers and (b) organic resin binders of the type which are normally instable with respect to viscosity when aged in contact with said fillers. Moreover, electroconductivity degradation is also avoided. In a preferred mode of the invention, the particle surface is treated with a coating of an interfacial pacifying agent such as a tetravalent tin compound which both enhances the electroconductive performance of the particles and also is sufficiently compatible with the resin binder to migrate into the binder sufficiently to avoid undue gelling of the binder by particle-borne contamination or residues of such contamination.
    Type: Grant
    Filed: May 13, 1987
    Date of Patent: November 22, 1988
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4716081
    Abstract: An improved silver-coated copper-based powder which is characterized by extraordinary stability, in terms of electroconductivity, when the powder is utilized with organic resin to form electroconductive compositions. The powder is made by subjecting it to an intensive heat treatment after the silver is coated thereon.
    Type: Grant
    Filed: July 19, 1985
    Date of Patent: December 29, 1987
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4683082
    Abstract: Unfavorable interaction is prevented between (a) electroconductive particle fillers and (b) organic resin binders of the type which are normally instable with respect to viscosity when aged in contact with said fillers. Moreover, electroconductivity degradation is also avoided. In a preferred mode of the invention, the particle surface is treated with a coating of an interfacial pacifying agent such as a tetravalent tin compound which both enhances the electroconductive performance of the particles and also is sufficiently compatible with the resin binder to migrate into the binder sufficiently to avoid undue gelling of the binder by particle-borne contamination or residues of such contamination.
    Type: Grant
    Filed: March 27, 1985
    Date of Patent: July 28, 1987
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4592961
    Abstract: A coating composition having surprisingly superior physical properties, particularly when highly-filled with small particles and bonded to a flexible film of a polymeric substrate. The composition consists essentially of (1) a homogeneous binder formed of relatively hard, high-tensile, aromatic polyester compounded with a vinylidene chloride copolymer such that the copolymer serves as means to increase the elongation, toughness and heat resistance of the binder and (2) the filler. The process of forming such a binder comprises formation of a homogeneous polymeric solution wherein each of the polymers is intimately distributed within the same solvent phase.
    Type: Grant
    Filed: October 9, 1984
    Date of Patent: June 3, 1986
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4435214
    Abstract: Improved compositions of the type using metal flake in resin binders. The distribution of the flakes can be much enhanced using relatively small quantities of an ultra-thin, non-planar metal flake. Enhanced electroconductivity is a particular advantage of the invention.
    Type: Grant
    Filed: June 6, 1983
    Date of Patent: March 6, 1984
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4407674
    Abstract: Novel electrically-conductive compositions comprising an organic resin matrix and flakes of a novel conductive silver powder which is characterized by extreme thinness. The novel silver powder, and a novel process for preparing metal powders, are also described.
    Type: Grant
    Filed: October 2, 1981
    Date of Patent: October 4, 1983
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich
  • Patent number: 4319920
    Abstract: Novel electrically-conductive compositions comprising an organic resin matrix and flakes of a novel conductive silver powder which is characterized by extreme thinness. The novel silver powder, and a novel process for preparing metal powders, are also described.
    Type: Grant
    Filed: March 3, 1980
    Date of Patent: March 16, 1982
    Assignee: Ercon, Inc.
    Inventor: John E. Ehrreich