Abstract: A mounting member of a semiconductor device according to the present invention includes a wiring substrate to input and/or output actuating signals to a semiconductor device, a power supplying conductor plate to supply actuating power to the semiconductor device, and the GND conductor plate. The wiring substrate, the power supplying conductor plate, and the GND conductor plate are laminated with insulation films between respective layers. Input/output signals as well as minute driving current is supplied from wiring substrate, and the large main driving current is supplied through the power supplying conductor plate as well as the GND conductor plate.

Abstract: An IC socket comprises a plurality of conductive connecting sections each having a holding section for holding one of a plurality of lead terminals of an IC; and a plurality of conductive coil springs, which are protruded from the IC socket and respectively fixed to the conductive connecting sections, the conductive springs being closer to a circuit board than the conductive connecting sections.

Abstract: A fuel cell current distribution measuring apparatus measures electromotive force distribution on an electrode surface of a fuel cell which includes: an electrolyte; and a pair of a fuel electrode and an air electrode between which the electrolyte is provided. The fuel cell current distribution measuring apparatus includes: a plurality of probe pins which are touched by a non-compartment area on an external surface of a fuel-electrode-side separator being one of separators of the pair of the fuel electrode and the air electrode; and a current measuring section for measuring a current in each of the probe pins. Therefore, it is possible to provide a fuel cell current distribution measuring apparatus and a fuel cell current distribution measuring method, each of which allows for exact reproduction of a partial electromotive force in an electromotive force obtained from the whole of electrodes of the fuel cell.

Abstract: A cooling apparatus configured such that a cooling body provided with heat-dissipating plates is pressed against a device to which a socket of a burn-in board is attached, and air is provided by a blower such that the air passes between the heat-dissipating plates, and compressed air provided from a compressed air supply system is discharged by a nozzle so that it directly hits a portion of the cooling upper surface of the cooling body. By means of the cooling effects from these two types of air, a device generating a large amount of heat can be cooled with good temperature accuracy.

Abstract: A semiconductor testing device of the invention has a measuring substrate that is provided with holes therethrough for exposing a pad of each of the dies of a semiconductor wafer mounted on the measuring substrate, the semiconductor wafer being supported by a wafer holder on one side of the measuring substrate, and the other side of the measuring substrate being provided with a wiring pattern for transmitting an evaluation test signal to the semiconductor wafer supported on the measuring substrate. The measuring substrate, with the pad of each of the dies being wire bonded with a pad of the wiring pattern through the holes, are set for an evaluation test so that a mount part of the semiconductor is placed inside a high temperature chamber, and that a terminal part for applying the evaluation test signal is placed outside of the high temperature chamber. As a result, there is provided a semiconductor testing device, inexpensively, that can suitably evaluate a semiconductor under a temperature of about 400° C.

Abstract: Input and output of small-current signals between a mother board and semiconductor devices subjected to a burn-in test are made via a device driving unit. Large-current main power is supplied via the device driving unit through bus bars without passing through the mother board. In this way, the risk of burn-out in a burn-in substrate and burn-in sockets, and damages caused by a burn-out can be reduced even when it occurs.

Abstract: The present invention realizes (i) a gas flow measuring device which can measure a gas flow of a low-boiling gas in a mixed gas including two types of gasses having different boiling points, and (ii) a method of measuring a gas flow easily but highly precisely, using the gas flow measuring device. The gas flow measuring device includes a condensing tank for condensing a mixed gas in which two types of gasses having different boiling points are mixed with each other, and a flow meter for measuring the flow of the mixed gas. After condensing the mixed gas in the condensing tank so as to cause the gas flow of the high-boiling gas to be known, the flow is measured using the flow meter so that the gas flow of the low-boiling gas is worked out.

Abstract: A disc-type unit 10 adjusts temperature of a control face 14 by means of a heater 12 and coolant, with a hollow plate 11 to which the heater 12 is secured, a cavity 13 formed in the hollow plate 11 and a piping 20 for supplying the coolant to the cavity 13, the piping 20 opening in the cavity 13, and the coolant being jetted to a portion to which the heater 12 is secured or a portion in proximity thereto and which shows high temperature rise when energizing the heater 12.

Abstract: The pipe heater manufacturing process comprises a vacuum making process A for introducing a stainless steel pipe into a furnace and evacuating the inside of the furnace, for example, to a pressure of 0.5 Torr, a pipe end sealing process B for brazing and sealing plugs 3 to both ends of the pipe under vacuum and brazing, a process C for forming a lower insulating layer by repeating several times the steps of screen printing an insulating glass material and baking it in a state in which the two ends of the pipe are sealed, and similar formation process D of a heat generating layer and formation process E of an upper insulating layer. With this method, baking in an oxygen-free state inside the pipe makes it possible to obtain the oxidation-free clean state without high-temperature corrosion on the inside of the pipe having the fluid to be heated flowing therein and to manufacture a pipe heater in which a heating response was improved by forming thin heating layer and insulating layer.

Abstract: The burn-in apparatus includes a water supply system and a sprayer and has a structure such that water is converted into mist and sprayed onto the upper surface of a device attached to a socket of a burn-in board. The amount of heat generated by the device that generates high heat is removed by the amount of heat that includes a large latent heat from when the mist falls on the upper surface and is evaporated. Burn-in of the device is conducted while it is being cooled to the target temperature.

Abstract: A cooling apparatus configured such that a cooling body provided with heat-dissipating plates is pressed against a device to which a socket of a burn-in board is attached, and air is provided by a blower such that the air passes between the heat-dissipating plates, and compressed air provided from a compressed air supply system is discharged by a nozzle so that it directly hits a portion of the cooling upper surface of the cooling body. By means of the cooling effects from these two types of air, a device generating a large amount of heat can be cooled with good temperature accuracy.

