Abstract: The present invention provides a device for conditioning semiconductor chips and a corresponding test method. The device comprises a chip temperature control means for receiving a semiconductor chip or a plurality of semiconductor chips and comprises a base body which can be flushed with a fluid for temperature control and which comprises a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip bonding pedestals which are inserted, in thermal contact with the base body, into the recesses which comprise a chip receiving region on the front face and a wiring means on the inside which is constructed for supplying electrical signals from and/or to the semiconductor chip inserted in the respective chip receiving region; and a motherboard attached to the rear face in such a way that the wiring means of the chip bonding pedestals is electrically connected to a wiring means of the motherboard.

Abstract: A method and apparatus for thermally processing mold wafers The method comprises: clamping a mold wafer at a first temperature on a first clamping device, the first temperature being below the hardening temperature of the plastic of the mold wafer; heating the mold wafer to a second temperature, which is higher than the first temperature and is above the hardening temperature; ending the clamping on the first clamping device and transporting the mold wafer heated to the second temperature to a second clamping device substantially contactlessly; clamping the heated mold wafer on the second clamping device; cooling the mold wafer down to a third temperature, which is lower than the second temperature and is below the hardening temperature; and ending the clamping on the second clamping device.

Abstract: The present invention relates to a method and a device for determining a deformation of a disc-shaped workpiece, in particular a mold wafer. The device comprises a rotatable, height and laterally adjustable mounting unit for mounting an inner region of the disc-shaped workpiece; a determination unit for determining eccentricity of a center axis of the disc-shaped workpiece from a center axis of the mounting unit and for generating a suitable adjustment signal for the mounting unit; a deposit unit for depositing the disc-shaped workpiece during a process of lateral adjustment of the mounting unit; and a fixed-height detector unit for measuring a deviation of a plurality of measuring points, respectively, in a non-mounted outer region of the disc-shaped workpiece from a predetermined height position corresponding to the deformation by rotating the mounting unit or the detector unit at a predetermined height position of the mounting unit.

Abstract: The present invention provides a device for conditioning semiconductor chips and a corresponding test method. The device comprises a chip temperature control means for receiving a semiconductor chip or a plurality of semiconductor chips and comprises a base body which can be flushed with a fluid for temperature control and which comprises a corresponding number of recesses which extend from a front face to a rear face of the base body; a corresponding number of chip bonding pedestals which are inserted, in thermal contact with the base body, into the recesses which comprise a chip receiving region on the front face and a wiring means on the inside which is constructed for supplying electrical signals from and/or to the semiconductor chip inserted in the respective chip receiving region; and a motherboard attached to the rear face in such a way that the wiring means of the chip bonding pedestals is electrically connected to a wiring means of the motherboard.

Abstract: The present invention relates to a method and a device for determining a deformation of a disc-shaped workpiece, in particular a mould wafer. The device comprises a rotatable, height and laterally adjustable mounting unit for mounting an inner region of the disc-shaped workpiece; a determination unit for determining eccentricity of a centre axis of the disc-shaped workpiece from a centre axis of the mounting unit and for generating a suitable adjustment signal for the mounting unit; a deposit unit for depositing the disc-shaped workpiece during a process of lateral adjustment of the mounting unit; and a fixed-height detector unit for measuring a deviation of a plurality of measuring points, respectively, in a non-mounted outer region of the disc-shaped workpiece from a predetermined height position corresponding to the deformation by rotating the mounting unit or the detector unit at a predetermined height position of the mounting unit.

Abstract: The present invention provides a removal roller (12) for detaching a film (2) from a disc-shaped workpiece (3), in particular from a mould wafer (3), comprising a film handling portion (13) for non-positively taking up or for expelling a portion (14) of the film (2). The present invention also provides a device (1) for detaching a film (2) from a disc-shaped workpiece (3), in particular from a mould wafer (3), comprising: a mounting means (4) for non-positively mounting the disc-shaped workpiece (3); a removal roller (12) of this type; a displacement means (17) for moving the removal roller (12) horizontally and/or vertically to a surface (10) of the mounting means (4); and a rotation means (24) for rotating the removal roller (12) about a centre axis (25) of the removal roller (12). Furthermore, the present invention also provides a method for detaching a film (2) from a disc-shaped workpiece (3), in particular from a mould wafer (3), by means of a device (1) of this type.

Abstract: The present invention provides a method and apparatus for thermally processing plastic discs, in particular mould wafers.

Abstract: The present invention provides a method for conditioning semiconductor wafers and/or hybrids having the steps: preparation of a space (1) which is at least partially enclosed and has a wafer/hybrid holding device (10) which is located therein and has the purpose of holding a semiconductor wafer and/or hybrid; and conduction of a dry fluid through the wafer/hybrid holding device (10) in order to heat-treat the wafer/hybrid holding device (10); wherein at least a portion of the fluid leaving the wafer/hybrid holding device (10) is used to condition the atmosphere within the space (1). The invention also provides a corresponding device for conditioning semiconductor wafers and/or hybrids.