Abstract: In the electronic module (M) of extra-thin construction disclosed, it is the principal object to substantially reduce the tendency to fracture of the module's semiconductor chip embedded in the plastic casing of the module (M), notwithstanding the extremely small thickness of the casing. The chip is fitted on the chip pad of a system support formed by a thin metal strip, commonly known as a lead frame. The chip may partly overlap the external contacts of the module that lie on one of the flat sides of the module's plastic casing. Slits in the system support, which form the boundaries of the chip pad and are inevitable lines of weakness in the thin metal strip, are situated at an oblique angle relative to the edges of the square or rectangular chip, preferably at about 45.degree.; hence the slits extend also at an oblique angle to possible fracture lines within the monocrystalline structure of the material used in chip manufacture, because said fracture lines are parallel to the chip's edges.