Abstract: The cooling apparatus comprises an air supply system, a water supply system, and a sprayer, and has a structure such that water and compressed air are mixed and the air is sprayed together with the water converted into mist onto the upper surface of a device attached to a socket of a burn-in board. The amount of heat generated by the device that generates a large amount of heat is removed via the heat including a large latent heat when the mist that falls on the upper surface is evaporated, and the burn-in is conducted, while the device is being cooled to the target temperature.

Abstract: The short circuit metal fitting 12 is made to realize such an arrangement that the distance from the contact position of the connection terminals 3 of the electronic circuit board 1 and the short circuit metal fitting 12 in the opening section of the short circuit metal fitting 12 to the contact position of the electronic circuit board 1 and the connector pin 11 of the card edge connector 10 is shorter than the length of the connection terminals 3 in a connection direction and longer than the distance from the contact position of the connector pin 11 and the connection terminals 3 to the back ends of the connection terminals 3 when the electronic circuit board 1 is completely inserted in the card edge connector 10. On this account, it is possible to provide a card edge connector connection jig and a card edge connector connection mechanism capable of preventing breakage of an electronic device etc.

Abstract: A cooling apparatus (1) has a compressor (2), a condenser (3), an expansion valve (5), an evaporator (6) and an electric valve (10), all connected to each other in this order by a piping line to form a refrigeration circuit. The apparatus further has a heating section (11) and a bypass (12), and a thermosensitive tube (13) of the expansion valve is disposed between the heating section (11) and the electric valve (10) so that temperature of a refrigerant having left this section is detected before entering this valve (10). The refrigerant remains as a gas-liquid mixture until it leaves the evaporator (6) such that temperature of the refrigerant is uniform within the evaporator and equal to the saturation vapor temperature of this refrigerant, and therefore fluctuation in the refrigerant temperature is diminished.

Abstract: The pipe heater manufacturing process comprises a vacuum making process A for introducing a stainless steel pipe into a furnace and evacuating the inside of the furnace, for example, to a pressure of 0.5 Torr, a pipe end sealing process B for brazing and sealing plugs 3 to both ends of the pipe under vacuum and brazing, a process C for forming a lower insulating layer by repeating several times the steps of screen printing and insulating glass material and baking it in a state in which the two ends of the pipe are sealed, and similar formation process D of a heat generating layer and formation process E of an upper insulating layer. With this method, baking in an oxygen-free state inside the pipe makes it possible to obtain the oxidation-free clean state without high-temperature corrosion on the inside of the pipe having the fluid to be heated flowing therein and to manufacture a pipe heater in which a heating response was improved by forming thin heating layer and insulating layer.

Abstract: A battery state diagnosing device applies load to a battery from a load applying section, measures input and output characteristics of the battery, and diagnoses a state of the battery by plugging a result of measurement into a mathematical expression obtained by a system identification method. In the battery state diagnosing device, a current load is used as the load applying section. With this arrangement, the battery state diagnosing device is capable of suitably determining, for example, life and state-of-charge of the battery.

Abstract: In order to carry out the electric property evaluation of internal wiring of an IC, the IC is attached to an IC socket, and terminals of the IC socket are connected with the external wiring via leads and coaxial connectors. The IC is directly in touch with a heating plate, for making the IC have a high temperature. The IC socket is provided with protrusions thereon, for forming a gap between the IC socket and the IC. On this account, it is possible to acquire an IC socket module in which the temperature of the IC is kept consistent when the evaluation of the internal wiring and wiring members of the IC is carried out at a high temperature.

Abstract: An apparatus for burn-in of semiconductor devices has board assemblies including a burn-in board and a driver board. The burn-in board has sockets on a first surface for accepting the semiconductor devices and first terminals extending from the sockets to protrude from a first back side of the burn-in board. The driver board has a second surface carrying an electronic circuit to drive the semiconductor devices and a second back side with second terminals for connecting the electronic circuit to the first terminals. The driver board has an edge connector with terminals for applying power to the electronic circuit. The burn-in board and the driver board are disposed with the first and second back sides facing such that corresponding ones of the first and second terminal can be brought into and out of contact with each other. The board assemblies are supported in a housing wherein the board assemblies form partitions isolating first and second environmental spaces for burn-in and cooling operation.

Abstract: A temperature control method for controlling a temperature in a chamber comprises the steps of: providing heating means which can select large and small heating powers for heating the chamber and refrigerating means for cooling the chamber; detecting a process temperature in the chamber; operating the heating means with a small heating power for attaining an intended set value when a detected temperature is equal to or higher than a lower tolerable deviation value, and operating the heating means with a large heating power when the detected temperature is lower than the lower tolerable deviation value; and operating the refrigerating means when the detected temperature is higher than an upper tolerable deviation value.

Abstract: A thermal shock chamber comprising a test area, a high-temperature air conditioning unit having a gas outlet and a gas inlet adjacent to the test area, an outside air supplying unit having an air outlet and an air inlet adjacent to the test area, a low-temperature air conditioning unit having a gas outlet and a gas inlet adjacent to the test area, a first damper assembly for opening the outlet and the inlet of one of the high-temperature air conditioning unit and the outside air supplying unit and closing the outlet and the inlet of the other unit at the same time, and a second damper assembly for opening the outlet and the inlet of one of the low-temperature air conditioning unit and the outside air supplying unit and closing the outlet and the inlet of the other unit at the same time.