Abstract: An apparatus for the visual inspection in particular of concealed soldered joints is provided, in particular between an electric or electronic component disposed on the surface of a printed circuit board and the printed circuit board. The apparatus includes with an ocular unit, a lens head, an image transmission unit for transmitting the image received by the lens head to the ocular unit and an illuminating device for illuminating the soldered joints to be tested. The lens head includes a device for image deviation which extends up to the axially outer end of the lens head, and in which the illuminating device is disposed in the lens head in such a way that the exit angle of the light of the illuminating device out of the lens head is substantially equal to the deviation angle of the image deviation. The exit point of the light is disposed next to the device for image deviation in the area of the axially outer end of the lens head.